Microsemi Power Products Group APTGF50H60T3G IGBT Module

Manufacturer Part Number: APTGF50H60T3GPbfree Code: YesPart Life Cycle Code: Not RecommendedIhs Manufacturer: MICROSEMI CORPPart Package Code: MODULEPackage Description: FLANGE MOUNT, R-XUFM-X25Pin Count: 25ECCN Code: EAR99Manufacturer: Microsemi CorporationRisk Rank: 5.13Case Connection: ISOLATEDCollector Current-Max (IC): 65 ACollector-Emitter Voltage-Max: 600 VConfiguration: COMPLEXGate-Emitter Voltage-Max: 20 VJESD-30 Code: R-XUFM-X25JESD-609 Code: e1Moisture Sensitivity Level: 1Number of Elements: 4Number of Terminals: 25Operating Temperature-Max: 150 °CPackage Body Material: UNSPECIFIEDPackage Shape: RECTANGULARPackage Style: FLANGE MOUNTPeak Reflow Temperature (Cel): NOT SPECIFIEDPolarity/Channel Type: N-CHANNELPower Dissipation-Max (Abs): 250 WQualification Status: Not QualifiedSubcategory: Insulated Gate BIP TransistorsSurface Mount: NOTerminal Finish: TIN SILVER COPPERTerminal Form: UNSPECIFIEDTerminal Position: UPPERTime Insulated Gate Bipolar Transistor, 65A I(C), 600V V(BR)CES, N-Channel, ROHS COMPLIANT, SP3, MODULE-25