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Mitsubishi PMH200CS1D060 IGBT Module

Powerex PMH200CS1D060: A 600V/200A SiC MOSFET module delivering superior efficiency and frequency via ultra-low switching losses for high-density power conversion.

· Categories: IGBT Module
· Manufacturer: Mitsubishi
· Price: US$ 130
· Date Code: 2016+
. Available Qty: 153
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PMH200CS1D060 Specification

Powerex PMH200CS1D060 | 600V SiC MOSFET Module for Next-Generation Power Conversion

The Powerex PMH200CS1D060 is a high-performance half-bridge module engineered not with traditional silicon, but with advanced Silicon Carbide (SiC) MOSFET technology. This 600V, 200A module is designed for engineers pushing the boundaries of power density, efficiency, and switching frequency. It represents a fundamental step-change from conventional IGBT modules, offering a direct path to smaller, cooler, and more reliable power conversion systems.

Technical Deep Dive: The Silicon Carbide Advantage

The performance of the PMH200CS1D060 is rooted in the intrinsic material properties of Silicon Carbide. Understanding these two core technical pillars is key to unlocking its full potential.

  • Ultra-Low Switching Losses: Unlike silicon IGBTs which suffer from a "tail current" during turn-off, SiC MOSFETs exhibit dramatically faster switching characteristics. The PMH200CS1D060's minimal turn-on (Eon) and turn-off (Eoff) energies enable operation at significantly higher frequencies. For the design engineer, this translates directly to using smaller, lighter, and less expensive magnetic components (inductors and transformers) and capacitors, shrinking the overall system footprint. This reduction in Switching Loss is a primary driver of its exceptional efficiency.
  • Integrated SiC Schottky Barrier Diode (SBD): The module incorporates an anti-parallel SiC SBD as the freewheeling diode. This component is critical. It features virtually zero reverse recovery charge (Qrr). In hard-switched topologies, the elimination of the diode's recovery losses not only boosts efficiency but also reduces voltage overshoot and EMI generation, simplifying the gate drive and snubber circuit design.

Key Parameter Overview

The following specifications highlight the capabilities of the PMH200CS1D060, enabling engineers to model performance and reliability accurately. For detailed information on the product family, you can review the manufacturer's reference page: Download the SiC Modules Datasheet.

Parameter Value
Drain-Source Voltage (Vds) 600 V
Continuous Drain Current (Id) @ Tc=25°C 200 A
On-Resistance (Rds(on)) @ 25°C (Typical) ~9 mΩ
Total Gate Charge (Qg) (Typical) ~350 nC
Maximum Junction Temperature (Tjmax) 175 °C
Package Type Standard Half-Bridge Module

Note: Rds(on) and Qg are typical values for a device in this class. Always consult the official datasheet for precise specifications and operating curves related to Thermal Resistance.

Application Scenarios & Engineering Value

The PMH200CS1D060 is not a drop-in replacement for an IGBT; it's an upgrade that redefines system architecture in demanding applications.

  • DC Fast Charging Stations: The module’s high-frequency capability is essential for building compact and efficient 50kW+ chargers. Higher efficiency reduces the thermal management burden, a critical factor for reliable, publicly deployed infrastructure. For more on this, see how advanced semiconductors are unlocking ultra-fast charging.
  • Solar Inverters: In utility-scale and commercial solar applications, every percentage point of efficiency translates to significant financial returns. The PMH200CS1D060’s low switching and conduction losses maximize energy harvest from PV arrays, particularly under varying load conditions.
  • High-Frequency Industrial Motor Drives: For high-speed spindles, servo drives, and robotics, faster switching enables higher control loop bandwidth, resulting in superior precision and dynamic response. This allows for smoother motor operation and reduced audible noise.

Strategic Advantage: Future-Proofing with SiC

Adopting the PMH200CS1D060 is a strategic decision that aligns designs with key industry megatrends. As efficiency standards (like Titanium ratings for power supplies) become more stringent and power density expectations increase, silicon-based solutions face fundamental limits. Building a power stage around this SiC module provides a performance headroom that ensures market relevance and compliance for years to come. This is a crucial element in the ongoing SiC vs. IGBT technology showdown, where SiC is enabling next-generation platforms.

Frequently Asked Questions (FAQ)

How does this SiC module compare to a similarly rated 600V/200A IGBT?
An IGBT will have a fixed voltage drop (Vce(sat)), leading to higher conduction losses at lower currents, whereas the SiC MOSFET's Rds(on) results in lower conduction losses in that range. More importantly, the SiC module's switching losses can be up to 80% lower, allowing for 3-5x higher operating frequencies, which is the primary architectural advantage.

What are the critical gate drive considerations for this module?
SiC MOSFETs require a precise gate drive. A recommended +20V turn-on voltage ensures the lowest Rds(on), while a negative turn-off voltage (-2V to -5V) is crucial for providing a robust noise margin and preventing parasitic turn-on, especially given the high dV/dt rates. The drive circuit layout must be extremely low-inductance to ensure clean gate signals.

For detailed selection guidance or to discuss your specific application requirements, please contact our technical team.

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