2DI100Z-100 Fuji Electric 1000V 100A Power Transistor Module

2DI100Z-100 Power Transistor Module In-stock / Fuji Electric: 1000V 100A. High DC gain, isolated base. 90-day warranty, VFDs/Inverters. Get quote.

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Content last revised on March 21, 2026

2DI100Z-100 Fuji Electric 1000V 100A Power Transistor Module

The 2DI100Z-100 is a high-performance Power Transistor Module featuring a dual Darlington configuration designed for high-voltage switching applications. Engineered by Fuji Electric, this module integrates two isolated Darlington transistors with high-speed, high-gain characteristics into a single package, significantly reducing the complexity of base drive circuits. With a Collector-Emitter Voltage (VCEX) of 1000V and a continuous Collector Current (IC) of 100A, it provides a robust solution for industrial power conversion systems where thermal stability and high-current handling are critical.

Top Specs: 1000V | 100A | Isolated Mounting Base

Key Benefits: High DC current gain reduces driver requirements; simplifies multi-phase inverter designs.

One common technical query engineers have is: How does the high DC current gain of this Darlington module impact system efficiency? By utilizing a Darlington structure, the 2DI100Z-100 achieves a high hFE, which allows the base drive circuit to operate at much lower current levels compared to standard bipolar transistors, effectively minimizing power consumption in the control stage. For 400V industrial drives prioritizing high-gain stability, this 1000V module is the optimal choice.

Key Parameter Overview

Functional Grouping of Electrical and Thermal Specifications

The following table outlines the critical technical parameters of the 2DI100Z-100, as sourced from the official technical documentation. These values are essential for calculating safe operating margins and thermal management requirements in high-power environments.

Category Parameter Description Typical Value / Rating
Voltage Ratings Collector-Emitter Voltage (VCEX) 1000V
Voltage Ratings Emitter-Base Voltage (VEBO) 10V
Current Ratings Continuous Collector Current (IC) 100A
Current Ratings Pulse Collector Current (ICP) 200A
Switching Performance DC Current Gain (hFE) 100 (Min)
Switching Performance Collector-Emitter Saturation Voltage 2.5V (Max)
Thermal/Mechanical Junction Temperature (Tj) +150°C
Thermal/Mechanical Isolation Voltage (Visol) 2500V AC (1 min)

Download the 2DI100Z-100 datasheet for detailed specifications and performance curves.

Application Scenarios & Value

Achieving System-Level Reliability in Industrial Power Architectures

The 2DI100Z-100 is frequently utilized in legacy and specialized high-power systems that require the high gain and voltage-blocking capabilities of Darlington Transistor technology. Its 1000V rating provides a necessary buffer for 480V AC line-operated equipment, protecting against transient spikes and inductive kickback common in heavy machinery. For engineers managing higher current loads in similar topologies, the 6DI100A-060 offers a different phase configuration for 600V-class applications.

In the context of Variable Frequency Drive (VFD) maintenance, the 2DI100Z-100 facilitates easier integration due to its Isolated Mounting Base. This feature allows multiple modules to be mounted on a single common heatsink without additional insulating washers, optimizing Thermal Management and reducing the physical footprint of the inverter assembly. Understanding the nuances of these modules is critical; for more information, see our guide on IGBT vs MOSFET vs BJT selection.

Another high-fidelity engineering scenario involves DC Chopper circuits used in industrial cranes or elevators. The high I2t rating and robust SOA (Safe Operating Area) allow the 2DI100Z-100 to handle the heavy surge currents associated with motor starting and regenerative braking without premature degradation. This reliability is vital for maintaining uptime in mission-critical logistics hardware.

Technical Deep Dive

Design Considerations for High-Voltage Darlington Configurations

The internal architecture of the 2DI100Z-100 consists of two NPN Darlington pairs, each accompanied by a high-speed free-wheeling diode. This internal diode is specifically matched to the transistor's switching characteristics, ensuring that the recovery time does not cause excessive Switching Loss during inductive load switching. This integration is comparable to a "pre-packaged relay" in terms of ease of use, as it manages the commutation of current internally, protecting the silicon from reverse voltage transients.

From a Thermal Resistance perspective, the module utilizes a copper base plate that ensures efficient heat transfer from the junction to the ambient environment. In high-power designs, minimizing the Rth(j-c) is equivalent to widening a highway; it allows more energy (heat) to flow away from the critical components faster, preventing thermal runaway. To ensure these modules are operating correctly during field service, engineers should follow established procedures on how to test a power module with a multimeter.

The high 2500V AC isolation rating is particularly important for compliance with safety standards such as IEC 61800-5-1. It ensures that the high-power collector circuit remains electrically separated from the control logic and the chassis, preventing catastrophic failure modes where high voltage could migrate into the low-voltage PLC or microprocessor control stage.

Frequently Asked Questions

How does the high hFE of the 2DI100Z-100 impact the design of the base drive circuit?
The high DC Current Gain (hFE), typically exceeding 100, allows the module to be driven with a relatively small base current. This means designers can use smaller, lower-cost drive components and experience less power dissipation in the driver stage. However, care must be taken to ensure adequate turn-off speed by using a negative bias or a low-impedance path to discharge the base-emitter capacitance.

What are the primary advantages of the isolated base plate in the 2DI100Z-100?
The Isolated Mounting Base allows the 2DI100Z-100 to be mounted directly onto a grounded heatsink. This simplifies the mechanical assembly, improves thermal conductivity by removing the need for external isolation pads, and enhances overall system safety by ensuring the cooling structure remains at ground potential.

For more technical details or to check current availability, please contact our engineering support team or visit our product catalog for related power semiconductor solutions.

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