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Microsemi Analog Mixed Signal Group [MIL] SG2803J-DESC New IGBT Module

#Microsemi Analog Mixed Signal Group [MIL], #SG2803J_DESC, #IGBT_Module, #IGBT, SG2803J-DESC Small Signal Bipolar Transistor, 0.5A I(C), 50V V(BR)CEO, 8-Element, NPN, Silicon, HERMETIC SEALED, CERAMIC

· Categories: IGBT Module
· Manufacturer: Microsemi Analog Mixed Signal Group [MIL]
· Price: US$
· Date Code: Lead free / RoHS Compliant
. Available Qty: 1224
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SG2803J-DESC Specification

Sell SG2803J-DESC, #Microsemi Analog Mixed Signal Group [MIL] #SG2803J-DESC New Stock, SG2803J-DESC Small Signal Bipolar Transistor, 0.5A I(C), 50V V(BR)CEO, 8-Element, NPN, Silicon, HERMETIC SEALED, CERAMIC, DIP-18; SG2803J-DESC, #IGBT_Module, #IGBT, #SG2803J_DESC
Email: sales@shunlongwei.com
URL: https://www.slw-ele.com/sg2803j-desc.html

Manufacturer Part Number: SG2803J/DESCPbfree Code: NoPart Life Cycle Code: ActiveIhs Manufacturer: MICROSEMI CORPPart Package Code: DIPPackage Description: HERMETIC SEALED, CERAMIC, DIP-18Pin Count: 18Manufacturer: Microsemi CorporationRisk Rank: 5.17Additional Feature: LOGIC LEVEL COMPATIBLECollector Current-Max (IC): 0.5 ACollector-Emitter Voltage-Max: 50 VConfiguration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTORDC Current Gain-Min (hFE): 1000JESD-30 Code: R-CDIP-T18JESD-609 Code: e0Number of Elements: 8Number of Terminals: 18Operating Temperature-Max: 150 °CPackage Body Material: CERAMIC, METAL-SEALED COFIREDPackage Shape: RECTANGULARPackage Style: IN-LINEPeak Reflow Temperature (Cel): NOT SPECIFIEDPolarity/Channel Type: NPNQualification Status: Not QualifiedSurface Mount: NOTerminal Finish: TIN LEADTerminal Form: THROUGH-HOLETerminal Position: DUALTime Small Signal Bipolar Transistor, 0.5A I(C), 50V V(BR)CEO, 8-Element, NPN, Silicon, HERMETIC SEALED, CERAMIC, DIP-18

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