Semikron SKIIP82AHB15T1 IGBT Module

Semikron Features: High level power integration Two-screws-mounting to the customer heatsink, compact design Low thermal impedance due to durable ceramic insulation Pressure contact technology with simple connection to DCB through pressure contact (no soldering) and with increased power cycling capability High power density, low losses Integrated temperature sensor Features: High level power integration Two-screws-mounting to the customer heatsink compact design Low thermal imped.