Fuji 2MBI400VG-060

2MBI400VG-060 Datasheet, Specs & Engineering Analysis: A 600V, 400A V-Series IGBT Module

Content last revised on October 12, 2025.

Introduction: A High-Level Overview

The Fuji Electric 2MBI400VG-060 is a 600V half-bridge module that provides exceptional thermal stability and reliability for high-current power conversion systems. Engineered with key specifications of 600V | 400A | Tj(max) 175°C, this device offers tangible engineering benefits, including enhanced thermal design margin and superior long-term reliability under demanding load cycles. It directly addresses the need for robust thermal management in high-stress applications by combining a low thermal resistance AlN substrate with a high maximum operating temperature. Best suited for high-power motor drives and UPS systems where thermal performance under heavy loads dictates system reliability and power density.

Application Scenarios & Value

System-Level Benefits in Demanding Motor Drive and UPS Applications

The 2MBI400VG-060 is engineered for high-power, high-frequency applications where thermal management and efficiency are critical design constraints. Its robust characteristics make it a strong candidate for the core switching element in systems such as:

• Variable Frequency Drives (VFDs): In industrial motor control, the module's ability to handle 400A continuously ensures precise and reliable control of large AC motors. The primary challenge in VFDs is managing heat generated during frequent acceleration, deceleration, and braking cycles.
• Uninterruptible Power Supplies (UPS): For commercial and data center UPS systems, reliability is paramount. The 2MBI400VG-060's high thermal margin and low conduction losses contribute to higher system uptime and efficiency.
• High-Power SMPS: In large-scale switched-mode power supplies, the module facilitates efficient power conversion with reduced cooling requirements.

Consider a VFD powering a heavy-duty industrial conveyor. The frequent start-stop cycles and variable loads generate significant thermal stress on the power electronics. What is the primary benefit of the module's 175°C Tj(max)? It acts like a higher redline on an engine, providing a crucial safety margin to absorb transient temperature spikes without compromising the device's lifespan. This robust thermal headroom, a direct result of its V-Series design and construction, is essential for preventing thermal runaway and ensuring system longevity. For applications requiring a lower current rating but a similar 600V voltage class, the related 2MBI300NB-060 offers a different performance profile.

Key Parameter Overview

Decoding Key Specifications for Thermal Robustness and Efficiency

The performance of the 2MBI400VG-060 is defined by a set of key parameters that directly influence its behavior in a power circuit. The following table provides a summary based on the official datasheet.

Download the 2MBI400VG-060 datasheet for detailed specifications and performance curves.

Technical Deep Dive

A Closer Look at the AlN Substrate and its Impact on Thermal Management

A critical, yet often overlooked, feature of the 2MBI400VG-060 is its use of an Aluminum Nitride (AlN) Direct Bonded Copper (DBC) substrate for electrical isolation. From an engineering perspective, this is a significant upgrade over the more common Alumina (Al2O3) substrates. The key advantage lies in thermal conductivity. AlN exhibits a thermal conductivity that is 5-7 times higher than that of Alumina. What is the practical result of this material choice? A dramatically lower thermal resistance (Rth(j-c)) of 0.09 K/W.

To put this into context, the AlN substrate acts like a multi-lane superhighway for waste heat, allowing it to be evacuated from the IGBT chip to the heatsink with minimal obstruction. A standard Alumina substrate, by comparison, is more like a single-lane country road. This efficient heat extraction path is fundamental to the module's ability to operate reliably at a high current of 400A and leverage its 175°C maximum junction temperature. For system designers, this translates directly into a smaller required heatsink, higher achievable power density, and ultimately, a more reliable system with a longer operational lifespan.

Frequently Asked Questions

Engineering-Focused Inquiries

How does the 175°C maximum junction temperature (Tjmax) of the 2MBI400VG-060 benefit a power system design?
An elevated Tjmax of 175°C provides a larger thermal operating margin. This allows the system to withstand unexpected overload conditions or operate in higher ambient temperatures without immediate derating or failure. It gives engineers more flexibility in thermal design, potentially allowing for more compact cooling solutions and increasing the overall robustness of the final application.

What is the practical engineering advantage of the Aluminum Nitride (AlN) substrate used in this module?
The primary advantage of the AlN substrate is its superior thermal conductivity compared to standard materials like Alumina. This results in a lower junction-to-case thermal resistance, enabling faster and more efficient heat removal from the semiconductor die. This directly enhances reliability, allows for higher power density, and is a key enabler for achieving the module's high current and temperature ratings.

Technical Support and Further Steps

To fully leverage the capabilities of the 2MBI400VG-060, a comprehensive understanding of its thermal and electrical characteristics is essential. Our team of specialists can provide engineering-level support to help you analyze its performance within the context of your specific application. For detailed inquiries regarding integration, gate drive design, or thermal modeling for this V-Series IGBT technology, please contact us for a technical consultation.