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Toshiba MG200H1AL2 IGBT Module

Toshiba MG200H1AL2: Robust 600V/200A dual IGBT. Delivers proven reliability and low loss, ideal for demanding industrial power conversion.

· Categories: IGBT Module
· Manufacturer: Toshiba
· Price: US$ 25
· Date Code: 2021+
. Available Qty: 757
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MG200H1AL2 Specification

Toshiba MG200H1AL2 | A Robust Workhorse for High-Reliability Power Conversion

The Toshiba MG200H1AL2 is an engineering staple, a 600V, 200A dual IGBT module that has earned its reputation through years of dependable performance in demanding industrial environments. While newer technologies emerge, this module remains a go-to choice for designers who prioritize proven reliability, straightforward implementation, and a balanced performance profile for high-power switching applications.

Engineered for longevity, the MG200H1AL2 delivers a compelling combination of low conduction losses and robust thermal management, making it an ideal component for systems where uptime and durability are non-negotiable.

  • Proven Reliability: Built with Toshiba's established planar IGBT technology and housed in a rugged, industry-standard package for exceptional operational lifespan.
  • Balanced Performance: Optimized for a sweet spot between low saturation voltage (VCE(sat)) and moderate switching speeds, making it versatile across a range of industrial frequencies.
  • High Current Capability: A substantial 200A collector current rating provides ample headroom for high-power motor drives and power supply applications.
  • Simplified Thermal Design: The module's isolated baseplate facilitates easy and effective mounting to a heatsink, ensuring efficient heat dissipation.

Key Technical Specifications

For engineers requiring a quick assessment, the core parameters of the Toshiba MG200H1AL2 are outlined below. For a comprehensive breakdown, you can download the official H1-Series manual.

ParameterValue
Collector-Emitter Voltage (VCES)600V
Collector Current (IC)200A
Collector-Emitter Saturation Voltage (VCE(sat))2.7V (Max)
Total Power Dissipation (PC)780W
Diode Forward Voltage (VECF)2.5V (Max)
Thermal Resistance (Rth(j-c)) - IGBT0.16 °C/W

Application Scenarios & Engineering Value

The true value of an IGBT module is measured by its performance in the field. The MG200H1AL2 excels in several core industrial applications:

  • Industrial Motor Drives: In Variable Frequency Drives (VFDs) and servo systems, its robust Safe Operating Area (SOA) and predictable switching characteristics allow for precise and reliable motor control, from high-torque startups to continuous operation.
  • Welding Power Supplies: The high-stress, pulsed-power environment of welding demands components that can withstand significant electrical and thermal cycling. The MG200H1AL2's rugged construction ensures it can handle these repetitive power bursts reliably.
  • Uninterruptible Power Supplies (UPS): For mission-critical infrastructure, the module’s low conduction losses contribute directly to higher system efficiency and longer battery runtime during power outages. Its proven reliability is paramount for ensuring seamless power conversion when it matters most.

Technical Deep Dive: The Engineering Behind the Performance

The Art of the Performance Trade-Off

The MG200H1AL2 embodies a classic and effective design philosophy. Unlike highly specialized IGBTs that target either ultra-low VCE(sat) or extremely high switching frequencies, this module provides a balanced profile. This deliberate trade-off results in moderate total power losses across a wide operational band (typically 1-15 kHz), simplifying thermal management and reducing the need for complex snubber circuits that are often required to tame faster devices. This balance is a key reason for its enduring popularity in general-purpose inverters.

Thermal Integrity and Package Design

A component's electrical ratings are only as good as its ability to shed heat. The Toshiba MG200H1AL2 is built on an isolated copper baseplate, a time-tested design that ensures a low thermal resistance path from the silicon die to the heatsink. Understanding and optimizing this thermal path is critical, as discussed in our guide on unlocking IGBT thermal performance. This robust thermal design is fundamental to preventing failures from overheating and is a cornerstone of the module's long-term reliability.

Frequently Asked Questions (FAQ)

What are the recommended gate drive conditions for the MG200H1AL2?

For optimal performance and to prevent parasitic turn-on, a gate drive voltage of +15V for turn-on and a negative voltage between -5V and -10V for turn-off is recommended. The negative bias provides a strong buffer against noise-induced switching, a common challenge in high-power environments. For more insights, review our practical tips for robust gate drive design.

Is it feasible to parallel these modules for higher current output?

Yes, paralleling is possible, but it requires careful engineering. Due to the positive temperature coefficient of VCE(sat) in IGBTs, designers must ensure symmetrical PCB layouts for the gate drives and balanced current sharing through careful busbar design. Most importantly, a shared, high-performance heatsink is crucial to keep the modules at a uniform temperature, preventing thermal runaway in one of the devices.

For application-specific inquiries or to discuss how the Toshiba MG200H1AL2 can fit into your next project, please contact our technical team for expert guidance.

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