Semikron SKiiP 11NAB063T1 | Solder-Free CIB Module for High-Reliability Motor Drives
The Semikron SKiiP 11NAB063T1 is an intelligent power module (IPM) that redefines reliability and ease of manufacturing for low-to-mid-power drive applications. By integrating a full Converter-Inverter-Brake (CIB) topology into a single, solder-free package, this module provides a robust, high-density solution engineered to minimize assembly time and maximize operational lifetime.
Engineering Excellence: Solder-Free SKiiP® and Advanced Silicon
At the core of the SKiiP 11NAB063T1's design superiority is Semikron's proprietary SKiiP® technology. This innovative approach replaces traditional solder connections with a highly reliable spring-pressure contact system. For design engineers, this is a game-changer. It eliminates solder fatigue—a primary failure mechanism in power modules subjected to thermal cycling—drastically improving durability in applications with fluctuating loads. Furthermore, it simplifies the manufacturing process, creating a faster, more repeatable, and cost-effective assembly line without the need for complex soldering procedures.
The module's electrical performance is anchored by advanced Trench Fieldstop IGBTs and complementary CAL (Controlled Axial Lifetime) freewheeling diodes. The Trench Gate structure significantly reduces the collector-emitter saturation voltage (VCE(sat)), leading to lower conduction losses and improved overall inverter efficiency. The CAL diodes are optimized for soft recovery characteristics, which minimizes voltage overshoots and electromagnetic interference (EMI) during switching. This allows for simpler and less costly snubber circuit designs, contributing to a more compact and reliable system.
Optimized Performance in Demanding Applications
The highly integrated nature of the Semikron SKiiP 11NAB063T1 makes it an ideal cornerstone for a range of power conversion systems.
- Compact Motor Drives (VFDs): The CIB configuration consolidates the input rectifier, output inverter, and braking chopper, significantly reducing the PCB footprint and component count. For developers of compact servo drives and variable frequency drives, this means a smaller, more power-dense, and cost-effective end product.
- Uninterruptible Power Supplies (UPS): Reliability is non-negotiable in UPS systems. The module's robust, solder-free construction ensures consistent performance under the stressful load conditions typical of power backup applications, guaranteeing longevity and system uptime.
- General-Purpose Inverters: For applications up to 5.5 kVA, the SKiiP 11NAB063T1 offers a streamlined path from design to production. The integrated NTC temperature sensor provides crucial feedback for thermal protection, further simplifying the overall system design.
SKiiP 11NAB063T1 at a Glance
This table provides a quick overview of the module's key specifications for rapid evaluation by engineers.
| Parameter | Value |
|---|---|
| Collector-Emitter Voltage (VCES) | 600 V |
| Continuous Collector Current (IC @ Tcase=25°C, Inverter) | 75 A |
| Collector-Emitter Saturation Voltage (VCE(sat), typ. @ ICnom) | 1.6 V |
| Topology | CIB (Converter-Inverter-Brake) |
| Package | MiniSKiiP® 1 |
| Integrated Features | NTC Temperature Sensor |
For a comprehensive list of electrical and thermal characteristics, download the official Semikron SKiiP 11NAB063T1 datasheet.
Engineer's FAQ: Getting the Most from the SKiiP 11NAB063T1
Here are expert answers to common questions about implementing this advanced IPM.
- How does the pressure contact mounting affect thermal management?
The spring-contact system ensures a consistent and uniformly distributed pressure across the module's baseplate. This creates a highly reliable, low thermal resistance path to the heatsink, avoiding potential voids and inconsistencies common with soldering. For optimal performance, it is crucial to use the specified mounting hardware and torque to maintain the designed pressure. - What is the primary benefit of a CIB topology in a single module?
The main advantage is system simplification. Integrating the AC-to-DC converter, DC-to-AC inverter, and braking chopper into one package dramatically reduces PCB complexity, assembly labor, and procurement overhead. This integration also minimizes stray inductance between power stages, leading to cleaner switching waveforms and improved electromagnetic compatibility (EMC).
For inquiries about this module or to discuss your specific design requirements, please contact our technical team for expert support.
