Content last revised on January 13, 2026
PDM755HA | 600V 5A DIPIPM, Integrated 3-Phase Inverter Module
Introduction & Key Highlights
Accelerating Low-Power Motor Drive Development with an All-in-One Solution
The PDM755HA from NIEC is a highly integrated DIPIPM (Dual In-Line Package Intelligent Power Module) engineered to dramatically simplify the design and improve the reliability of low-power, three-phase inverter applications. This module consolidates a three-phase IGBT inverter, high- and low-side gate drivers, and comprehensive protection circuits into a single compact, transfer-mold package. Its core value lies in reducing component count, shrinking PCB real estate, and accelerating the development cycle for engineers. With key specifications of 600V | 5A, it provides a robust power stage for variable speed control of small motors. Its key benefits include a significantly reduced bill of materials (BOM) and enhanced system-level reliability through built-in protection. This integration allows for a seamless interface with 3.3V or 5V logic-level controllers, directly answering the need for simplified drive electronics in modern control systems. For sub-1kW motor drives requiring minimal PCB space and rapid development, this 600V/5A DIPIPM is the optimal integrated solution.
Application Scenarios & Value
Streamlining Inverter Design from Appliances to Automation
The PDM755HA is purpose-built for applications where space, cost, and design simplicity are critical decision factors. Its primary role is in driving small three-phase motors, making it an excellent fit for modern home appliances such as air conditioner fans, washing machine motors, and refrigerator compressors. In these high-volume applications, the engineering challenge is to deliver reliable, efficient motor control on a compact and cost-effective PCB. The PDM755HA directly addresses this by integrating the power stage and drive logic, eliminating the need for external optocouplers, a separate gate drive power supply, and complex protection circuitry. This significantly reduces both design complexity and assembly costs.
Beyond appliances, its utility extends to light industrial automation, including small fans, pumps, and automated gate openers. The module's integrated protection features—including short-circuit (SC), over-temperature (OT), and under-voltage (UV) lockout—provide a critical layer of safety, ensuring robust operation in demanding environments. What is the key benefit of the PDM755HA's integrated HVIC? It allows direct control from a 3.3V/5V MCU, simplifying the interface. For systems that demand a higher current capability, related IPMs such as the PS21865-P offer ratings up to 20A.
Key Parameter Overview
Interpreting the Specifications for Simplified System Integration
The specifications of the PDM755HA are tailored for straightforward implementation in low-power inverter systems. The parameters below highlight the module's capabilities and their direct impact on system design and performance.
| Parameter | Value | Engineering Value & Interpretation |
|---|---|---|
| Inverter Part: Collector-Emitter Voltage (V_CES) | 600V | Provides a substantial safety margin for applications operating on 200/240V AC mains, ensuring robustness against voltage transients. |
| Inverter Part: Collector Current (I_C) @ Tc=25°C | 5A | Defines the module's continuous current handling capability, suitable for driving fractional horsepower motors typically found in appliances and light industrial equipment. |
| Control Part: Control Supply Voltage (V_CC) | 13.5 ~ 16.5V (Recommended: 15V) | Specifies the required supply for the internal gate drivers and logic. The narrow, well-defined range simplifies power supply design. |
| Control Part: Input Signal Logic | 3.3V / 5V CMOS Compatible | This is a crucial feature for simplification. It allows the module to be driven directly from a standard Microcontroller (MCU) without the need for level-shifting interface circuits. |
| Junction-Case Thermal Resistance (R_th(j-c)) | 8.0 °C/W (per IGBT) | A key indicator of thermal performance. This value is essential for engineers to accurately calculate heatsink requirements to maintain the junction temperature within safe limits during operation. |
| Built-in Protections | SC, OT, UV | Integrating Short-Circuit, Over-Temperature, and Under-Voltage protection on-chip enhances system reliability and reduces the need for external monitoring and shutdown circuits. |
This table represents a selection of key parameters. For comprehensive electrical characteristics, dynamic performance, and application notes, it is essential to consult the official documentation.
Download the PDM755HA datasheet for detailed specifications and performance curves.
Technical Deep Dive
Dissecting the On-Chip Intelligence and Drive Circuitry
A significant engineering advantage of the PDM755HA lies within its integrated control section. The module incorporates a high-voltage IC (HVIC) for the high-side gate drive. This component performs the critical function of level-shifting, translating the low-voltage logic signals from the MCU to the high-side floating potential required to drive the upper IGBTs. This architecture eliminates the need for pulse transformers or costly high-side optocouplers, which are common sources of complexity and propagation delay in discrete designs.
Furthermore, the design includes a bootstrap circuit diode for the high-side driver supply, requiring only an external bootstrap capacitor and resistor to create a simple, self-biasing power source. The integration extends to fault detection. The module internally monitors for destructive events like short-circuits and over-temperature conditions. Upon detecting a fault, it pulls a dedicated fault output pin (Fo) low and shuts down the IGBTs in a controlled manner. This rapid, on-chip response is typically faster and more reliable than implementing similar protection with external circuitry, providing a superior level of system protection. What is the primary benefit of its pressure-contact design? Enhanced long-term reliability by eliminating solder fatigue.
Frequently Asked Questions
Engineering Insights into the PDM755HA DIPIPM
What is the main advantage of using the PDM755HA over a discrete IGBT and driver solution?
The primary advantage is system integration. The PDM755HA significantly reduces component count, PCB size, and assembly complexity. This leads to a shorter design cycle, lower manufacturing cost, and often, higher reliability due to the reduction of interconnects and the optimized internal layout.
How do the open-emitter terminals on the low-side IGBTs benefit my motor control design?
The open-emitter configuration allows for the insertion of individual shunt resistors in each of the lower arms. This is essential for accurate phase current measurement, which is a fundamental requirement for implementing advanced motor control algorithms like Field-Oriented Control (FOC) or Vector Control, enabling higher efficiency and smoother torque delivery.
What considerations are necessary for the bootstrap circuit design for the high-side drivers?
Proper selection of the external bootstrap capacitor and resistor is crucial. The capacitor must be large enough to supply the gate charge required by the high-side IGBT without significant voltage drop, especially at low PWM frequencies. The datasheet provides specific guidance on calculating these values based on switching frequency and gate charge (Qg).
Can I drive the PDM755HA's input pins directly from a 3.3V microcontroller?
Yes, the input logic is designed to be compatible with both 3.3V and 5V CMOS logic levels. This direct interface capability is a key feature that simplifies the connection between the control and power stages of the inverter design.
How does the integrated over-temperature protection work?
The module contains a temperature sensing element (LVIC) integrated into the control IC. If the temperature of the IC exceeds a predefined threshold (typically around 100°C), the internal logic triggers a fault condition, safely shutting down all six IGBTs and signaling the fault to the host MCU via the Fo pin. This prevents thermal runaway and protects the module from damage.
Design & Application Guidance
An Engineer's Perspective on Implementation
From an implementation standpoint, the PDM755HA is designed for efficiency, not just in its electrical performance but in the engineering workflow. The key to a successful design with this IPM is careful attention to the control interface and thermal management. The direct MCU compatibility simplifies the electrical interface, but designers must ensure clean logic signals and respect the dead-time requirements specified in the datasheet to prevent shoot-through. A well-designed PCB layout, with short, low-inductance traces between the module and decoupling capacitors, is paramount for minimizing noise and ensuring reliable operation. While the module simplifies the power stage, it does not eliminate the need for sound thermal engineering. A properly selected heatsink, coupled with a quality thermal interface material, is essential to extract heat effectively and leverage the full performance potential of this compact and highly capable DIPIPM.