CM400HU-24F Mitsubishi 1200V 400A High Power Switching IGBT Module

Content last revised on January 12, 2026

CM400HU-24F IGBT Module: Technical Review for High-Current Industrial Applications

A 1200V, 400A Single IGBT Engineered for Reliability and Simplified Thermal Design

The Powerex CM400HU-24F is a high-performance single IGBT module designed for robust power switching in demanding industrial environments. It delivers a formidable combination of high current capacity and efficient operation, centered on a design that prioritizes both electrical performance and long-term mechanical reliability. With key specifications of 1200V | 400A | VCE(sat) 2.7V, its primary benefits include significantly simplified thermal assembly and enhanced system durability. For engineers questioning how to streamline heatsink mounting without compromising electrical safety, the module's integrated isolated base provides a direct and effective solution. Best fit for high-power chopper circuits and motor drives where simplified assembly and consistent thermal performance are critical design criteria.

Key Parameter Overview

Decoding the Electrical and Thermal Specifications for System Design

The CM400HU-24F is defined by its capacity to handle substantial power loads while maintaining operational efficiency. The parameters below are critical for system-level design, particularly for thermal management and loss calculations in applications like Variable Frequency Drive (VFD) systems.

Download the CM400HU-24F datasheet for detailed specifications and performance curves.

Application Scenarios & Value

System-Level Benefits in High-Power Industrial Applications

The CM400HU-24F is strategically suited for high-power switching circuits where efficiency and reliability are paramount. Its single-switch topology makes it an excellent building block for chopper circuits, boost/buck converters, and the brake chopper phase in large AC motor control systems.

Consider the design of a high-power welding power supply. A key engineering challenge is ensuring consistent and reliable thermal contact between the power module and the heatsink while maintaining high voltage isolation. The CM400HU-24F's integrated isolated base directly addresses this challenge. By eliminating the need for a separate, fragile ceramic insulation sheet, it reduces assembly complexity and removes a potential point of failure. This design ensures more uniform thermal transfer, crucial for handling the high pulse currents typical in welding, thereby improving the system's overall robustness and lifespan. For systems requiring even greater current capabilities, the CM600HU-24F offers a similar design with a 600A rating, while applications needing a dual-switch configuration may find the CM300DU-24F to be a suitable component.

Frequently Asked Questions

Engineering Inquiries on Performance and Integration

How does the 0.06 °C/W Rth(j-c) value for the CM400HU-24F influence the thermal design process?
A low junction-to-case thermal resistance like 0.06 °C/W signifies highly efficient heat transfer from the IGBT chip to the module's baseplate. For a design engineer, this means that for a given power loss, the chip's temperature rise will be minimized. This directly translates to the ability to use a smaller, more cost-effective heatsink or to operate the device at higher power levels while staying within safe temperature limits, a key aspect of effective IGBT thermal performance.

What is the primary benefit of the CM400HU-24F's integrated isolated baseplate?
Its primary benefit is enhanced long-term reliability by simplifying the thermal stack. It eliminates the need for external insulation pads, which can be prone to cracking, contamination, or improper mounting, leading to inconsistent thermal performance or catastrophic isolation failure. The integrated design ensures a certified 2500Vrms isolation with a more robust and repeatable assembly process.

What are the recommended gate drive voltage settings for the CM400HU-24F?
To ensure the module operates at its specified low VCE(sat), a positive gate voltage of +15V is typically recommended. While the datasheet indicates an absolute maximum of ±20V, operating within the recommended range ensures optimal performance and longevity. A negative gate voltage (e.g., -5V to -10V) is often used during the off-state to provide a strong defense against noise-induced turn-on, particularly in electrically noisy environments found in welding or large inverter applications. For further reading, explore these practical tips for robust IGBT gate drive design.

With a VCE(sat) of 2.7V at 400A, how are conduction losses calculated for this module?
Conduction loss (Pcond) is calculated by multiplying the on-state voltage, VCE(sat), by the collector current, IC. For a steady DC current, the formula is Pcond = VCE(sat) * IC. At rated current, this would be 2.7V * 400A = 1080 Watts. It's important to consult the datasheet's characteristic curves, as VCE(sat) varies with both current and junction temperature. This calculation is the first step in determining the total power dissipation and required cooling for the UPS (Uninterruptible Power Supply) or motor drive it is designed into.

Strategic Positioning

The CM400HU-24F represents a strategic choice for designers of high-power industrial systems who value manufacturing efficiency and field reliability as much as raw electrical performance. By integrating the isolation layer, Mitsubishi Electric Power Products (Powerex) provides a component that reduces assembly cost and mitigates long-term risks associated with complex thermal interfaces. This module is not merely a high-current switch but an engineered solution aimed at improving the total cost of ownership and operational robustness of the end system, from industrial motor controls to high-capacity power supplies.