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STMicroelectronics Announces MasterGaN Reference Design and Demonstrates 250W Heatsinkless Resonant Converter

Posted on: 04/27/2022

China, May 18, 2021 – STMicroelectronics has released the first reference design for MasterGaN, showing how the new highly integrated device can improve power density, energy efficiency, simplify product design and reduce time-to-market.

The EVLMG1-250WLLC reference design is a 250W resonant converter with a board size of 100mm x 60mm and a maximum component height of 35mm. The power chip is a MasterGaN1 that integrates an STDRIVE half-bridge gate driver and two 650V normally-off GaN transistors. It has matching timing parameters, an on-resistance (Rds(on)) of 150mΩ, a maximum current rating of 10A, and a logic input compatible with 3.3V to 15V signals.

MasterGaN1 is suitable for high-efficiency soft-switching topologies in AC/DC power supplies, DC/DC converters, and DC/AC inverter applications up to 400W, including resonant converters, active-clamp flyback or forward converters, and no Bridge Totem Pole PFC (Power Factor Correction).

Taking advantage of the high energy efficiency of GaN power transistors, the reference design uses a heatsink-less design on the primary side. In addition, GaN transistors have excellent switching performance and operate at higher frequencies than common silicon-based MOSFET solutions, allowing the use of smaller electromagnetic components and capacitors, enabling higher power density and lower bill-of-materials costs.

The EVLMG1-250WLLC is a power supply reference design with a nominal 400V input, providing a 24V/10A output port with a maximum energy efficiency of over 94%. Thanks to the integrated safety features within MasterGaN, the converter output is protected against short-circuit and overcurrent. It also has undervoltage protection and input voltage monitoring functions. The voltage detection function can realize power-on sequencing in multiple DC/DC converters to prevent low-voltage starting of the motor.

ST’s MasterGaN family of products consists of pin-compatible integrated half-bridge products, including symmetrical and asymmetrical configurations, housed in a thin 9mm x 9mm GQFN package. The rated voltage of the internal circuit of the package is up to 650V, and the creepage distance between the high and low voltage pads exceeds 2mm. MasterGaN modules are suitable for various power ratings, and engineers can expand and upgrade the system design with minor hardware modifications.

EVLMG1-250WLLC is now available from st.com and dealers.

The Links:   PM20CSJ060 243NQ045