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Infineon BSM200GB60DLC IGBT Module

Eupec BSM200GB60DLC: A robust 600V, 200A dual IGBT. Its low Vce(sat) ensures high efficiency and reliability for demanding industrial power conversion.

· Categories: IGBT Module
· Manufacturer: Infineon
· Price: US$ 45
· Date Code: 2021+
. Available Qty: 420
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BSM200GB60DLC Specification

Eupec BSM200GB60DLC | Robust 600V Dual IGBT for High-Reliability Power Conversion

The Eupec BSM200GB60DLC is a workhorse 600V, 200A dual IGBT module engineered for demanding power conversion applications where reliability and thermal efficiency are non-negotiable. Housed in a standard, industry-proven package, this module provides a robust foundation for inverters, drives, and power supplies operating in harsh industrial environments. Its design philosophy prioritizes durability and consistent performance over the entire operational lifetime.

Product Highlights at a Glance

  • Voltage and Current Rating: A solid 600V collector-emitter voltage and 200A continuous collector current make it suitable for a wide range of medium-power applications.
  • Low Conduction Losses: Features a low saturation voltage (Vce(sat)) technology that directly translates to reduced heat generation and higher system efficiency.
  • Robust Construction: Built with a high-insulation voltage package and an isolated baseplate, ensuring operational safety and simplifying thermal management.
  • Dual (Half-Bridge) Configuration: The integrated half-bridge topology is ideal for building compact and efficient three-phase inverter stages or DC-DC converters.

Technical Deep Dive: Engineering for Longevity

Two core engineering principles define the BSM200GB60DLC's value proposition: optimized conduction performance and exceptional package integrity.

First, the module's low VCE(sat) characteristic is a critical advantage. By minimizing the voltage drop across the device when it's fully on, power dissipated as heat (conduction loss) is significantly reduced. For a design engineer, this means a smaller, more cost-effective heatsink can be used, or alternatively, the system can operate at a higher ambient temperature without derating. This is a crucial factor in sealed enclosures or high-density power systems where thermal headroom is limited.

Second, the mechanical and electrical robustness of the package cannot be overstated. The BSM200GB60DLC utilizes a Direct Bonded Copper (DBC) substrate which provides excellent heat transfer from the silicon die to the baseplate and superior thermal resistance characteristics. This construction method is known for its high reliability during thermal cycling, preventing delamination and ensuring a long service life in applications with frequent start/stop cycles, such as industrial motor drives.

Key Parameter Overview

The following table outlines the critical electrical and thermal characteristics that engineers rely on for system design and simulation. For a complete list of specifications, you can download the official BSM200GB60DLC datasheet.

ParameterValue
Collector-Emitter Voltage (Vces)600 V
Continuous Collector Current (Ic @ Tc=80°C)200 A
Collector-Emitter Saturation Voltage (Vce(sat), typ. @ 200A, 150°C)2.2 V
Total Power Dissipation (Ptot @ Tc=25°C)1000 W
Maximum Junction Temperature (Tjmax)150 °C

Application Scenarios & Value Proposition

The BSM200GB60DLC excels in applications where its balance of performance and ruggedness provides a tangible advantage:

  • Industrial Motor Drives: In Variable Frequency Drives (VFDs), its ability to handle high current and dissipate heat effectively ensures precise motor control and long-term reliability on the factory floor. The half-bridge configuration simplifies the design of the three-phase output stage.
  • Uninterruptible Power Supplies (UPS): High efficiency is paramount in UPS systems to maximize battery runtime. The module's low Vce(sat) contributes directly to reducing energy waste, making it a cornerstone for reliable backup power solutions.
  • Welding Power Supplies: Welding applications demand components that can withstand high current pulses and thermal stress. The robust packaging and thermal design of the BSM200GB60DLC make it a durable choice for these demanding, repetitive-load scenarios.

Frequently Asked Questions (FAQ)

1. How does the BSM200GB60DLC's thermal performance compare to newer generation modules?

While newer generations may offer lower switching losses, the BSM200GB60DLC is optimized for low-to-medium frequency applications (typically

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