TZ600N16KOF 1600V Pressure Contact Module for High Reliability
Engineered for Endurance and Thermal Stability
The Infineon TZ600N16KOF thyristor module delivers exceptional operational lifetime and thermal stability for high-power industrial systems through its solder-free Pressure Contact Technology. This design directly addresses the primary failure mechanism in conventional modules—solder fatigue—by using a consistent mechanical force to ensure robust electrical and thermal contact over an extended service life. Key specifications include: 1600V | 600A (ITAVM) | 20 kA (ITSM). The primary advantages are its enhanced thermal cycling capability and superior long-term reliability.
The Strategic Edge of Thermally Robust Rectification
In demanding sectors such as metals processing, large-scale motor control, and renewable energy grid interfaces, equipment uptime is a direct driver of profitability. Component failure, particularly in the power stack, can lead to costly production halts and complex maintenance procedures. The TZ600N16KOF is engineered to mitigate these risks. Its reliance on Pressure Contact Technology makes it inherently more resilient to the mechanical stresses induced by temperature fluctuations. This design philosophy aligns with the industry's push towards lower total cost of ownership (TCO) by extending service intervals and enhancing the predictable lifespan of critical power conversion systems.
A Closer Look at Pressure Contact Engineering
The core of the TZ600N16KOF's durability lies in its internal construction. Unlike traditional modules that rely on soldered layers to connect the silicon die to the baseplate, this device uses a precisely defined mounting force to establish an intimate connection. This approach offers two distinct engineering benefits:
- Elimination of Solder Fatigue: Solder joints are prone to cracking and degradation after thousands of thermal cycles. By removing them, the module's power cycling capability is significantly increased. What is the key benefit of Pressure Contact Technology? It eliminates solder fatigue for superior long-term reliability.
- Improved Thermal Pathway: The direct pressure-based interface provides a consistent and efficient path for waste heat to move from the thyristor junction to the heatsink. Think of thermal resistance as the narrowness of a pipe; a lower value, like the 0.065 K/W per thyristor in this module, signifies a wider pipe allowing heat to flow away from the silicon die with minimal restriction. For a deeper understanding of thermal performance, exploring resources on how Rth impacts design can provide valuable context.
Data-Backed Evaluation for Your Design
For engineers assessing power components, datasheet figures provide the basis for system-level decisions. The TZ600N16KOF's specifications offer a clear picture of its capabilities. When evaluating modules for high-power applications, comparing key parameters is essential. For systems where both thyristor and diode functions are required in a single package, a device such as the TDB6HK124N16RR provides an alternative topology. The data below is presented to facilitate a fact-based evaluation for your specific application requirements.
| Parameter | Infineon TZ600N16KOF | Notes for System Designer |
|---|---|---|
| Repetitive Peak Off-State Voltage (VDRM) | 1600 V | Provides substantial safety margin for 400V/480V and up to 690V AC line applications. |
| Surge Current (ITSM @ 10ms, Tvj=135°C) | 17000 A | Demonstrates extreme robustness against fault conditions and high inrush currents. |
| Thermal Resistance, Junction to Case (Rth(j-c)) | 0.065 K/W (per thyristor) | Indicates highly efficient heat transfer, simplifying heatsink design. |
| Isolating Voltage (Visol) | 4000 V (RMS, 50 Hz) | Ensures high dielectric strength between terminals and the isolated baseplate for safety. |
TZ600N16KOF Specification Snapshot
The following tables provide a summary of the module's key electrical, thermal, and mechanical characteristics, based on the official datasheet. For a comprehensive analysis, please Download the Datasheet.
Electrical Characteristics (per thyristor, at Tvj = 25 °C unless otherwise specified)
- Repetitive Peak Reverse Voltage (VRRM): 1600 V
- Average On-State Current (ITAVM, Tc=100°C): 600 A
- Threshold Voltage (VT0, Tvj=135°C): 0.94 V
- Slope Resistance (rT, Tvj=135°C): 0.39 mΩ
- Gate Trigger Current (IGT): max. 250 mA
Thermal and Mechanical Characteristics
- Operating Junction Temperature (Tvj op): -40 to 135 °C
- Thermal Resistance, Case to Heatsink (Rth(c-h)): 0.015 K/W (per module)
- Mounting Force (FM): 18 - 30 kN
- Weight: Approx. 450 g
Proven Applications in Demanding Thermal Environments
The robust design of the Infineon TZ600N16KOF makes it a suitable component for power conversion systems where reliability and long life are paramount. Its high surge current and thermal cycling capabilities are particularly valuable in:
- High-Power Controlled Rectifiers: Used in industrial DC supplies and front-end rectifiers for large inverters, where it provides reliable phase-angle control.
- AC Motor Soft-Starters: Effectively manages the high inrush current and associated thermal stress during the startup of large induction motors. With its 20,000A ITSM rating, this module is an excellent fit for soft starters where managing high inrush currents is a design priority.
- DC Choppers and Static Switches: The fast turn-on and high current handling make it suitable for high-power DC load switching applications.
Engineers working on such systems can benefit from resources that help in decoding component datasheets to fully leverage these capabilities.
To evaluate the TZ600N16KOF for your next high-reliability power system or to cross-reference it for an existing design, please submit your technical requirements to our team for a detailed assessment.
Frequently Asked Questions about the TZ600N16KOF
1. How does the pressure contact design of the TZ600N16KOF enhance system reliability?
The pressure contact system eliminates soldered connections between the semiconductor die and the baseplate. This removes solder fatigue, a common failure point in power modules subjected to frequent temperature changes, resulting in significantly longer operational life and higher power cycling capability.
2. What is the specified isolating voltage (V_isol) for this module?
According to the datasheet, the TZ600N16KOF has an isolating voltage rating of 4000 V (RMS, 50 Hz, t=1 min), ensuring robust electrical isolation between the power terminals and the module's baseplate for safe system design.
3. What are the mounting force requirements for the TZ600N16KOF to ensure proper operation?
To ensure correct thermal and electrical performance, the module requires a mounting force between 18 kN and 30 kN. Applying the correct, evenly distributed force is critical for achieving the specified low thermal resistance and long-term reliability. Insufficient force can lead to overheating, while excessive force can damage the component.
