EUPEC FF600R17KF6C_B2 IGBT Module

FF600R17KF6C_B2 | 600A 1700V IGBT for Reliable Inverters

Introduction & Core Specifications

The Infineon FF600R17KF6C_B2 is a 1700V IGBT module architected for superior thermal performance and long-term reliability in high-power converters. This module delivers robust electrical performance through its combination of TRENCHSTOP™ IGBT4 and Emitter Controlled 4 diode technology. Key specifications include: 1700V Collector-Emitter Voltage | 600A DC Collector Current | 150°C Max Operating Junction Temp. It offers the primary engineering benefits of superior thermal management and simplified parallel operation. For designers questioning how to ensure effective heat dissipation in high-current systems, the module's integrated copper baseplate provides a highly efficient thermal interface, crucial for maintaining stability and extending operational lifetime.

Intra-Series Comparison & Positioning

Positioning within the 1700V Family for Thermal Demands

Within a portfolio of high-voltage power modules, the FF600R17KF6C_B2 carves out a specific niche for applications that require a robust 1700V blocking voltage combined with significant current handling up to 600A. Its design prioritizes thermal resilience, making it a distinct choice compared to modules that may offer similar ratings but without the same emphasis on high-temperature operation and efficient heat extraction. This focus on thermal management provides a greater design margin for systems operating in demanding ambient conditions or those pushing for higher power density. For systems where even greater current capacity is required within a similar voltage class, the related FZ1200R17KF6C_B2 offers a pathway to scaling power output while maintaining a comparable technological foundation.

Application Scenarios & Value

Application Value Driven by Thermal Robustness

The technical characteristics of the FF600R17KF6C_B2 translate directly into tangible value across several demanding industrial sectors. The high operational temperature ceiling and efficient thermal design are critical for ensuring reliability and longevity in applications where downtime is costly.

• High-Power Motor Drives: In large-scale industrial motors for manufacturing, pumps, and conveyors, the module's ability to handle thermal cycling and high continuous currents ensures precise control and operational stability, contributing to higher system uptime.
• Commercial, Construction, and Agricultural Vehicles (CAV): The robust mechanical design and thermal resilience are well-suited for the harsh operating environments of electric and hybrid powertrains in CAVs, where temperature extremes and vibration are common.
• Renewable Energy Systems: For solar and wind power inverters, the 1700V rating provides ample voltage margin for systems connected to 1000V DC links. The module's efficiency and reliability are key to maximizing energy harvest and ensuring grid stability.
• Uninterruptible Power Supply (UPS): In critical data centers and industrial backup systems, the module's dependable performance under load prevents costly power interruptions, safeguarding sensitive equipment and operations.

For high-power motor drives demanding robust performance up to Tvj op 150°C, the FF600R17KF6C_B2's low thermal resistance makes it a superior choice for thermal stability.

Key Parameter Overview

Key Parameters for Thermal and Electrical Stability

The performance of the FF600R17KF6C_B2 is defined by a set of key parameters detailed in its datasheet. The following table highlights the specifications most critical for system design and performance evaluation.

Download the Datasheet for complete technical information.

Interpreting Key Specifications

• Collector-Emitter Saturation Voltage (V_CE sat): This parameter is a primary indicator of conduction losses. The low typical V_CE(sat) of 2.15V at nominal current means less power is converted into heat during the on-state, directly enhancing the inverter's overall energy efficiency. Furthermore, its positive temperature coefficient is a crucial feature for IGBT Paralleling , promoting balanced current sharing between modules in high-power arrays without the risk of thermal runaway.
• Thermal Resistance, Junction to Case (R_thJC): This value acts like the diameter of a drainpipe for heat; a lower value signifies a wider pipe, allowing waste heat to escape the semiconductor junction more quickly and efficiently. The FF600R17KF6C_B2's low maximum R_thJC of 0.045 K/W ensures a highly effective thermal path, which is fundamental to keeping the IGBTs within their Safe Operating Area (SOA) and achieving a long operational life.

Industry Insights & Strategic Advantage

Strategic Advantage in Energy-Efficient Systems

The deployment of the FF600R17KF6C_B2 aligns with critical industry trends pushing for greater energy efficiency and higher power density. As standards for motor efficiency (e.g., IE4/IE5) become more stringent, the low conduction losses of this module's TRENCHSTOP™ IGBT4 technology become a strategic asset for designers of Variable Frequency Drives (VFDs). Similarly, in the renewable energy sector, the move towards higher DC bus voltages to minimize resistive losses finds a suitable component in this 1700V module. Its ability to operate reliably at elevated temperatures allows for more compact system designs with smaller, more cost-effective cooling systems, providing a competitive advantage in both performance and total cost of ownership.

Technical Deep Dive

A Closer Look at the Thermal Pathway and Chip Technology

The robust performance of the FF600R17KF6C_B2 is rooted in its internal construction and the silicon technology it employs. At its core is the Infineon TRENCHSTOP™ IGBT4 chip. This technology is designed to minimize conduction losses, which is a direct contributor to the low VCE(sat) value. What is the primary benefit of the module's copper baseplate? It creates a highly effective thermal spreader, ensuring that heat generated by the IGBT and diode chips is distributed evenly and transferred efficiently to the external heatsink. This mechanical feature is just as critical as the silicon itself for achieving the module's high reliability and power density ratings. This integrated approach to unlocking IGBT thermal performance is essential for demanding, high-current applications.

Technical FAQ for the FF600R17KF6C_B2

What specific feature of the FF600R17KF6C_B2 makes it well-suited for parallel connection?

The module's TRENCHSTOP™ IGBT4 has a positive temperature coefficient for its collector-emitter saturation voltage (VCE(sat)). This means that as an individual IGBT heats up, its on-state resistance increases slightly. In a parallel arrangement, this causes current to naturally redirect to the cooler, less resistive modules, creating a self-balancing effect. This characteristic prevents thermal runaway in a single module and ensures stable, reliable current sharing across the entire array, simplifying the design of very high-power inverter systems.

Can the integrated NTC thermistor be used for over-temperature protection?

Yes, the integrated NTC (Negative Temperature Coefficient) thermistor is designed to provide a temperature reading that correlates with the module's baseplate temperature. This data can be fed into the control system's logic to trigger alarms, reduce power output (derating), or initiate a safe shutdown if the temperature exceeds predefined limits, providing a critical layer of protection against overheating.

Engineering & Procurement Support

To facilitate your design and evaluation process, we provide access to comprehensive technical documentation and datasheets for the FF600R17KF6C_B2. For detailed inquiries regarding this module or to explore its suitability for your specific power conversion project, please contact our technical support team. We are equipped to provide the necessary data to help you make an informed procurement decision based on your engineering requirements.