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GeneSiC MBRT60045 IGBT Module

MBRT60045 RC-IGBT: 450V/600A module. Integrates IGBT and diode on one die to cut stray inductance, boost power density, and simplify high-current inverter designs.

· Categories: IGBT Module
· Manufacturer: GeneSiC
· Price: US$ 32
· Date Code: 2022+
. Available Qty: 458
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Tags: 600aigbt

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MBRT60045 Specification

MBRT60045 | 450V 600A Reverse-Conducting IGBT for Unmatched Power Density

The MBRT60045 is an advanced Power Integrated Module (PIM) engineered for high-current, low-voltage applications where thermal performance and system footprint are non-negotiable. By monolithically integrating a 450V IGBT with an antiparallel freewheeling diode (FWD), this Reverse-Conducting IGBT (RC-IGBT) offers a superior solution for designers aiming to reduce complexity and boost efficiency in demanding power conversion stages.

  • Voltage/Current Rating: 450V Collector-Emitter Voltage / 600A Continuous Collector Current.
  • Core Technology: Reverse-Conducting (RC) structure integrates the IGBT and FWD on a single silicon die, drastically reducing package size and stray inductance.
  • Low Conduction Losses: Optimized for minimal VCE(sat), ensuring high efficiency under heavy load conditions typical in motor drives and welding applications.
  • Primary Applications: High-frequency welding power supplies, high-current industrial motor drives, automotive auxiliary inverters, and high-power DC-DC converters.

Technical Deep Dive: The Reverse-Conducting Advantage

Conventional IGBT modules require a separate, co-packaged freewheeling diode to handle reverse current during inductive load switching. The MBRT60045 fundamentally changes this paradigm. Its RC technology, similar in principle to innovations like Infineon's RCDC, fabricates both the IGBT and diode structures on a single piece of silicon. This monolithic integration delivers two critical engineering benefits. First, it eliminates the bond wires between the IGBT and diode chips, significantly lowering the internal stray inductance. This reduction minimizes voltage overshoots during fast switching, simplifying snubber circuit design and enhancing overall system reliability. Second, it creates a more efficient thermal pathway for the diode, improving heat dissipation and allowing the module to operate at higher power densities without thermal compromise.

Optimized for High-Current Industrial Applications

The unique characteristics of the MBRT60045 make it a strategic choice for specific, high-stakes environments:

  • Welding Power Supplies: In high-frequency welders, the low total switching losses (E_total) and exceptional current handling capability of the MBRT60045 allow for higher operating frequencies. This translates directly to smaller magnetic components, reducing the overall size, weight, and cost of the final product.
  • Low-Voltage Motor Drives: For applications like forklift traction drives or robotic servo controllers, this module's high current density and integrated design simplify the power stage. Fewer components mean a smaller PCB, reduced assembly costs, and a more robust inverter design, a key consideration explored in powering precision servo drives.
  • Automotive Auxiliary Systems: In 48V mild-hybrid systems or other high-power auxiliary converters, the module's compact form factor and high efficiency are invaluable, helping engineers meet stringent space and performance targets.

Key Parameter Overview

The following table provides a snapshot of the MBRT60045's performance. For comprehensive electrical and thermal characteristics, consult the official datasheet.

ParameterValue
Collector-Emitter Voltage (V_CES)450 V
Continuous Collector Current (I_C) @ T_c = 100°C600 A
Collector-Emitter Saturation Voltage (V_CE(sat)) @ I_C = 600A, T_j = 125°C1.5 V (Typ.)
Diode Forward Voltage (V_F) @ I_F = 600A, T_j = 125°C1.45 V (Typ.)
Total Switching Energy (E_total) @ I_C = 600A, V_CC = 300V38 mJ (Typ.)
Short-Circuit Withstand Time (t_sc)6 µs

Frequently Asked Questions (FAQ)

1. How does the thermal management of the integrated diode in the MBRT60045 compare to a standard module?The thermal performance is significantly better. By eliminating the separate diode chip and its associated thermal interface layers, the RC-IGBT provides a more direct and efficient path for heat to travel from the diode's junction to the module's baseplate. This results in a lower junction-to-case Thermal Resistance, allowing for higher operational reliability or increased output current for the same junction temperature.

2. What are the key considerations when designing a gate drive for this RC-IGBT?While the fundamentals of robust gate drive design still apply, the lower internal inductance of the MBRT60045 allows for faster switching speeds. However, this also makes the gate loop layout more critical. It is essential to use a low-inductance layout with twisted-pair gate wires and a driver placed as close to the module as possible to prevent ringing and ensure clean, reliable switching.

For detailed application support or to discuss how the MBRT60045 can enhance your next project, please contact our technical team.

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