Sell ST NAND512R3A2SZA6E New Stock

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Manufacturer Part Number: NAND512R3A2SZA6E
Pbfree Code: Yes
Part Life Cycle Code: Obsolete
Ihs Manufacturer: MICRON TECHNOLOGY INC
Part Package Code: BGA
Package Description: VFBGA-63
Pin Count: 63
ECCN Code: 3A991.B.1.A
HTS Code: 8542.32.00.51
Manufacturer: Micron Technology Inc
Risk Rank: 8.6
JESD-30 Code: R-PBGA-B63
JESD-609 Code: e1
Length: 11 mm
Memory Density: 536870912 bit
Memory IC Type: FLASH
Memory Width: 8
Number of Functions: 1
Number of Terminals: 63
Number of Words: 67108864 words
Number of Words Code: 64000000
Operating Mode: ASYNCHRONOUS
Operating Temperature-Max: 85 °C
Operating Temperature-Min: -40 °C
Organization: 64MX8
Package Body Material: PLASTIC/EPOXY
Package Code: TFBGA
Package Shape: RECTANGULAR
Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial: PARALLEL
Peak Reflow Temperature (Cel): 260
Programming Voltage: 1.8 V
Seated Height-Max: 1.05 mm
Supply Voltage-Max (Vsup): 1.95 V
Supply Voltage-Min (Vsup): 1.7 V
Supply Voltage-Nom (Vsup): 1.8 V
Surface Mount: YES
Technology: CMOS
Temperature Grade: INDUSTRIAL
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form: BALL
Terminal Pitch: 0.8 mm
Terminal Position: BOTTOM
Time
Flash, 64MX8, PBGA63, VFBGA-63