SC450R12E6 MACMIC 1200V 450A Sixpack IGBT Power Module

Content last revised on January 12, 2026

SC450R12E6: High-Efficiency 1200V Six-Pack IGBT Module for Demanding Power Applications

Engineered for Thermal Superiority and System Reliability

The SC450R12E6 is a high-performance 1200V, 450A six-pack IGBT module designed to meet the stringent demands of modern high-power conversion systems. This module provides a robust solution for engineers seeking to enhance efficiency and power density in applications like industrial motor drives and renewable energy inverters. It combines low conduction losses with exceptional thermal performance, directly addressing the critical challenge of thermal management in compact system designs. For high-frequency industrial drives where thermal margin is a primary design constraint, the SC450R12E6 offers a strategically optimized balance of performance and reliability.

Application Scenarios & Value

Achieving System-Level Benefits in High-Power Converters

This module is engineered for applications where thermal performance and operational robustness are non-negotiable. Its primary value is demonstrated in systems requiring high power density and consistent output under demanding thermal loads.

• Industrial Motor Drives: In high-power Variable Frequency Drive (VFD) systems, the SC450R12E6's low thermal resistance is a critical asset. Consider an engineer designing a 200 kW VFD for a critical manufacturing process. The module's excellent heat dissipation capability (Rth(j-c) of 0.05 K/W) allows for a smaller, more cost-effective heatsink, reducing the overall system footprint while maintaining a safe operating temperature for the semiconductor junctions. This ensures long-term reliability and prevents nuisance trips caused by overheating.
• Solar and Wind Inverters: For utility-scale renewable energy inverters, maximizing efficiency is paramount. The module's low collector-emitter saturation voltage (VCE(sat)) of 1.70V minimizes conduction losses, directly increasing the amount of energy delivered to the grid. This characteristic is vital for improving the levelized cost of energy (LCOE) over the system's lifetime.
• Uninterruptible Power Supplies (UPS): In data centers and industrial UPS applications, reliability is the primary driver. The module’s robust design ensures stable power conversion, safeguarding critical loads from grid disturbances.

While the SC450R12E6 is optimized for 450A applications, for systems requiring even higher current handling within a similar voltage class, the CM600DX-24T provides an increased current rating for scaling power output.

Key Parameter Overview

Decoding the Specs for Enhanced Thermal Reliability

The technical specifications of the SC450R12E6 are foundational to its performance in high-stress environments. The parameters below have been selected to highlight the module's suitability for high-efficiency and thermally demanding applications. The extremely low thermal resistance from junction to case is a defining feature, directly impacting system-level thermal design and long-term reliability.

Technical Deep Dive

A Closer Look at the Chip Technology and its Impact on Performance

The performance of the SC450R12E6 is rooted in its advanced semiconductor technology, specifically the use of TRENCHSTOP™ IGBT3 technology. This chip design creates a fine balance between low conduction losses (VCE(sat)) and switching losses (E_on/E_off). The low VCE(sat) of 1.70V acts like a significantly lower "electrical friction" for the current, meaning less power is wasted as heat when the device is fully turned on. This is a primary contributor to the module's high energy efficiency.

Furthermore, the module’s thermal architecture is critical. The exceptional junction-to-case thermal resistance (R_thJC) of 0.05 K/W can be visualized as an extremely wide pipeline for heat. It allows thermal energy generated within the silicon chip to be transferred to the heatsink with minimal obstruction. This efficient heat evacuation is essential for maintaining a lower operating junction temperature, which is a key factor in improving the module's lifetime and reliability, especially under cyclic loading conditions typical in motor drive applications.

Frequently Asked Questions

How does the low Rth(j-c) of 0.05 K/W directly impact heatsink selection and overall system power density?
A lower thermal resistance means heat is transferred more efficiently from the IGBT junction to the case. This allows engineers to either use a smaller, less expensive heatsink for the same power dissipation or to push more power through the module while staying within safe temperature limits. The direct result is a more compact and cost-effective system design with higher power density.

What is the primary benefit of the module's 1.70V VCE(sat) in a motor drive application?
The primary benefit is reduced conduction losses. In a motor drive, the IGBTs are conducting current for significant portions of the operating cycle. A lower VCE(sat) directly reduces the power dissipated as heat during these periods (P_loss = VCE(sat) * I_C). This leads to higher overall inverter efficiency, less waste heat to manage, and lower operational energy costs.

Is the SC450R12E6 suitable for high-frequency switching applications?
The SC450R12E6 is based on TRENCHSTOP™ IGBT3 technology, which is optimized for a balance between conduction and switching losses, making it well-suited for applications with moderate switching frequencies, typically found in industrial motor drives (e.g., 2-8 kHz). For applications requiring significantly higher frequencies, a thorough analysis of switching losses (E_ts) is necessary to ensure the thermal management system can handle the increased dissipation.

Strategic Advantage in System Design

Integrating the SC450R12E6 into a power system provides a strategic path toward achieving higher performance and reliability benchmarks. Its thermally efficient design enables engineers to build more compact and robust power conversion platforms. This capability is critical in a competitive landscape where reducing system size, weight, and total cost of ownership are key differentiators. By providing more thermal headroom, the module allows for designs that are more resilient to unexpected load conditions and harsh environmental temperatures, underpinning the long-term dependability required in industrial and renewable energy infrastructure. For other components that facilitate robust power design, explore related drivers such as the SKHI 24 R or alternative power modules like the FS450R17KE3 for higher voltage applications.