FS300R17KE3 Infineon 1700V 300A Sixpack IGBT Module

Content last revised on February 28, 2026

FS300R17KE3 Infineon 1700V 300A Sixpack IGBT Module

The FS300R17KE3, a centerpiece of the Infineon EconoPACK™+ family, is a high-performance sixpack IGBT module engineered for 1700V industrial power conversion. By integrating TRENCHSTOP™ IGBT3 technology with a specialized copper base plate, this module addresses the stringent requirements of high-voltage efficiency and thermal stability. For industrial 690V inverter designs prioritizing high power density, the FS300R17KE3 1700V 300A module is the optimal choice.

UVP: Optimizing high-voltage system efficiency through minimized switching losses and enhanced thermal conductivity in a compact sixpack configuration.

• Core Specs: 1700V | 300A | TRENCHSTOP™ IGBT3
• Key Benefits: Reduced cooling overhead; superior voltage margin for 690V lines.
• Expert Insight: What makes the FS300R17KE3 ideal for 690V AC drives? Its 1700V rating provides a critical safety buffer against the DC link voltage fluctuations and transient spikes common in heavy industrial environments.

Application Scenarios & Value

Achieving System-Level Efficiency in High-Voltage Industrial Drives

The FS300R17KE3 excels in applications where the 1700V Vces rating is non-negotiable, particularly in Variable Frequency Drives (VFD) operating on 690V grids. In a typical engineering scenario, a designer of a high-power Solar Inverter or a central UPS (Uninterruptible Power Supply) must balance switching frequency with thermal management. The low VCE(sat) of this module—typically 2.00V at its rated 300A—directly reduces conduction losses, allowing for a more compact heatsink design without compromising reliability.

The integration of an internal NTC temperature sensor provides real-time thermal monitoring, which is vital for preventing IGBT failure due to overtemperature during peak load conditions. While this module provides 300A of current handling, for systems requiring significantly higher power density within a similar voltage class, the related FS450R17KE3 offers 450A, while the FF600R17ME4 provides a dual configuration for modular scaling. Integrating this module into a Gate Drive circuit requires careful consideration of the Miller Clamp to prevent parasitic turn-on, a common challenge in high-voltage switching loss optimization.

Key Parameter Overview

Decoding the Specs for Enhanced Switching Reliability

Datasheet Download

Technical & Design Deep Dive

A Closer Look at the Copper Base Plate and IGBT3 Synergy

The mechanical robustness of the FS300R17KE3 is largely attributed to its copper base plate. In high-power electronics, the base plate acts as the primary heat spreader. Think of the thermal resistance (Rthjc) as a highway bottleneck; the 0.075 K/W rating of this module ensures that the "traffic" (heat) generated by 300A of switching current can exit the silicon junction and reach the heatsink with minimal congestion. This is particularly crucial in Variable Frequency Drive (VFD) applications where cyclic loading can lead to power cycling fatigue.

Furthermore, the TRENCHSTOP™ IGBT3 architecture provides a "square" RBSOA (Reverse Bias Safe Operating Area). This means the FS300R17KE3 can safely handle turn-off switching even under high-current conditions, providing engineers with a more forgiving SOA (Safe Operating Area) during fault events like a short circuit. For deeper insights into thermal management, refer to the Why Rth Matters guide or explore the Core Trio of IGBT Selection to understand how Vces and Ic interact in real-world environments.

FAQ

How does the Rth(j-c) of 0.075 K/W directly impact heatsink selection and overall system power density?
A lower Thermal Resistance allows for higher power dissipation within the same temperature limits. For the FS300R17KE3, the 0.075 K/W rating means you can either use a smaller, less expensive heatsink for the same output power or push more current (up to 300A) without exceeding the 150°C maximum junction temperature, effectively increasing the system's power density.

Is the FS300R17KE3 suitable for high-frequency switching applications above 10kHz?
While the IGBT3 technology is optimized for mid-range frequencies (typically 2kHz to 8kHz in 1700V applications), it can be used at higher frequencies if the total power losses (conduction + switching) are managed through aggressive Thermal Management. Engineers should closely monitor the Switching Loss (Eon/Eoff) at their specific frequency to ensure the module remains within its safe thermal limits.

For procurement professionals and engineers seeking high-voltage IGBT Module solutions, the FS300R17KE3 represents a stable, industry-proven platform. Technical evaluation should always begin with the official Infineon Infineon documentation to confirm compatibility with your specific Gate Drive and cooling architecture.