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SI6925ADQ-T1-E3 Vishay 20V Dual N-Channel MOSFET Array

  • SI6925ADQ-T1-E3

SI6925ADQ-T1-E3 MOSFET In-stock / Vishay: Dual N-Channel 20V 3.9A. Low-threshold drive. 90-day warranty, portable power rails. Global shipping. Get quote.

· Categories: MOSFET
· Manufacturer: Vishay
· Price:
Price Range: US$ 50 - US$ 200 (Estimated)
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. Available Qty: 1843
90-Day Warranty
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Content last revised on July 8, 2026

SI6925ADQ-T1-E3 Vishay Dual N-Channel MOSFET: High-Efficiency Low-Threshold Switching Solution

Can a sub-3V gate drive truly achieve highly efficient load switching without incurring catastrophic conduction losses? The Vishay Siliconix SI6925ADQ-T1-E3 dual N-channel MOSFET addresses this challenge directly, delivering optimized switching efficiency and low-loss conduction in battery-powered or space-constrained systems with direct sub-3V logic drive. Rated at 20V | 3.9A | 35mΩ (at 4.5V), this device delivers micro-level gate charge control and minimizes overall board space. Key benefits include: direct sub-3V gate compatibility and ultra-low switching transitions. For space-constrained portable electronics requiring sub-3V gate drive, this 20V dual N-channel array is the optimal choice.

Frequently Asked Questions

Technical Clarifications for Low-Voltage MOSFET Implementations

How does the sub-3V gate-threshold voltage of the SI6925ADQ-T1-E3 benefit modern microcontrollers?

The device features a gate-threshold voltage (VGS(th)) as low as 0.6V (typical), enabling full turn-on directly from 2.5V or 1.8V microcontroller I/O pins. This eliminates the need for external level-shifters, saving PCB area.

What is the electrical penalty when operating this MOSFET at a 2.5V gate drive instead of 4.5V?

When VGS drops from 4.5V to 2.5V, typical on-resistance (rDS(on)) increases from 35mΩ to 50mΩ. This modest change ensures robust low-power conduction while maintaining highly competitive thermal efficiency.

How does the maximum Junction-to-Ambient thermal resistance of 110°C/W impact thermal design?

With a maximum RthJA of 110°C/W in its compact TSSOP-8 package, localized board layout copper vias are recommended as a heat sink to safely dissipate continuous loads and keep power levels within its 1.13W rating.

Key Parameter Overview

Decoding the Specifications for High-Performance Conduction

Parameter Symbol Value (Typical / Max) Key Indicator Highlight
Drain-Source Voltage VDS 20V Optimized for low-voltage power rails
Gate-Source Voltage VGS ±12V Provides excellent gate oxide margin
Continuous Drain Current ID 3.9A (at TA = 25°C) High power density in an ultra-slim footprint
On-Resistance (VGS = 4.5V) rDS(on) 35 mΩ (Typ) / 45 mΩ (Max) Minimizes static I²R conduction losses
On-Resistance (VGS = 2.5V) rDS(on) 50 mΩ (Typ) / 65 mΩ (Max) Guarantees low-loss switching at 2.5V logic
Total Gate Charge Qg 4.0 nC (Typ) / 6.0 nC (Max) Enables rapid transition times, reducing switching losses
Junction-to-Ambient Thermal Resistance RthJA 110 °C/W (Max) Thermal benchmark for standard TSSOP-8 packaging

Technical & Design Deep Dive

Optimizing Gate Charge Dynamics to Suppress Switching Dissipation

The core engineering advantage of the SI6925ADQ-T1-E3 lies in its gate charge profile. With a typical gate charge (Qg) of just 4.0 nC at 4.5V, this MOSFET transitions between Cut-off and Saturation with extreme velocity. Imagine a water valve requiring only a brief tap to open, compared to a heavy wheel needing multiple turns; this low gate charge acts like that highly responsive tap, minimizing power lost during transitions.

To understand the low threshold voltage (VGS(th)) of 0.6V, consider an electronic pressure valve calibrated to open at the slightest pressure. This sensitivity ensures that both channels achieve complete low-impedance pathways even when driven by tiny 2.5V signals.

Furthermore, minimizing the parasitic gate-drain "Miller" charge (Qgd) to just 1.2 nC prevents spurious turn-on from rapid drain-voltage transients (dv/dt), ensuring glitch-free performance under highly dynamic load conditions.

What is the primary benefit of its low gate charge? It minimizes switching transition losses in high-frequency converters.

Can it be driven directly by 2.5V logic? Yes, its 0.6V threshold allows direct low-voltage microcontroller drive.

Application Scenarios & Value

Achieving Peak Efficiency in Low-Power HMI Systems and Portable Power Rails

Engineers often face the critical challenge of high static power consumption in battery-operated handheld diagnostic equipment. In these space-constrained environments, microprocessors run on low 2.5V or 3.3V supply rails and cannot generate the 10V gate drive required by standard power MOSFETs.

The SI6925ADQ-T1-E3 solves this dilemma. By utilizing its low threshold voltage of 0.6V and low on-resistance of 50mΩ at 2.5V, the device ensures the load switches transition fully into saturation, enabling smooth power switching to auxiliary modules. For a deeper analysis of discrete power technologies, read our power semiconductor selection guide or explore our comprehensive power MOSFET deep dive.

Designing robust battery-powered solutions requires precise adherence to the MOSFET's Safe Operating Area to prevent hot spots. Proper board-level Thermal Design guarantees that the TSSOP-8 package operates reliably.

In multi-rail configurations where the SI6925ADQ-T1-E3 manages localized power, the system may integrate display panels such as the G121EAN01.4 for robust user interfaces.

From a strategic perspective, integrating highly efficient components like the SI6925ADQ-T1-E3 is a cornerstone of next-generation low-power hardware design. As the industry drives toward battery-powered IoT devices and green computing, minimizing idle power is critical. By reducing conduction resistance at low logic thresholds, the device helps OEMs achieve energy efficiency targets and extend battery service life.