Sell infineon HYB18L256160BC-7.5 New Stock

HYB18L256160BC-7.5 Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 12 X 8 MM, 1 MM HEIGHT, PLASTIC, VFBGA-54; HYB18L256160BC-7.5
  • Part Number:    

    HYB18L256160BC-7.5

  • Category:    

    ICs

  • Manufacturer:    

    infineon

  • Packaging:    

    BGA

  • Data Code:    

    04+

  • Qty Available:    

    1628

Email us: sales@shunlongwei.com
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HYB18L256160BC-7.5
infineon HYB18L256160BC-7.5 New Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 12 X 8 MM, 1 MM HEIGHT, PLASTIC, VFBGA-54, HYB18L256160BC-7.5 pictures, HYB18L256160BC-7.5 price, #HYB18L256160BC-7.5 supplier
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Email: sales@shunlongwei.com

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Manufacturer Part Number: HYB18L256160BC-7.5
Rohs Code: No
Part Life Cycle Code: Transferred
Ihs Manufacturer: INFINEON TECHNOLOGIES AG
Part Package Code: BGA
Package Description: 12 X 8 MM, 1 MM HEIGHT, PLASTIC, VFBGA-54
Pin Count: 54
ECCN Code: EAR99
HTS Code: 8542.32.00.24
Manufacturer: Infineon Technologies AG
Risk Rank: 5.44
Access Mode: FOUR BANK PAGE BURST
Access Time-Max: 5.4 ns
Additional Feature: AUTO/SELF REFRESH
Clock Frequency-Max (fCLK): 133 MHz
I/O Type: COMMON
Interleaved Burst Length: 1,2,4,8
JESD-30 Code: R-PBGA-B54
JESD-609 Code: e0
Length: 12 mm
Memory Density: 268435456 bit
Memory IC Type: SYNCHRONOUS DRAM
Memory Width: 16
Number of Functions: 1
Number of Ports: 1
Number of Terminals: 54
Number of Words: 16777216 words
Number of Words Code: 16000000
Operating Mode: SYNCHRONOUS
Operating Temperature-Max: 70 °C
Organization: 16MX16
Output Characteristics: 3-STATE
Package Body Material: PLASTIC/EPOXY
Package Code: FBGA
Package Equivalence Code: BGA54,9X9,32
Package Shape: RECTANGULAR
Package Style: GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel): NOT SPECIFIED
Power Supplies: 1.8 V
Qualification Status: Not Qualified
Refresh Cycles: 8192
Sequential Burst Length: 1,2,4,8,FP
Standby Current-Max: 0.00035 A
Subcategory: DRAMs
Supply Current-Max: 0.09 mA
Supply Voltage-Max (Vsup): 1.95 V
Supply Voltage-Min (Vsup): 1.65 V
Supply Voltage-Nom (Vsup): 1.8 V
Surface Mount: YES
Technology: CMOS
Temperature Grade: COMMERCIAL
Terminal Finish: Tin/Lead (Sn/Pb)
Terminal Form: BALL
Terminal Pitch: 0.8 mm
Terminal Position: BOTTOM
Time
Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 12 X 8 MM, 1 MM HEIGHT, PLASTIC, VFBGA-54

Shunlongwei Inspected Every HYB18L256160BC-7.5 Before Ship, All HYB18L256160BC-7.5 with 6 months warranty.

Shunlongwei Co. Ltd.

Contact: Alice Peng

Tel:+86-755-82732562

E-mail: sales@shunlongwei.com

ADD:Rom512,Bldg#505, Shangbu Industrial Area, Huaqiang North Rd., SZ,518000,China.