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APT APT75GP120JDQ3 IGBT Module

Microchip APT75GP120JDQ3: A 1200V/75A PT IGBT delivering fast, clean switching via a co-pack FRED & Kelvin Emitter. Optimized for high-frequency, high-efficiency power conversion.

· Categories: IGBT Module
· Manufacturer: APT
· Price: US$
· Date Code: 2024+
. Available Qty: 590
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APT75GP120JDQ3 Specification

Microchip APT75GP120JDQ3 | High-Frequency 1200V Punch-Through IGBT for Demanding Power Conversion

The Microchip APT75GP120JDQ3 is not just another power switch; it's a meticulously engineered component designed for engineers pushing the boundaries of efficiency and speed in high-power systems. This 1200V, 75A single IGBT, housed in the robust and easily mountable SOT-227 package, is purpose-built to deliver exceptional performance where it matters most: in high-frequency power conversion applications.

Product Highlights: Performance and Reliability by Design

  • High-Frequency Optimization: Leverages Microchip's advanced Punch-Through (PT) IGBT technology to drastically reduce switching losses, particularly turn-off loss (Eoff), making it ideal for systems operating well above 20 kHz.
  • Superior Dynamic Control: Features a co-packaged Fast Recovery Epitaxial Diode (FRED) with soft recovery characteristics. This minimizes voltage overshoot and EMI, simplifying snubber design and improving overall system reliability.
  • Precision Gate Drive: Incorporates a dedicated Kelvin Emitter pin, which separates the gate drive return path from the main power current. This is a critical feature for minimizing switching oscillations and achieving the fast, clean switching performance specified in the datasheet.
  • Rugged and Isolated Package: The SOT-227 package provides 2500V of isolation and a large, flat base for excellent thermal transfer to a heatsink, ensuring dependable operation in harsh industrial environments.

Engineering for Speed and Precision: A Technical Breakdown

The performance of the APT75GP120JDQ3 is rooted in the intelligent synergy between its silicon technology and packaging. Understanding these elements is key to unlocking its full potential.

The Punch-Through (PT) Advantage in High-Frequency Designs

Unlike standard Non-Punch-Through (NPT) IGBTs, the PT design features a heavily doped N+ buffer layer. During turn-off, this layer significantly accelerates the removal of minority carriers from the drift region. The direct engineering benefit is a major reduction in switching losses. For designers of high-frequency welding power supplies or switch-mode power supplies (SMPS), this translates directly into higher operating frequencies, which allows for smaller, lighter, and more cost-effective magnetic components without sacrificing efficiency.

Synergy in Switching: The FRED Diode and Kelvin Emitter

In hard-switching topologies, the performance of the anti-parallel diode is as critical as the IGBT itself. The integrated FRED diode in the APT75GP120JDQ3 is engineered for a "soft" reverse recovery. This controlled, less abrupt current transition dramatically reduces high-frequency voltage ringing and electromagnetic interference (EMI). The benefit is a more stable system that requires less filtering and is easier to certify.

This is further enhanced by the Kelvin Emitter connection. By providing a clean return path for the gate driver, it bypasses the stray inductance of the main emitter power connection. This seemingly small detail is paramount for achieving clean, fast switching signals, preventing parasitic turn-on, and ensuring your gate drive design performs as intended.

Key Parameter Overview

For a detailed analysis, refer to the official datasheet. For your convenience, a summary of the most critical parameters is provided below.

For complete specifications and performance graphs, you can Download the APT75GP120JDQ3 Datasheet.

ParameterValue
Collector-Emitter Breakdown Voltage (V_CES)1200V
Continuous Collector Current (I_C @ Tc=110°C)75A
Collector-Emitter Saturation Voltage (V_CE(sat), Typ @ 75A)2.4V
Total Switching Energy (E_ts @ 25°C)3.3mJ
Diode Forward Voltage (V_F, Typ @ 75A)2.2V
Thermal Resistance, Junction-to-Case (R_thJC)0.28°C/W

Where the APT75GP120JDQ3 Excels: Real-World Applications

  • High-Frequency Welding: The low switching losses enable the design of compact, efficient, and responsive inverter-based welders that provide superior arc control.
  • Solar Inverters and UPS: The 1200V rating offers robust voltage margin for 400V/480V systems, while the efficient switching and robust Safe Operating Area (SOA) ensure high reliability and power density.
  • High-Performance Motor Drives: In applications like robotic servo drives, the fast, precise switching of the APT75GP120JDQ3 allows for higher PWM frequencies, resulting in smoother motor operation, reduced torque ripple, and lower audible noise.

Engineer's FAQ for the APT75GP120JDQ3

What are the key gate drive considerations for this IGBT?

To maximize performance, it is crucial to use the Kelvin Emitter pin for the gate driver return path. A bipolar gate voltage of ±15V is recommended for fast switching and high noise immunity. Ensure your driver has low output impedance to provide the necessary peak current to charge and discharge the gate capacitance rapidly.

How does the Punch-Through (PT) design affect thermal management?

A key characteristic of PT IGBTs is a positive temperature coefficient for V_CE(sat). This means conduction losses will increase as the device heats up. While this trait is beneficial for paralleling devices, it requires diligent thermal design. Your heatsink solution must be sized to handle the total power dissipation at the maximum expected operating temperature to guarantee reliability. Understanding and calculating these thermal dynamics is crucial for any robust power design, highlighting why thermal resistance matters.

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