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SEP MDC100-6 IGBT Module

IXYS MDC100-6 Thyristor/Diode Module (600V, 110A/85A). DCB substrate ensures superior thermal stability for high-reliability industrial power control.

· Categories: IGBT Module
· Manufacturer: SEP
· Price: US$
· Date Code: 2025+
. Available Qty: 700
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MDC100-6 Specification

IXYS MDC100-6 Thyristor/Diode Module for Reliable Power Control

Engineered for Thermal Stability and Sustained Performance

The IXYS MDC100-6 Thyristor/Diode Module provides a robust foundation for industrial power conversion, emphasizing long-term reliability through superior thermal management. This module integrates a half-controlled single-phase bridge configuration, leveraging a Direct Copper Bonded (DCB) substrate to minimize thermal stress and enhance power cycling capability. This construction directly addresses the engineering challenge of maintaining performance and extending operational lifetime in demanding industrial power systems.

Top Specs: 600V | 110A (Diode) / 85A (Thyristor) | 2500V Isolation

Key Benefits:

  • Exceptional thermal transfer
  • High operational reliability

Enabling Uptime in Demanding Industrial Environments

The MDC100-6 is designed for a range of applications where consistent and dependable power control is essential for operational continuity. Its robust thermal design ensures it can handle the rigorous demands of industrial settings, preventing premature failures that lead to costly downtime. What is the main benefit of the MDC100-6's construction? Its DCB substrate provides superior thermal performance and long-term reliability.

  • AC Motor Speed & Motion Control: Provides a reliable front-end rectifier and control stage for Variable Frequency Drives (VFDs) and soft starters, ensuring smooth and efficient motor operation.
  • Industrial Power Supplies: Serves as a core component in regulated DC power supplies and battery chargers, where stable output and durability are critical.
  • Temperature and Lighting Control: Ideal for high-power heating and lighting dimmer circuits that require precise phase-angle control and the ability to manage significant thermal loads.
  • Welding Equipment: Delivers the dependable power rectification and control needed for various welding power sources.

For industrial drives requiring stable operation up to a case temperature of 85°C, the MDC100-6's 110A average forward current rating makes it a thermally sound choice for the diode bridge portion of the circuit.

Data-Driven Evaluation: A Comparative Look

For engineers evaluating power modules, understanding the trade-offs in thermal and electrical specifications is key. The MDC100-6 offers a specific set of characteristics for informed decision-making. The data presented here is intended to support your technical assessment process. For systems that operate on higher voltage mains, the related MDC100-16 offers a similar current capability with a 1600V blocking voltage rating.

When comparing modules, consider not only the primary voltage and current ratings but also the thermal resistance (Rth). A lower thermal resistance, like that facilitated by the DCB construction in the MDC100-6, allows for more effective heat extraction, potentially enabling more compact heatsink designs or higher power throughput under the same thermal constraints. For further insights into evaluating these critical parameters, consult our guide on unlocking thermal performance.

The Engineering Behind the MDC100-6's Thermal Integrity

The enduring reliability of the IXYS MDC100-6 stems from its fundamental construction. At its core is a Direct Copper Bonded (DCB) aluminum oxide ceramic substrate. This technology is pivotal for thermal management. Think of thermal resistance as the narrowness of a pipe restricting water flow; a lower Rth value is like a wider pipe, allowing heat (the "water") to flow easily from the silicon chip to the heatsink. The DCB substrate creates an exceptionally wide "pipe" for heat.

Furthermore, this ceramic insulator provides a robust 2500V of electrical isolation. What isolation level does the MDC100-6 provide? It features a robust 2500V electrical isolation for enhanced system safety. This high isolation voltage allows multiple modules to be mounted on a single, non-isolated heatsink, streamlining mechanical assembly and reducing system complexity. The use of planar and glass-passivated chips further enhances the module's stability, ensuring reliable voltage blocking characteristics throughout its operational life.

Core Specifications of the MDC100-6

The following parameters are provided for technical evaluation. For comprehensive details, please refer to the official datasheet.

Download the Datasheet

Key Electrical & Thermal Characteristics (TC = 25°C unless otherwise specified)
Parameter Value Conditions
Diode Ratings
Repetitive Peak Reverse Voltage (VRRM) 600 V
Average Forward Current (ID(AV)) 110 A TC = 85°C
Thyristor Ratings
Repetitive Peak Off-State Voltage (VDRM) 600 V
Average On-State Current (IT(AV)) 85 A TC = 85°C
Module Ratings
Isolation Test Voltage (VISOL) 2500 V~ 50/60 Hz, RMS, 1 minute
Operating Junction Temperature (Tvj) -40 to +125 °C
Thermal Resistance, Junction-to-Case (RthJC) - Diode 0.35 K/W Per diode
Thermal Resistance, Junction-to-Case (RthJC) - Thyristor 0.40 K/W Per thyristor
Weight 150 g Typical

Aligning with Industry Demands for Longevity and Efficiency

In today's competitive industrial landscape, the total cost of ownership (TCO) is a major consideration. Component selection has a direct impact on system longevity, maintenance schedules, and energy efficiency. The design philosophy of the MDC100-6, with its emphasis on superior thermal resistance and robust internal construction, aligns directly with these strategic objectives. By ensuring lower operating junction temperatures and mitigating mechanical stress from thermal cycling, this module contributes to building power systems that are not only effective but also economically advantageous over their entire lifecycle.

Technical Support and Further Information

Our team is available to provide technical data to support your design and procurement process for the IXYS MDC100-6. For detailed specifications, application notes, and to evaluate this module for your next project, please contact us for engineering-level documentation. We are committed to empowering your design decisions with precise and reliable information.

Frequently Asked Questions

1. What are the recommended mounting torque specifications for the MDC100-6, and why are they critical?
The datasheet specifies a mounting torque of 4.5-5.5 Nm for the M6 mounting screws and 2.25-2.75 Nm for the M5 electrical terminal screws. Adhering to these values is crucial. Insufficient mounting torque can create gaps between the module baseplate and the heatsink, significantly increasing thermal resistance and leading to overheating. Conversely, excessive torque can damage the ceramic substrate, compromising the module's mechanical integrity and isolation barrier.

2. How does the glass passivation process in the MDC100-6 contribute to its long-term voltage blocking stability?
Glass passivation involves applying a layer of specialized glass over the exposed silicon junction termination area. This layer acts as a hermetic seal, protecting the sensitive junction from moisture, ions, and other contaminants that can degrade its ability to block high voltages over time. This process results in lower leakage currents and a more stable and reliable performance across the module's entire operational lifespan, especially in environments with fluctuating humidity or temperature.

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