Infineon BSM50GD120DN2E3226 | Robust 1200V/50A Dual IGBT for Demanding Power Conversion
The Infineon BSM50GD120DN2E3226 is a cornerstone component for power electronics engineers designing high-reliability systems in the 10-30 kW range. Housed in the industry-proven EconoPACK™ 2 package, this dual IGBT module delivers a precisely engineered balance of performance, thermal efficiency, and ruggedness, making it a go-to solution for cost-sensitive yet demanding industrial applications.
- Voltage and Current Rating: 1200V Collector-Emitter Voltage (V_CES) and 50A Nominal Collector Current (I_C_nom), providing ample headroom for industrial drive and inverter systems.
- Topology: Features a half-bridge (dual) configuration, simplifying the design of 3-phase inverter stages.
- Core Technology: Built upon Infineon’s mature and highly reliable TRENCHSTOP™ IGBT3 technology, optimized for low conduction losses.
- Integrated Sensing: Includes an NTC thermistor for accurate, real-time temperature monitoring, a critical feature for implementing effective thermal protection.
A Technical Deep Dive into Core Advantages
Beyond the top-level specifications, the engineering value of the BSM50GD120DN2E3226 lies in its underlying technology. Two features are particularly critical for system designers.
First, the use of TRENCHSTOP™ IGBT3 technology provides an exceptionally low collector-emitter saturation voltage (VCE(sat)) of typically 1.7V at its nominal current. For a power conversion system, this directly translates into lower conduction losses during operation. The practical benefit is twofold: it increases overall system efficiency and reduces the thermal load, potentially allowing for a smaller, more cost-effective heatsink design. This focus on minimizing static losses makes it ideal for applications with moderate switching frequencies where on-state performance is paramount.
Second, the module's EconoPACK™ 2 package with an integrated NTC thermistor addresses a fundamental engineering challenge: thermal management. The package itself is designed for low thermal resistance from junction to case, ensuring efficient heat extraction. The inclusion of the NTC thermistor provides the control system with a direct feedback loop to monitor the module's operating temperature. This enables the implementation of sophisticated fault-protection strategies, such as power derating or emergency shutdown in over-temperature conditions, significantly enhancing the long-term reliability and unlocking the full thermal performance of the device.
Application Sweet Spots: Where the BSM50GD120DN2E3226 Excels
This module is not a universal solution; it is a specialized tool. Its design parameters make it particularly well-suited for the following applications:
- Industrial Motor Drives: In variable frequency drives (VFDs) and servo drives, the module's robustness and excellent thermal cycling capability ensure a long service life under the demanding load profiles of factory automation. The low Vce(sat) contributes directly to lower operating costs through improved energy efficiency.
- Solar Inverters: For commercial and residential string inverters, maximizing energy harvest is the primary goal. The high efficiency of the BSM50GD120DN2E3226 helps boost the overall conversion efficiency, translating sunlight into usable grid power with minimal losses.
- Uninterruptible Power Supplies (UPS): Reliability is non-negotiable in UPS systems. The proven track record of the EconoPACK™ family and the integrated thermal monitoring provide the dependability required to protect critical loads.
Key Electrical and Thermal Characteristics
For detailed specifications and application notes, please download the official BSM50GD120DN2E3226 datasheet. The table below summarizes the most critical parameters for initial design evaluation.
| Parameter | Value |
|---|---|
| Max. Collector-Emitter Voltage (V_CES) | 1200 V |
| Nominal Collector Current (I_C_nom) | 50 A |
| Repetitive Peak Collector Current (I_CRM) | 100 A |
| Collector-Emitter Saturation Voltage (V_CE(sat), Typ. @ I_C_nom) | 1.70 V |
| Max. Junction Temperature (T_vj max) | 150 °C |
| Internal Configuration | Dual / Half-Bridge |
| Integrated Sensor | NTC Thermistor |
Engineer's FAQ
1. What is the main advantage of the EconoPACK™ 2 package?
Its primary advantage is a combination of reliability and ease of use. The package offers low internal stray inductance, excellent thermal transfer to a heatsink, and features robust screw terminals for secure power connections. This contrasts with press-fit or solder-pin packages, making it ideal for straightforward assembly and maintenance in industrial environments.
2. How does the IGBT3 technology in this module compare to newer generations like IGBT7?
IGBT3 represents a mature, highly optimized technology focused on minimizing conduction losses (low Vce(sat)). Newer technologies like IGBT7 are typically optimized for lower switching losses, enabling higher frequency operation. For applications operating in the sub-20kHz range, such as many standard motor drives, the BSM50GD120DN2E3226 offers a superb performance-to-cost ratio. It provides a robust and field-proven solution without the premium associated with the very latest silicon.
For help selecting from our wide range of IGBT modules for your specific application, please contact our technical team for expert guidance.
