ST NANDA9R3N0BZPA5 New Memory Circuit, Flash+SDRAM, PBGA152, NANDA9R3N0BZPA5 pictures, NANDA9R3N0BZPA5 price, NANDA9R3N0BZPA5 supplier
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Manufacturer Part Number: NANDA9R3N0BZPA5E
Rohs Code: Yes
Part Life Cycle Code: Active
Ihs Manufacturer: MICRON TECHNOLOGY INC
Package Description: FBGA, BGA152,21X21,25
Manufacturer: Micron Technology Inc
Risk Rank: 5.68
JESD-30 Code: S-PBGA-B152
Memory IC Type: MEMORY CIRCUIT
Mixed Memory Type: FLASH+SDRAM
Number of Terminals: 152
Operating Temperature-Max: 85 °C
Operating Temperature-Min: -30 °C
Package Body Material: PLASTIC/EPOXY
Package Code: FBGA
Package Equivalence Code: BGA152,21X21,25
Package Shape: SQUARE
Package Style: GRID ARRAY, FINE PITCH
Power Supplies: 1.8 V
Qualification Status: Not Qualified
Subcategory: Other Memory ICs
Supply Voltage-Nom (Vsup): 1.8 V
Surface Mount: YES
Temperature Grade: OTHER
Terminal Form: BALL
Terminal Pitch: 0.635 mm
Terminal Position: BOTTOM
Memory Circuit, Flash+SDRAM, PBGA152
Shunlongwei Inspected every NANDA9R3N0BZPA5 before Ship, All NANDA9R3N0BZPA5 with 6 months warranty.
