Infineon FB10R06KL4G IGBT Module

FB10R06KL4G IGBT: 600V 10A H-Bridge Module Analysis

Streamlining Power Electronics with Integrated H-Bridge Design

The Infineon FB10R06KL4G consolidates an entire H-bridge power stage into a single, compact module, offering a direct path to simplified design and accelerated manufacturing. At its core, this module leverages TRENCHSTOP™ IGBT4 technology to achieve a balance of efficiency and durability. How does this integration reduce system complexity? By providing a complete four-switch topology in one package, it eliminates the need for multiple discrete components, simplifying PCB layout and thermal management for low-power applications.

• Top Specs: 600V | 10A | VCE(sat) 1.65V (typ.)
• Key Benefits: Simplified H-bridge implementation; Integrated thermal sensing.

Data-Informed Selection: FB10R06KL4G in Context

Evaluating a power module requires a clear understanding of its place within the broader component landscape. The FB10R06KL4G is specifically positioned for low-power applications where space, assembly efficiency, and integrated functionality are primary decision drivers. The data below is presented to support your technical evaluation process. For applications requiring higher voltage blocking capabilities or different current ratings, other modules may be suitable. For example, the FP15R12KE3 offers a 1200V rating in a different configuration.

This comparison is intended to provide factual data points for engineering assessment, not to serve as a direct recommendation. Your specific application requirements, including thermal constraints, control strategy, and mechanical layout, should guide your final component selection.

Design Scenarios: Where Integration Drives Value

The intrinsic design of the FB10R06KL4G makes it a compelling choice for specific engineering challenges, particularly where a compact full-bridge or dual half-bridge topology is required. Its architecture delivers significant value in systems that demand high power density and simplified assembly.

• Compact Servo Drives: In the automation and robotics sectors, motor drive size is a critical design constraint. The module’s integrated H-bridge and small EasyPACK™ 1B footprint allow engineers to develop smaller, more power-dense servo drives without the complexity of managing multiple discrete IGBTs and their associated gate drive circuitry.
• Small Industrial Inverters: For general-purpose inverters and small motor controllers, the FB10R06KL4G provides a robust, all-in-one power stage. The integrated NTC thermistor offers a streamlined method for implementing over-temperature protection, a vital feature for ensuring operational reliability in industrial settings.
• Uninterruptible Power Supplies (UPS): The module's configuration is well-suited for the inverter stage of small-scale UPS systems, where converting DC battery power to AC requires an efficient and reliable H-bridge.

What is the primary benefit of its Press-Fit pin technology? It enables a reliable, solder-free mounting process, which is critical for high-volume automated manufacturing. For low-power motor drives (< 4 kW) requiring minimal footprint, the FB10R06KL4G's integrated H-bridge topology is the defining factor for compact design.

Strategic Implications of Integrated Power Design

Adopting an integrated module like the FB10R06KL4G over a discrete component solution aligns with key industry trends focused on accelerating time-to-market and enhancing system reliability. The move toward pre-configured power stages, such as this four-pack module, shifts engineering effort from component-level circuit design to system-level optimization. This approach minimizes parasitic inductance by shortening connections between switches, a common challenge in discrete layouts that can lead to voltage overshoots. Furthermore, the inclusion of an NTC thermistor directly on the substrate provides far more accurate thermal feedback than an external sensor placed on a heatsink, enabling more precise thermal management and contributing to a longer operational lifetime.

Engineering Specifications at a Glance

The following parameters are derived from the official datasheet to support a detailed technical review. This table is structured to provide a clear overview of the module's primary operational characteristics. For complete data, including detailed charts and application notes, please download the official datasheet.

Download the Datasheet

Technical Architecture: A Closer Look at the Four-Pack

What is the topology of the FB10R06KL4G? It is a Four-Pack H-bridge configuration. This architecture is foundational to its value proposition. Inside the EasyPACK™ housing, four Infineon TRENCHSTOP™ IGBT4 transistors and four emitter-controlled diodes are arranged in a classic H-bridge circuit. This topology is essential for applications requiring bidirectional current control, such as DC motor drives, or for creating an AC waveform from a DC source, as in an inverter.

Interpreting Key Parameters

• Collector-Emitter Saturation Voltage (V_CEsat): This value of 1.65V (typical at 25°C) is a primary indicator of conduction losses. A lower V_CEsat means less power is dissipated as heat when the IGBT is fully on, which directly contributes to higher overall system efficiency.
• Thermal Resistance (R_thJC): This parameter, 6.40 K/W per IGBT, quantifies how effectively heat can be transferred from the silicon junction to the module's case. Think of it like the diameter of a drainpipe for heat; a lower number signifies a wider pipe, allowing heat to escape more easily. Efficient heat removal is crucial for preventing the device from exceeding its maximum operating temperature and ensuring long-term reliability. To learn more about thermal performance, see our guide on Why Rth Matters.

The combination of these carefully specified components within a single module provides a pre-validated power stage that mitigates many of the layout and thermal challenges associated with discrete designs.

Frequently Asked Questions (FAQ)

1. How does the integrated NTC thermistor in the FB10R06KL4G improve system reliability?
The NTC thermistor is physically located close to the IGBT chips on the module's substrate. This proximity provides a much more accurate and responsive measurement of the actual junction temperature compared to an external sensor on the heatsink. It allows the control system to react quickly to thermal stress by reducing current or initiating a shutdown, preventing catastrophic failure and extending the module's operational lifespan.

2. What are the main benefits of using Press-Fit pins for mounting this IGBT module compared to traditional soldering?
Press-Fit technology creates a gas-tight, cold-welded connection between the module pin and the PCB plated-through-hole. The primary advantages are twofold. First, it eliminates the thermal stress on the module and PCB that occurs during soldering, improving long-term reliability. Second, it is a clean, fast, and highly automatable process, which can reduce manufacturing time and cost, especially in high-volume production environments.

Your Next Steps in System Design

The FB10R06KL4G offers a compelling solution for engineers tasked with developing compact and efficient low-power motor controls and inverters. Its integrated approach simplifies the design cycle and enhances manufacturability. To further evaluate its suitability for your specific project, we recommend downloading the complete datasheet and utilizing the provided thermal and electrical data in your system simulations. For any inquiries regarding technical specifications or to discuss your project needs, please contact our team for fact-based support.