Samsung Advanced Package Technology(AVP): Moving Semiconductors Beyond Moore’s Law

First introduced in 1965 by Gordon Moore, Moore’s Law states that the number of transistors that we can place on an integrated circuit doubles every two years. For over five decades, Moore’s Law has served as the fundamental principle of the semiconductor industry.

But in the 21st-century, Moore’s Law is slowing down, requiring semiconductor makers to adopt sophisticated integrated solutions to keep pace with the innovations of new markets like artificial intelligence, high-performance computing, automotive, and more.

To help transition Beyond Moore’s Law, Samsung Semiconductor launched its Advanced Package (AVP) business in late 2022. Using our industry-leading expertise in memory, logic (System LSI) and foundry, the AVP Business Team provides advanced 2.5D and 3D packaging solutions for high-performance, low-power chips that deliver results greater than the sum of their parts.

Samsung AVP’s not-so-secret weapon in moving semiconductors into the Beyond Moore era is heterogeneous integration, an advanced package technology that connects multiple chips together horizontally and vertically. Using Advanced Heterogeneous Integration, Samsung AVP can unify memory and logic chips into packages that are faster, more efficient, and more adaptable than traditional monolithically designed chipsets, while also being cheaper to produce.

Closely aligned with our Multi-Die Integration Alliance partners and embracing formative new next-generation computing standards like Universal Chiplet Interconnect Express (UCIe) to balance power-efficient, high-bandwidth communications with cost efficiency, Samsung AVP is committed to helping our customers sidestep Moore’s Law and bring their products from imagination into reality.
Find out more about Samsung Semiconductor’s Advanced Package business.