#STMicroelectronics, #BU900TP, #IGBT_Module, #IGBT, BU900TP 5A, 370V, NPN, Si, POWER TRANSISTOR, ROHS COMPLIANT PACKAGE-3; BU900TP
Manufacturer Part Number: BU900TPRohs Code: YesPart Life Cycle Code: ObsoleteIhs Manufacturer: STMICROELECTRONICSPackage Description: ROHS COMPLIANT PACKAGE-3Pin Count: 3Manufacturer: STMicroelectronicsRisk Rank: 5.81Collector Current-Max (IC): 5 ACollector-Emitter Voltage-Max: 370 VConfiguration: DARLINGTON, 3 TRANSISTORS WITH BUILT-IN DIODE AND RESISTORDC Current Gain-Min (hFE): 7000JESD-30 Code: R-PSFM-T3Number of Elements: 1Number of Terminals: 3Operating Temperature-Max: 150 °CPackage Body Material: PLASTIC/EPOXYPackage Shape: RECTANGULARPackage Style: FLANGE MOUNTPeak Reflow Temperature (Cel): NOT SPECIFIEDPolarity/Channel Type: NPNPower Dissipation-Max (Abs): 55 WQualification Status: Not QualifiedSubcategory: Other TransistorsSurface Mount: NOTerminal Form: THROUGH-HOLETerminal Position: SINGLETime 5A, 370V, NPN, Si, POWER TRANSISTOR, ROHS COMPLIANT PACKAGE-3