Dalian Da Youshang Group launches TWS bone conduction Bluetooth headset solution based on Actions and Vesper products

“With the development of Bluetooth headsets, bone conduction technology has become a hot topic. The principle of bone conduction is to transmit sound to the auditory nerve through the skull to obtain sound. In recent years, well-known manufacturers such as Apple, Huawei, Edifier and so on have successively introduced bone conduction call noise reduction headphones. This type of headphones collects the user’s sound through the bone transmission method, which can effectively avoid external sound interference and make the call effect more effective. Clear.

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On September 3, 2021, the leading semiconductor component distributor dedicated to the Asia-Pacific market, Grand United Holdings, announced that its subsidiary Youshang has launched a TWS bone conduction Bluetooth headset solution based on Actions ATS3019 and Vesper VA1200.

Figure 1-display board diagram of TWS bone conduction Bluetooth headset solution based on Actions and Vesper products

With the development of Bluetooth headsets, bone conduction technology has become a hot topic. The principle of bone conduction is to transmit sound to the auditory nerve through the skull to obtain sound. In recent years, well-known manufacturers such as Apple, Huawei, Edifier and so on have successively introduced bone conduction call noise reduction headphones. This type of headphones collects the user’s sound through the bone transmission method, which can effectively avoid external sound interference and make the call effect more effective. Clear.

The TWS bone conduction Bluetooth headset solution launched by the Friends of the United Nations based on Actions ATS3019 and Vesper VA120 can separate human voice and environmental noise in real time, bringing users a better experience. This solution conducts the user’s voice signal through bone vibration, combines with AI human voice extraction, and intelligently recognizes the speaking state, no matter what environment you are in, it guarantees the sound transmission effect, and greatly improves the clarity and privacy of the call.

Figure 2-Scene application diagram of TWS bone conduction Bluetooth headset solution based on Actions and Vesper products

Actions is a low-power system-level chip design manufacturer. Its main business is the research and development, design and sales of smart audio SoC chips and low-power wireless MCUs. The company focuses on providing professional chips and complete solutions for wireless audio, smart wear, smart multimedia, voice interaction and smart Internet of Things. ATC3019 is a new generation of Bluetooth headset chip launched by Actions. It has a Bluetooth 5.0 dual-mode configuration with a transmission power of up to 10dBm and a receiving sensitivity of -95dBm, which effectively improves the stability of the audio connection. In the case of regular audio playback, the no-load power consumption can be as low as 5.xmA, while the low-latency mode is supported, and the Bluetooth audio signal delay is as low as 40ms.

Figure 3-Block diagram of TWS bone conduction Bluetooth headset solution based on Actions and Vesper products

VA1200 is a piezoelectric MEMS voice accelerometer under Vesper. It has an ultra-small package of 2.9 mm x 2.76 mm x 0.9 mm. It is compatible with reflow soldering, has no sensitivity degradation, and is dust-proof and moisture-proof, even in harsh environments. It can run stably in the environment. Using the VA1200 voice accelerometer in conjunction with a standard microphone can effectively reduce background sound and wind noise and achieve excellent audio effects. Vesper is an acoustic sensor developer that focuses on the research of piezoelectric MEMS technology. Its products are widely used in mobile devices and audible devices.

Core technical advantages:

ATS3019 chip advantage:

Program development through configuration tools, no need to write code (customized function can modify the code by yourself);
Support Bluetooth 5.0 protocol stack, HFP V1.7, A2DP V1.3, AVRCP V1.6, HID V1.0 and other profiles;
BLE broadcasting and related functions, dual mobile phone connection and TWS teaming, Bluetooth master-slave design in TWS scenarios, TWS binaural song broadcasting (sbc), TWS binaural calling (cvsd), HID camera control and other application scenarios;
Broadcast caller number and ringtone, three-way call, last number callback, call mute, SIRI and other functions, and call PLC, AEC, AGC, ANS, CNG and other algorithm adjustments;
Supports power reporting and volume synchronization, sound adjustment for scenes such as song and call, 14-segment PEQ, amplitude limiting and pre-attenuation;

Advantages of VA1200 chip:

Provide excellent background sound and wind noise suppression;
Small size C2.9 mm x 2.76 mm x 0.9 mm;
Single-ended analog output;
High frequency bandwidth for user voice pickup;
Good compatibility for TWS headsets: with very suitable size, power, performance and cost.

Overall program advantages:

The main control platform with good cost-effectiveness and bone voiceprint call noise reduction technology make the overall solution cost-effective and the call quality is better than most headset solutions on the market.

Scheme specifications:

ATS3019 chip specifications:

QFN32 package: 4 x 4 x 0.75 mm, Pitch 0.4 mm;
32 bit RISC, main frequency 200Mhz;
Support V5.0, compatible with Bluetooth V4.2/V4.0 LE/V3.0/V2.1+EDR Systems;
Built-in ROM, 8Mbits SPI Flash and 216K bytes RAM;
Communication interface: SPI*2, UART*2, I²C*2;
Audio output: 16bit dual-channel stereo, 18 mW PA, optional differential or single-ended output, I²S TX; Audio input: support dual MIC and AUX;
PIN resources: 9 GPIO, 5 PWM, 4 LRADC; integrated power management, support lithium battery and DC5V power supply, 10 ma~300 ma charging current is optional.

VA1200 chip specifications:

Dimensions: 2.90 mm x 2.75 mm x 0.9 mm;
Current consumption: 150uA;
Bandwidth: 2.4 kHz;
Resonance frequency: 3 kHz;
The mechanical stability of all shafts is 10kgee.