Fingernail size!Intel unveils 3D packaged ‘Lakefield’ processors

Today, Intel revealed in an official press release what the 3D packaged “Lakefield” processor will look like, with the chip magnified with a magnifying glass and only the size of a fingernail.

Intel said Foveros advanced packaging technology allows Intel to package memory and I/O Modules in a single chip, which can greatly reduce the size of the motherboard. Intel’s first product with this design was the “Lakefield,” a Core processor with Intel Hybrid Technology.

According to Intel, Lakefield represents an entirely new type of chip that offers the best balance of performance and efficiency. The package size of Lakefield is only 12 x 12 x 1 mm. Its hybrid CPU architecture combines the power-saving “Tremont” core with the performance-expandable 10nm “Sunny Cove” core, which can achieve the effect of moving like a rabbit and being a virgin.

Both Microsoft’s Surface Neo and Lenovo’s ThinkPad X1 will feature the processor, the latter of which will be released in the middle of this year.

Not long ago, the well-known whistleblower APISAK found a Lakefield processor in the database, the model is i5-L16G7, 5 cores and 5 threads.

According to the information in the database, this Samsung device is equipped with an i5-L16G7, which also comes with 8GB of memory, and a 1080p Display.

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