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MITSUBISHI CM75TJ-24F IGBT Module

Mitsubishi CM75TJ-24F: 1200V/75A 7-in-1 PIM with CSTBT™ tech. Delivers high efficiency and integration to simplify design and cut system costs.

· Categories: IGBT Module
· Manufacturer: MITSUBISHI
· Price: US$
· Date Code: 2025+
. Available Qty: 84
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CM75TJ-24F Specification

Mitsubishi CM75TJ-24F | 1200V 75A Integrated 7-Pack IGBT Module (PIM)

The Mitsubishi CM75TJ-24F is a highly integrated Power Integrated Module (PIM) designed for robust and efficient power conversion. Engineered for applications demanding reliability and a compact footprint, this module consolidates a three-phase converter, brake chopper, and a three-phase inverter into a single, thermally efficient package. It represents a workhorse solution for engineers developing low-to-mid power motor drives, UPS systems, and general-purpose inverters.

Key Parameters at a Glance

This table provides a high-level overview of the CM75TJ-24F's critical electrical characteristics, essential for initial design and component selection.

ParameterValue
Collector-Emitter Voltage (VCES)1200V
Collector Current (IC)75A
Collector-Emitter Saturation Voltage (VCE(sat)) (Typ. @ IC=75A)2.2V
Module Configuration7-in-1 (Three-Phase Diode Bridge + Brake Chopper + Three-Phase Inverter)
Maximum Junction Temperature (Tj(max))150°C

For a comprehensive analysis of all operating parameters and characteristic curves, you can download the official CM75TJ-24F datasheet.

Technical Deep Dive: CSTBT™ and PIM Architecture

The performance of the CM75TJ-24F is rooted in two core Mitsubishi technologies: its advanced silicon and its intelligent module integration.

  • V-Series CSTBT™ (Carrier Stored Trench-gate Bipolar Transistor): This module utilizes Mitsubishi's advanced CSTBT™ silicon. Unlike standard trench IGBTs, this technology incorporates an additional carrier storage layer. This engineering feat allows for a significant reduction in the collector-emitter saturation voltage (VCE(sat)) without a proportional increase in switching losses. For the design engineer, this directly translates to lower conduction losses, reduced heat generation, and ultimately, higher overall system efficiency.
  • Integrated PIM Design: The 7-in-1 topology is a strategic advantage. By integrating the rectifier, brake, and inverter stages, the CM75TJ-24F drastically reduces PCB complexity and assembly costs compared to a discrete component design. This integration minimizes stray inductance between power stages, leading to lower voltage overshoots during switching, simplified gate drive design, and improved EMI performance.

Application Sweet Spots for the CM75TJ-24F

This module's feature set makes it an ideal choice for specific power conversion applications where reliability and power density are paramount.

  • Small to Medium AC Motor Drives: In Variable Frequency Drives (VFDs) up to approximately 30 kW, the CM75TJ-24F provides a complete power stage solution. The integrated brake chopper is particularly valuable for handling regenerative energy during motor deceleration, a common requirement in servo and elevator applications. For more details on this, explore how IGBTs are the heart of robotic servo drives.
  • Uninterruptible Power Supplies (UPS): The module's high reliability and compact form factor are perfect for online UPS systems. The PIM architecture simplifies manufacturing and enhances the thermal management of the power conversion block, contributing to a longer service life.
  • General-Purpose Inverters: For any application requiring a robust AC output from a DC or rectified AC source, such as welding power supplies or industrial heating, this module offers a standardized and proven power core, accelerating the development cycle.

Frequently Asked Engineering Questions (FAQ)

1. What are the key thermal management considerations for the CM75TJ-24F?

Due to its integrated nature, all heat-generating components (diodes and IGBTs) are concentrated in one package. Effective thermal management is critical. The focus should be on ensuring a low thermal resistance path from the module's baseplate to the ambient. This involves selecting an appropriately sized heatsink, ensuring a flat and clean mounting surface, and using a high-quality thermal interface material (TIM) applied with the correct pressure. Understanding the module's thermal resistance (Rth) is key to unlocking its full performance potential.

2. Is paralleling the CM75TJ-24F recommended for higher power?

No, this module is not designed for direct paralleling. The 7-in-1 PIM configuration is optimized for a specific power range. Attempting to parallel these complex modules can lead to severe current imbalances and catastrophic failure. For applications requiring higher power, it is necessary to select a larger discrete IGBT module with a higher current rating designed for parallel operation.

If you have specific questions about integrating the Mitsubishi CM75TJ-24F into your design, please don't hesitate to contact our technical team for expert guidance.

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