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TI SN74LVC1G97YZPR New Integrated Circuit

SN74LVC1G97YZPR
# TI , #SN74LVC1G97YZPR, #Integrated_Circuit, #Integrated, SN74LVC1G97YZPR Configurable Multiple-Function Gate 6-DSBGA -40 to 85; SN74LVC1G97YZPR
  • Category: Integrated Circuit
  • Manufacturer: TI
  • Package Type: BGA
  • Date Code: 12+
  • Available Qty: 9102

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SN74LVC1G97YZPR Description

Sell SN74LVC1G97YZPR, # TI #SN74LVC1G97YZPR New Stock, SN74LVC1G97YZPR Configurable Multiple-Function Gate 6-DSBGA -40 to 85; SN74LVC1G97YZPR, #Integrated_Circuit, #Integrated, #SN74LVC1G97YZPR
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Manufacturer Part Number: SN74LVC1G97YZPR
Brand Name: Texas Instruments
Rohs Code: Yes
Part Life Cycle Code: Active
Ihs Manufacturer: TEXAS INSTRUMENTS INC
Part Package Code: BGA
Package Description: VFBGA, BGA6,2X3,20
Pin Count: 6
ECCN Code: EAR99
HTS Code: 8542.39.00.01
Manufacturer: Texas Instruments
Risk Rank: 0.87
Family: LVC/LCX/Z
JESD-30 Code: R-XBGA-B6
JESD-609 Code: e1
Length: 1.4 mm
Load Capacitance (CL): 50 pF
Logic IC Type: LOGIC CIRCUIT
Max I(ol): 0.024 A
Moisture Sensitivity Level: 1
Number of Functions: 1
Number of Terminals: 6
Operating Temperature-Max: 85 °C
Operating Temperature-Min: -40 °C
Output Characteristics: 3-STATE
Package Body Material: UNSPECIFIED
Package Code: VFBGA
Package Equivalence Code: BGA6,2X3,20
Package Shape: RECTANGULAR
Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Packing Method: TAPE AND REEL
Peak Reflow Temperature (Cel): 260
Power Supplies: 3.3 V
Prop. Delay
Configurable Multiple-Function Gate 6-DSBGA -40 to 85

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