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Infineon FP40R12KE3G IGBT Module

Infineon FP40R12KE3G: A 1200V/40A EconoPIM™ 3 module with TRENCHSTOP™ IGBT3. This integrated power stage ensures high efficiency and thermal reliability for compact motor drives.

· Categories: IGBT Module
· Manufacturer: Infineon
· Price: US$ 80
· Date Code: 2023+
. Available Qty: 216
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FP40R12KE3G Specification

FP40R12KE3G: Engineering a Compact and Reliable 1200V/40A Power Stage

Content last revised on October 16, 2025.

The Infineon FP40R12KE3G is a 1200V, 40A PIM (Power Integrated Module) that integrates a three-phase input rectifier, a three-phase inverter, a brake chopper, and an NTC thermistor in a single EconoPIM™ 3 housing. This module leverages Infineon's TRENCHSTOP™ IGBT3 technology to deliver a solution optimized for thermal performance and switching efficiency in compact motor drives. With a collector-emitter voltage of 1200V, a nominal collector current of 40A, and robust thermal cycling capability, it provides a dependable foundation for power conversion systems. This integrated design directly addresses the engineering challenge of reducing system size and complexity without compromising on thermal management. For space-constrained applications like servo drives or auxiliary inverters where thermal stability is paramount, the FP40R12KE3G offers a highly efficient and reliable power core.

Key Parameter Overview

Decoding the Specs for Thermal and Electrical Efficiency

The technical specifications of the FP40R12KE3G are pivotal for engineers designing compact and efficient power systems. The module's performance is defined by a balance of voltage ratings, current handling, and thermal characteristics, which are crucial for ensuring reliability and operational longevity.

Parameter Category Specification Value Engineering Significance
Inverter IGBT Collector-Emitter Voltage (VCES) 1200 V Provides substantial voltage margin for applications connected to 400V or 575V AC lines, enhancing system robustness against voltage transients.
Continuous DC Collector Current (IC) 55 A (@ TC=25°C) Defines the maximum continuous current handling capability under ideal cooling conditions, critical for power throughput calculations.
Collector-Emitter Saturation Voltage (VCEsat) 1.80 V (Typ. @ IC=40A) A lower VCEsat directly translates to reduced conduction losses, which simplifies thermal management and improves overall inverter efficiency. Think of it as electrical friction; less friction means less wasted heat.
Rectifier Diode Repetitive Peak Reverse Voltage (VRRM) 1600 V Ensures high reliability for the input stage, capable of withstanding significant voltage spikes common on industrial power grids.
Thermal Characteristics Thermal Resistance, Junction-to-Case (Rth(j-c)) 0.57 K/W (per IGBT) This value is a direct measure of how efficiently heat can be transferred from the semiconductor junction to the module's case. A lower value simplifies heatsink selection and enables higher power density.
Integrated Features NTC Thermistor R25 = 5 kΩ Provides a direct means for real-time temperature monitoring, enabling critical over-temperature protection and sophisticated thermal management control loops.

Download the FP40R12KE3G datasheet for detailed specifications and performance curves.

Application Scenarios & Value

System-Level Benefits in Compact Motor Drives and Power Converters

The FP40R12KE3G is engineered for power applications where space, reliability, and thermal efficiency are critical design constraints. Its high level of integration makes it particularly suitable for compact systems by reducing component count and simplifying PCB layout. For an engineer designing a servo drive for a CNC machine or robotic arm, the primary challenge is often dissipating heat within a sealed, small-footprint enclosure. The module's low VCEsat of 1.80V minimizes conduction losses, directly reducing the waste heat that must be managed. This allows for smaller heatsinks and potentially fan-less designs, increasing system reliability by eliminating a mechanical point of failure. The integrated NTC thermistor provides the necessary feedback for precise thermal control, preventing overheating during demanding operational cycles. This combination of features makes the FP40R12KE3G an excellent fit for:

  • Motor Drives for industrial automation and robotics.
  • Auxiliary inverters in commercial vehicles or construction equipment.
  • Power stages for medical equipment requiring high reliability.
  • Air conditioning systems focused on energy efficiency.

While the FP40R12KE3G is ideal for systems requiring up to 40A, for applications demanding higher current capacity within a similar integrated package, the FP50R12KE3 offers a comparable 1200V rating with an increased current handling capability.

Frequently Asked Questions (FAQ)

What is the primary benefit of the EconoPIM™ 3 housing?The EconoPIM™ 3 housing's main advantage is its high level of integration, combining a three-phase rectifier, brake chopper, and inverter into a single, compact, and industry-standard package. This drastically reduces the physical footprint, simplifies assembly, and minimizes stray inductance compared to a discrete solution, which is critical for improving electrical performance and reliability.

How does the integrated NTC thermistor improve system design?The integrated NTC thermistor provides a direct, real-time measurement of the module's baseplate temperature. This allows the system controller to implement precise over-temperature protection, preventing thermal runaway and catastrophic failure. It also enables more advanced thermal management strategies, such as derating power output gracefully when temperatures rise, maximizing uptime without compromising the module's lifespan.

What does the VCEsat positive temperature coefficient signify for this module?The positive temperature coefficient of the collector-emitter saturation voltage (VCEsat) is a key feature for reliable paralleling of IGBTs. It means that as an IGBT heats up, its on-state resistance (and thus VCEsat) increases. In a parallel configuration, if one chip starts to carry more current and gets hotter, its rising VCEsat naturally forces current to be shared more evenly with the other, cooler chips. This self-balancing behavior prevents current hogging and subsequent thermal runaway, making parallel designs more robust.

Technical Deep Dive

An Analysis of TRENCHSTOP™ IGBT3 Technology and Thermal Management

The core of the FP40R12KE3G's performance lies in the use of Infineon's TRENCHSTOP™ IGBT3 technology. This technology is engineered to optimize the trade-off between conduction losses (VCEsat) and switching losses (Eon/Eoff), particularly for applications operating at moderate switching frequencies. For a motor drive, this means achieving high efficiency across a range of operating speeds. The key to this technology is a field-stop layer that allows for a much thinner N-drift region compared to older Non-Punch-Through (NPT) IGBTs. This is analogous to reducing the thickness of a wall to allow things to pass through more easily; the thinner drift region leads to a lower VCEsat, reducing the heat generated during conduction.

Furthermore, the module's thermal resistance (Rth(j-c)) of 0.57 K/W per IGBT is a critical parameter for thermal design. This value represents the thermal "bottleneck" between the active silicon and the heatsink. A lower number indicates more efficient heat extraction. For system designers, this specification directly dictates the required size and performance of the heatsink to maintain the junction temperature (Tvj) within safe operating limits, ensuring long-term reliability and preventing premature component failure.

Strategic Considerations

For engineering teams developing next-generation motor drives or power converters, the FP40R12KE3G represents a strategic design choice that balances performance, integration, and reliability. Its PIM architecture significantly accelerates the design-to-market cycle by providing a pre-validated power stage, reducing the complex engineering effort required for layout, thermal analysis, and component selection associated with a fully discrete solution. By leveraging the proven reliability of the TRENCHSTOP™ IGBT3 technology within the industry-standard EconoPIM™ 3 package, this module allows designers to focus resources on higher-level system features and software innovation, creating a competitive advantage in a demanding market.

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