IR IRKD91/12A IGBT Module

Features:

High Voltage

Industrial Standard Package

Thick Al metal die and double stick bonding

Thick copper baseplate

UL E78996 approved

3500VRMS isolating voltage

Benefits:

Up to 1600V

Full compatible TO-240AA

High Surge capability

Easy Mounting on heatsink

Al203 DBC insulator

Heatsink grounded

Mechanical Description

The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage

of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.

The Cu baseplate allow an easier mounting on the majority of heatsink with increased tolerance of surface

roughness and improve thermal spread.

The Generation V of AAP module is manufactured without hard mold, eliminating in this way any possible

direct stress on the leads.

The electrical terminals are secured against axial pull-out: they are fixed to the module housing via a click-stop

feature already tested and proved as reliable on other IR modules.

Thermal and Mechanical Specifications

RRM Max. peak reverse leakage 10 mA TJ = 150°C current

VINS RMS isolation voltage 3500 (1 sec) V 50 Hz, circuit to base, all terminals shorted

VFM Max. forward voltage drop 1.45 V IFM = p x IF(AV), TJ = 25°C, tp = 400µs square wave

IF(AV) Max. average forward current 100 A 180° conduction, half sine wave @ Case temperature 100 °C

IF(RMS) Max. RMS forward current 157 A DC @ 90°C case temperarure

TJ Max. junction operating temperature range -40 to 150°C

Tstg Storage temperature range -40 to 150°C

RthJC Max. thermal resistance, junction to case 0.35k/w Per junction, DC operation

Mounting torque ±10% to heatsink 5 N.m

Mass weight 110g