Microsemi Analog Mixed Signal Group [MIL] SG2823J-DESC IGBT Module

Manufacturer Part Number: SG2823J/DESCPbfree Code: NoPart Life Cycle Code: ActiveIhs Manufacturer: MICROSEMI CORPPart Package Code: DIPPackage Description: HERMETIC SEALED, CERAMIC, DIP-18Pin Count: 18ECCN Code: EAR99Manufacturer: Microsemi CorporationRisk Rank: 5.43Additional Feature: LOGIC LEVEL COMPATIBLECollector Current-Max (IC): 0.5 ACollector-Emitter Voltage-Max: 95 VConfiguration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTORDC Current Gain-Min (hFE): 1000JESD-30 Code: R-CDIP-T18JESD-609 Code: e0Number of Elements: 8Number of Terminals: 18Operating Temperature-Max: 150 °CPackage Body Material: CERAMIC, METAL-SEALED COFIREDPackage Shape: RECTANGULARPackage Style: IN-LINEPeak Reflow Temperature (Cel): NOT SPECIFIEDPolarity/Channel Type: NPNQualification Status: Not QualifiedSurface Mount: NOTerminal Finish: TIN LEADTerminal Form: THROUGH-HOLETerminal Position: DUALTime Small Signal Bipolar Transistor, 0.5A I(C), 95V V(BR)CEO, 8-Element, NPN, Silicon, HERMETIC SEALED, CERAMIC, DIP-18