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2MBI200UB-120 Fuji Electric 1200V 200A Dual IGBT Module

  • 2MBI200UB-120
  • 2MBI200UB-120 IGBT Module In-stock / Fuji Electric: 1200V 200A. High-speed switching. 90-day warranty, motor drive. Global fast shipping. Request pricing now.

    · Categories: IGBT
    · Manufacturer: Fuji Electric
    · Price:
    Price Range: US$ 50 - US$ 200 (Estimated)
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    · Date Code: Please Verify on Quote
    . Available Qty: 3182
    90-Day Warranty
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    Content last revised on July 15, 2026

    Optimizing 1200V Power Converters with the Fuji Electric 2MBI200UB-120 IGBT Module

    How can power electronics designers balance high switching speeds and conduction losses in a 1200V/200A inverter design? The Fuji Electric 2MBI200UB-120 is a dual IGBT module that establishes a new standard in high-power efficiency, utilizing trench-gate technology to achieve a typical VCE(sat) of 1.95V. Engineered with continuous ratings of 1200V and 200A, it delivers high performance while boasting a low thermal resistance of 0.085°C/W. This module mitigates power dissipation, answering critical thermal management demands in heavy industrial settings.

    Frequently Asked Questions

    Addressing Design Challenges and Specifications

    How does the low Rth(j-c) of 0.085 °C/W directly impact heatsink selection and overall system power density?

    The low junction-to-case thermal resistance of 0.085 °C/W acts like a wider highway for thermal dissipation. This allows heat to escape faster from the silicon chip to the baseplate, reducing the size requirement of the external heatsink and allowing for a more compact cabinet layout.

    Why does the datasheet specify two different VCE(sat) values, terminal-level and chip-level, and how does this affect driver design?

    The terminal VCE(sat) of 1.95V typical includes internal lead resistance, whereas the chip VCE(sat) of 1.75V represents only the semiconductor junction drop. Engineers must use the terminal-level voltage for overall system efficiency calculations, while the chip-level value is used for internal thermal modeling.

    What gate drive voltages and external gate resistance (Rg) are recommended to optimize switching performance?

    For optimal turn-on and turn-off transitions, a gate drive voltage of +15V/-15V is recommended along with a typical external gate resistance of 3.0 Ω. This configuration ensures sufficient peak gate current to charge the 22 nF input capacitance rapidly while mitigating electromagnetic interference (EMI).

    What is the typical turn-off time (toff) of this module, and how does it impact switching frequency?

    The module features a typical turn-off time of 0.97 µs. This fast switching capability, characteristic of Fuji Electric's U-series trench-gate technology, keeps switching energy losses low, making it suitable for operating frequencies up to 10 kHz in hard-switched topologies.

    Key Parameter Overview

    Decoding the Specs for Enhanced Thermal Reliability

    For high-power inverter topologies, the following parameters are critical for safe operating limits, thermal margins, and overall converter design. The highlighted metrics represent the device's electrical capabilities.

    Parameter Symbol Test Conditions Value / Rating
    Collector-Emitter Voltage VCES Tj = 25°C 1200 V
    Continuous Collector Current IC TC = 25°C / 80°C 200 A
    Pulsed Collector Current ICP 1 ms pulse limit 400 A
    Collector Power Dissipation PC 1 device, TC = 25°C 1500 W
    Collector-Emitter Saturation Voltage (Terminal) VCE(sat) IC = 200A, VGE = 15V, Tj = 25°C 1.95 V (typ) / 2.30 V (max)
    Diode Forward Voltage (Terminal) VF IF = 200A, VGE = 0V, Tj = 25°C 1.80 V (typ) / 2.10 V (max)
    Input Capacitance Cies VCE = 10V, VGE = 0V, f = 1MHz 22 nF (typ)
    Junction Temperature Range Tj Operating limits -40°C to +150°C

    Download the 2MBI200UB-120 datasheet for detailed specifications and performance curves.

    Technical & Design Deep Dive

    A Closer Look at the Trench Gate and Low Inductance Module Packaging

    The internal silicon structure of the 2MBI200UB-120 represents a significant evolutionary step in power device design, integrating a trench gate layout with a field-stop structure. This combination can be visualized as a highly optimized vertical transport system. Traditional planar layouts require current to travel horizontally along the surface before turning downward, adding resistance. In contrast, this trench architecture allows current to flow straight down through thin, vertical channels. This configuration minimizes the on-state resistance and keeps the collector-emitter saturation voltage down to a typical 1.95V, lowering conduction losses during peak load operations.

    What is the primary benefit of the trench gate design? It minimizes conduction losses by lowering on-state voltage drop.

    Furthermore, internal stray inductance is a major threat during high-speed turn-off transitions. When an IGBT cuts off a current of 200A rapidly, parasitic inductance behaves like a hydraulic shock in a closed pipeline when a valve is slammed shut. The resulting voltage spike (V = L * di/dt) can exceed the 1200V rating and lead to catastrophic collector-emitter breakdown. The low-inductance packaging design of the module suppresses this overshoot, which ensures the device operates safely within its reverse bias Safe Operating Area.

    How does the low-inductance package enhance device safety? It minimizes voltage spikes during fast turn-off switching transitions.

    To optimize layout design, engineers can refer to detailed guidelines on IGBT design integration. These resources help reduce external busbar loop inductance.

    In addition, maintaining long-term reliability under severe thermal stress requires robust gate drive strategies. High transient dV/dt can cause parasitic turn-on due to Miller capacitance. Implementing active gate drivers with negative turn-off bias is a critical preventative measure. Understanding the causes of thermal and electrical degradation is key to maintaining system uptime. Engineers can explore the foundational principles outlined in the in-depth analysis of IGBT modules to better handle dynamic thermal cycles.

    Application Scenarios & Value

    Maximizing System Efficiency in High-Power Motor Drives and Industrial Machinery

    For motor drive systems prioritizing high switching speeds and thermal margin, this 1200V 200A module is the optimal choice.

    Consider the real-world engineering challenge of designing a heavy-duty industrial conveyor system. During motor startup, the system experiences high inrush currents that subject the power stage to intense thermal spikes. Utilizing the 2MBI200UB-120, with its pulse current rating of 400A and maximum power dissipation of 1500W, provides the robustness needed to ride through these starting currents without exceeding the maximum junction temperature of 150°C. This capability ensures industrial equipment runs continuously, minimizing expensive plant downtime.

    In applications such as variable frequency drives (VFD), industrial automation, and high-frequency welding machines, this module assists designers in meeting international energy efficiency standards, such as IEC 61800-9. By lowering overall losses, it contributes to overall carbon neutrality targets in factory settings. Proper diagnostics are also crucial for preventative maintenance. Engineers can utilize standard measurement equipment to inspect modules in the field using this guide on preventing overcurrent and thermal failures.

    For power configurations requiring different packaging or voltage/current trade-offs, alternative modules can be evaluated. For designs utilizing legacy configurations, the related 2MBI200NB-120 offers an alternative planar option. Alternatively, the 2MBI200U4H-120 presents an option with updated field-stop trench technology for designs requiring modern switching efficiency characteristics. Selecting the appropriate module configuration remains a critical step in building future-proof, energy-efficient power converters that meet demanding industrial standardizations.

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