CM600HA-28H Mitsubishi 1400V 600A High Power IGBT Module

Content last revised on November 16, 2025

Mitsubishi CM600HA-28H | 1400V 600A IGBT for Reliable Power

Engineered for Thermal Stability in High-Current Applications

In an era where power density and operational uptime define system value, the Mitsubishi CM600HA-28H IGBT Module provides a robust foundation for high-power conversion. This module is engineered to deliver exceptional thermal performance and long-term reliability under demanding electrical and environmental loads. With headline specifications of 1400V | 600A | 0.042°C/W Rth(j-c), it combines high voltage and current capabilities with superior heat dissipation. Key engineering benefits include superior thermal headroom and extended operational life. Its low thermal impedance is a direct answer to the challenge of managing heat in high-current systems, simplifying heatsink design and improving overall system reliability.

Comparative Data for Informed Component Selection

To support your design and procurement decisions, this section provides factual parameter comparisons. The data presented here is intended to empower engineers to evaluate components based on key performance indicators relevant to their specific application constraints. The CM600HA-28H is a single IGBT module configuration. For systems that require a dual-switch topology in a single package, the CM600DX-24T offers a different internal configuration while handling a comparable current rating. Evaluating the topology alongside electrical and thermal parameters is a critical step in the design process.

Core Specifications for Thermal and Electrical Design

The technical specifications of the CM600HA-28H are grounded in its datasheet, providing the necessary data for robust system modeling and simulation. Effective thermal management is crucial for reliability, a concept further explored in our guide on unlocking IGBT thermal performance. Below is a summary of the module's key parameters.

Absolute Maximum Ratings (Tj = 25°C)

Electrical and Thermal Characteristics (Tj = 25°C)

For a comprehensive list of specifications, please refer to the official CM600HA-28H datasheet.

Strategic Implications of Enhanced Thermal Reliability

The emphasis on thermal performance within the CM600HA-28H is not just about preventing overheating; it's a strategic design choice that impacts long-term value. A low thermal resistance (Rth) directly translates to a lower junction temperature under the same load conditions. This is critical in applications where power cycling is frequent, such as servo drives or solar inverters. What defines its thermal efficiency? A low junction-to-case thermal resistance of 0.042°C/W. This reduction in thermal stress mitigates wear-out mechanisms like solder fatigue and bond wire lift-off, contributing to a longer operational lifespan and reducing the total cost of ownership.

Deployment Focus: Where Thermal Stability is Paramount

The robust thermal architecture of the CM600HA-28H makes it particularly well-suited for deployments where consistent performance in challenging environments is required. In high-power welding supplies, the module's ability to efficiently dissipate heat during high-current pulses ensures weld quality and equipment longevity. Similarly, in uninterruptible power supplies (UPS) for data centers or medical facilities, its thermal stability guarantees that it can handle sustained full-load conditions during a power outage without derating, ensuring the integrity of critical operations.

A Closer Look at the Module's Thermal Architecture

The module's ability to effectively manage 4100 watts of power dissipation is fundamentally tied to its thermal resistance. The key parameter, Rth(j-c), or junction-to-case thermal resistance, dictates how efficiently heat generated at the silicon chip can be transferred to the module's baseplate. Think of thermal resistance as the narrowness of a drainage pipe. A lower Rth(j-c) value, like the 0.042 °C/W specified for the IGBT in this module, is analogous to a wider pipe, allowing a greater "flow" of heat to escape from the junction with less "pressure," or temperature rise. This efficiency is paramount, as it directly reduces the operating temperature of the IGBT chip, which is a primary factor in both performance and long-term reliability. Understanding these parameters is key, as detailed in this guide to decoding IGBT datasheets.

Application Arenas Benefiting from Thermal Headroom

The generous thermal headroom provided by the CM600HA-28H's design enables its use in a range of demanding high-power applications. Its specifications make it a strong candidate for systems where both electrical ruggedness and thermal stability are essential.

• AC Motor and Servo Drives: In industrial automation, the module can handle the high-current, dynamic loads required for precise motor control, while its efficient heat dissipation allows for more compact drive designs.
• Welding Power Supplies: The ability to sustain high peak currents and manage the resulting thermal load is critical for consistent performance in industrial welding equipment.
• Uninterruptible Power Supplies (UPS): Ensures reliable power delivery by maintaining stable operation under heavy, continuous loads during power grid failures. For high-power UPS systems where operational availability is the primary design driver, the CM600HA-28H's thermal endurance provides a significant design margin.
• Renewable Energy Inverters: In solar and wind power systems, the module facilitates efficient DC-AC conversion, with its wide operating temperature range ensuring reliability in outdoor or uncontrolled environments.

Frequently Asked Questions (FAQ)

What is the significance of the 1400V VCES rating on the CM600HA-28H?
The 1400V collector-emitter voltage (VCES) rating provides a substantial safety margin for systems operating on higher voltage buses, such as those found in certain industrial drives or renewable energy applications. It offers enhanced protection against voltage overshoots caused by stray inductances during high-speed switching, which is a common concern detailed in guides on IGBT failure analysis.

How does the low thermal resistance of the CM600HA-28H impact heatsink selection?
The low junction-to-case thermal resistance of 0.042 °C/W means that for a given amount of power loss, the internal temperature rise of the IGBT is minimized. This allows engineers to either use a smaller, more cost-effective heatsink to achieve a target operating temperature or to push more power through the module with an existing thermal solution, thereby increasing power density.

Can the CM600HA-28H be used in parallel, and what should be considered?
Yes, single IGBT modules like the CM600HA-28H are often used in parallel to achieve higher current ratings. For stable current sharing, it is critical to ensure symmetrical layout of the busbars to equalize stray inductances and to select modules with closely matched VCE(sat) and VGE(th) characteristics. A common practice is to derate the total current capability by 10-20% to ensure a safe operating margin.

To evaluate if the CM600HA-28H is the right fit for your system's power stage, contact our technical support team for further clarification or request a quote for your project.