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Infineon extends 1200V 62 mm IGBT7 portfolio with new maximum current rating

Posted on: 08/22/2023

With the 1,200 V TRENCHSTOP™ IGBT7 chips, Infineon Technologies delivers a 62mm half-bridge and common emitter module portfolio. The new 800A maximum current class for the package family broadens the variety of options in the tried-and-true 62 mm housing. The addition to the portfolio’s existing classes gives system designers a lot of creative freedom when creating solutions for increased current power requirements that also offer greater power density and electrical performance. It is made to specifically fulfill the demands of industrial drive applications, uninterruptible power supply (UPS), and solar central inverters. In addition, new industrial applications such as EV charging and energy storage systems (ESS) can be covered.

The 62 mm module family with the 1,200 V TRENCHSTOP IGBT7 chip has much reduced static losses than the modules with the IGBT4 chipset because to revolutionary micro-pattern trench technology. Applications experience a large loss reduction as a result, particularly industrial drives that frequently run at modest switching frequencies. The IGBT’s controllability and oscillation behavior have been improved. The new power modules also have a 175°C maximum overload junction temperature.

A robust, nickel-coated copper baseplate and screw main terminals guarantee the 62 mm module housing’s great mechanical robustness. Due to their central location and low inductive DC link connection, the main terminals are well suited for 3-level topologies and parallel circuits. Mechanical compatibility with the preceding module version is supported by constant standard package size and design within the module family. Additionally, Infineon’s tried-and-true pre-applied thermal interface material (TIM) is available for all modules.