Advantech Introduces MIC-770 V3 Industrial Edge Solution with NVIDIA L4 GPU for Industrial AI Applications

Advantech, a global leader in Industrial IoT, is excited to announce its GPU edge computing solution with NVIDIA® L4 GPU NVQual validation – the MIC-770 V3 Modular IPC with MIC-75M20 expansion i-Module. This industrial edge solution is compatible with the NVIDIA L4 Tensor Core GPU, boasts an impressive 7,424 CUDA cores and 24GB GDDR6 GPU memory; and consumes only 72W of power. When paired with the efficiency of the NVIDIA L4 GPU, the high-performance highly scalable compact design of this IPC creates an excellent AIoT solution for diverse deep learning and edge inference applications in factory automation, autonomous vehicles, automated optical inspection (AOI), and AI prediction in medical equipment, as well as smart city video surveillance and transportation.

Key Features include:

High-Performance Compact Design with Flexible Expandability

Powered by the latest 12th Gen Intel® Core® i processor, MIC-770 V3 is designed as a high-performance open-source x86 platform capable of enabling the quick development of GPU-accelerated solutions. By Adopting MIC-75M20, a 2-slot expansion i-Module, this integrated solution is compatible with the NVIDIA L4 Tensor Core GPU with its small, energy-efficient, single-slot, low-profile 72W form factor. These features make it ideal for AI-based edge computing and inference. It delivers energy-efficient universal acceleration for AI inference, video, and graphics applications; and is ideal for global deployment in enterprise, cloud, and edge applications with limited space.

Innovative Modular Design Enables Diverse Industry Applications

MIC-770 V3 features a modular design that delivers enhanced functionality and flexibility for PCIe expansion via Advantech i-Modules and Flex I/O in the front panel. Adding a PCIE-1674 vision frame grabber card enables the connection of 4 x cameras when used in autonomous vehicles. Likewise, adding 4 x GbE Flex I/O (98910770301) enables this controller to connect to LiDAR systems, thus enabling it to detect distances and shapes in its environment then pass on data to the NVIDIA L4 GPU for the rendering of 3D models based on graphics analysis.

Remote Management Realizes Seamless Edge AI Computing

MIC-770 V3 supports the iBMC 1.2 Edge Intelligent Solution to simplify remote systems and edge device management. Indeed, by leveraging iBMC hardware-based out-of-band (OOB) management technology, this Advantech WISE-DeviceOn solution can serve as both an in-band and out-of-band management system, enabling the comprehensive access, configuration, monitoring, and analysis & control of IoT network assets on a single centralized platform. In addition, Enterprise IT and OT managers can remotely control the power (via reset/forced shutdown/power on/power off), conduct remote system recovery via Acronis or hardware, trigger SSD recovery, and check operating statuses — even during software or OS failures. These features address 90% of system failures without requiring users to dispatch maintenance crews to the site, thus drastically reducing system downtime and operational costs.

Advanced Thermal Design for Stable and Reliable GPU Computing

The MIC-770 V3 leverages an NVIDIA L4 GPU and supports wide operating temperatures (0 ~ 40 °C) when used in harsh environments. It features a dedicated server-grade air duct design that improves the thermal management of the GPU.  This cooling solution maintains a GPU IC operating temperature below 70.5 °C in environmental conditions up to 40 °C to deliver superior performance and clock frequency residency. In sum, MIC-770 V3 leverages its advanced thermal design to deliver 30.3 TFLOPs computing power with 72 watts of power consumption.

The Advantech MIC-770 V3 compact industrial computer (with MIC-75M20 i-Module) is available for order now. For more information regarding this or other products, please contact your local sales support team, visit Advantech, at www.advantech.com/en-eu or visit our website.

About Advantech

Advantech’s corporate vision is to enable an intelligent planet. The company is a global leader in the fields of IoT intelligent systems and embedded platforms. To embrace the trends of IoT, big data, and artificial intelligence, Advantech promotes IoT hardware and software solutions with the Edge Intelligence WISE-PaaS core to assist business partners and clients in connecting their industrial chains. Advantech is also working with business partners to co-create business ecosystems that accelerate the goal of industrial intelligence. www.advantech.com

About CLPA

The CC-Link Partner Association (CLPA) is an open network organization established in 2000 and celebrates its 20th anniversary. The mission of CLPA is to increase the adoption of the CC-Link family of open automation network technologies worldwide. CC-Link is the open fieldbus network standard which originated in Japan, after being developed by industry leaders such as Mitsubishi Electric Corporation. The year 2007 saw the release of CC-Link IE as the first 1Gbps Ethernet-based open industrial network. Subsequently, the year 2018 saw the release of CC-Link IE TSN, a network which significantly improves the performance and functions of the current CC-Link IE. The main activities of the CLPA include the development of the CC-Link family of technical specifications, conducting conformance tests, development support and user support for device selection and application. In addition, the CLPA conducts promotional activities on a global basis in order to achieve wider adoption of the CC-Link family. The CLPA, which began with 134 corporate members, has expanded yearly and, as of the end of January 2023, boasts over 4,000 members, of which 80% are overseas corporations.

About CC-Link IE TSN

CC-Link IE TSN combines the gigabit bandwidth of CC-Link IE with TSN to meet future automation market demands, such as Industry 4.0. This provides flexible integration of Operational Technology (OT) and IT while further strengthening performance and functionality. A comprehensive portfolio of device development options also ensures that any vendor can easily add this technology to their product line-up. The aim is to improve efficiency and reduce time to market for Smart Factories utilizing the IIoT and the products they manufacture. As of January 2023, five years after the announcement of the CC-Link IE TSN specifications, more than 100 models of partner products have been released or are under development.

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