Vicor VI-26W-CU IGBT Module

Vicor VI-26W-CU | High-Density, Military-Grade DC-DC Converter Module

The Vicor VI-26W-CU is an advanced, high-density DC-DC converter module engineered for systems where performance, reliability, and space are non-negotiable. As a key component in Vicor's VI-200 series, this module leverages a proprietary zero-current switching topology to deliver exceptional power density and high efficiency in a rugged, chassis-mountable package. It is specifically designed for engineers building demanding power systems in sectors such as military, aerospace, industrial automation, and distributed power architectures where failure is not an option.

Technical Deep Dive: Efficiency and Power Density

The performance of the Vicor VI-26W-CU is rooted in two core technological advantages that set it apart from conventional power converters. Understanding these principles is key to unlocking its full potential in your design.

• Zero-Current Switching (ZCS) Topology: Unlike traditional pulse-width modulation (PWM) converters that suffer from high switching losses, Vicor's patented ZCS technology ensures the internal MOSFETs switch at the zero-crossing point of the current waveform. This fundamental advantage virtually eliminates switching losses, which are a primary source of waste heat. The direct engineering benefit is a significant boost in efficiency (typically 80-90%) and a reduction in the required thermal management hardware, simplifying the overall system design. For a deeper understanding of thermal performance metrics, explore our guide on why thermal resistance matters.
• Extreme Power Density: The high efficiency achieved through ZCS allows the VI-26W-CU to operate at much higher frequencies—into the megahertz range. High-frequency operation enables the use of significantly smaller magnetic components (transformers and inductors) and capacitors. This translates directly into a smaller physical footprint and lower weight, providing a power density that is difficult to achieve with standard converter designs. This is a critical factor for space- and weight-constrained applications.

Application Scenarios and Engineering Value

The robust design and advanced feature set of the VI-26W-CU make it an ideal solution for a variety of high-stakes applications. This is more than just a component; it is a problem-solver for complex power challenges.

• Aerospace and Defense Systems: In avionics, C4ISR systems, and military vehicle electronics, the module's high-density, ruggedized package, and wide operating temperature range ensure reliable power delivery under extreme shock, vibration, and thermal stress.
• Industrial Process Control: The VI-26W-CU provides clean, isolated, and reliable power for sensitive PLCs, sensors, and distributed control systems on the factory floor, ensuring system uptime in electrically noisy environments.
• Distributed Power Architectures (DPA): As a core component in a DPA, this module excels at providing localized, point-of-load conversion from a higher-voltage DC bus. This approach minimizes power loss over long cable runs and improves transient response for dynamic loads, a common requirement in complex machinery. These types of integrated solutions are a cornerstone of modern Power module design philosophy.

Key Performance Parameters

The following table provides a snapshot of the critical specifications for the Vicor VI-26W-CU. For complete electrical and mechanical data, it is essential to consult the official product datasheet.

For detailed schematics and performance curves, please download the official Vicor VI-26W-CU datasheet.

Frequently Asked Questions for Design Engineers

Can the VI-26W-CU modules be connected in parallel for increased power output?Yes, one of the key features of the Vicor VI-200 series is their ability to be easily paralleled for higher power or redundancy. The modules include a dedicated parallel pin (PR) which allows multiple units to share the load current accurately. This enables scalable power solutions without the need for complex external load-sharing circuitry, providing a straightforward path to designing multi-kilowatt arrays.

What are the primary considerations for thermal management with the 'CU' case?The 'CU' case code signifies a chassis-mountable package with a finned heatsink for enhanced thermal dissipation. Effective thermal management requires ensuring a low thermal impedance path from the module's baseplate to the system chassis or a cold plate. Use a high-quality thermal interface material (TIM) and ensure proper mounting torque to minimize contact resistance. The module's high efficiency already reduces the thermal load, but for operation at the upper end of its power and temperature range, proper heatsinking is critical for long-term reliability. For any specific application challenges or to explore our wider range of IGBT modules for different power applications, please contact our technical team.