Infineon BSM20GP60 IGBT Module | Robust Six-Pack for Efficient Power Conversion
The Infineon BSM20GP60 is a highly reliable power module designed to streamline the development of three-phase power conversion systems. By integrating a full inverter bridge into a single package, it offers a robust and thermally efficient solution for engineers tackling demanding industrial applications. This module is not just a component; it's a foundational building block for creating compact, high-performance motor drives, uninterruptible power supplies, and automation systems.
Technical Deep Dive: Core Advantages in Your Design
- Optimized Conduction and Switching Losses: The BSM20GP60 is engineered with advanced Trench and Field-Stop IGBT technology. This results in a low Collector-Emitter Saturation Voltage (Vce(sat)), directly reducing conduction loss. The benefit for your design is tangible: lower heat generation, which allows for smaller heatsinks, reduces cooling system costs, and ultimately increases overall application efficiency.
- Integrated Six-Pack Configuration: This module consolidates six IGBTs and six fast-recovery freewheeling diodes in a standard 6-pack IGBT module topology. This integration drastically simplifies PCB layout, minimizes parasitic inductance that can cause voltage overshoots in discrete designs, and shortens your product's time-to-market by reducing component count and assembly complexity.
Multi-Dimensional Application Scenarios & Value
The true value of the Infineon BSM20GP60 is demonstrated in how it solves specific challenges across various sectors:
- Variable Frequency Drives (VFDs): In motor drives, thermal stability is key to longevity. The low-loss performance of the BSM20GP60 ensures cooler operation, enhancing the reliability of the drive and allowing for more compact, fanless designs in lower-power applications.
- Uninterruptible Power Supplies (UPS): For a UPS, every watt counts during a power outage. The module’s high efficiency directly translates to longer battery runtime, providing critical systems with extended protection and improving the overall value proposition of the UPS.
- Industrial Automation & Servo Drives: Precision is non-negotiable in servo control. The controlled switching characteristics and low internal inductance of this integrated module enable clean gate signals and fast, precise current control, resulting in improved accuracy and responsiveness of robotic arms and CNC machines.
- Welding Equipment: The robust thermal design and ability to handle pulsed currents make the BSM20GP60 an excellent choice for inverter-based welding power sources, ensuring stable arc performance and long-term durability in harsh industrial environments.
Infineon BSM20GP60 at a Glance
| Parameter | Value |
|---|---|
| Collector-Emitter Voltage (VCES) | 600 V |
| Continuous Collector Current (IC @ TC=80°C) | 20 A |
| Collector-Emitter Saturation Voltage (VCE(sat), typ. @ IC=20A, Tvj=25°C) | 1.9 V |
| Package Type | GP60 |
For complete technical details, please refer to the [BSM20GP60 Datasheet].
Industry Insight & Competitive Edge
In an industry constantly pushing for higher power density and efficiency, integrated power modules like the BSM20GP60 are moving from a convenience to a necessity. Compared to building a power stage with discrete IGBTs, this module provides pre-optimized thermal and electrical characteristics. This mitigates common design risks associated with PCB layout, such as uneven current sharing and excessive parasitic inductance. By choosing this module, you are leveraging decades of Infineon's packaging expertise to build a more reliable and cost-effective end product. For engineers working on systems up to 5 kW, this module hits a sweet spot of performance, integration, and value. For different power requirements, feel free to Explore More IGBT Modules.
Frequently Asked Questions (FAQ)
- What is the primary benefit of the isolated baseplate?The electrically isolated baseplate simplifies assembly by allowing the module to be mounted directly to a common heatsink without requiring additional insulating pads. This improves thermal transfer, reduces assembly steps, and enhances the system's overall reliability and resistance to electrical noise.
- How does the BSM20GP60 help with EMC compliance?By integrating the entire three-phase bridge into a compact housing, the current loops are minimized, which significantly reduces stray inductance and, consequently, radiated electromagnetic interference (EMI). This makes achieving EMC compliance easier and may reduce the need for extensive filtering. Proper PCB layout for IGBT gate drive circuits remains crucial.
To determine if the BSM20GP60 is the optimal fit for your specific design constraints and performance targets, our technical experts are available for consultation. Contact Us for a Quote or for personalized selection support.
