Semikron SKiiP 26AC12T4V1 | Integrated CIB Power Module for Advanced Motor Drives
The Semikron SKiiP 26AC12T4V1 is not just another IGBT module; it is a highly integrated power system engineered for designers who prioritize efficiency, reliability, and a reduced system footprint. As a CIB (Converter-Inverter-Brake) Power Integrated Module (PIM), it consolidates the entire power stage of a low-to-mid-power drive into a single, robust component. Leveraging Semikron-Danfoss's renowned SKiiP technology, this module is an intelligent solution for sophisticated power conversion challenges.
- Complete System Integration: Features a three-phase input rectifier, a brake chopper, and a three-phase output inverter in one compact SKiiP 2 package, drastically simplifying design and assembly.
- Advanced Chip Technology: Utilizes 1200V Trench 4 Field-Stop IGBTs and CAL (Controlled Axial Lifetime) freewheeling diodes for optimized switching performance and low conduction losses.
- Integrated Intelligence: Comes equipped with built-in current sensors for the inverter phases and an NTC temperature sensor, providing precise feedback for control loops and thermal protection without external components.
- Unmatched Reliability: Built on Semikron's industry-proven Semikron SKiiP® Technology, which employs solder-free pressure contacts, eliminating a common failure point and enhancing thermal cycling capability.
Engineering Excellence: A Technical Deep Dive
The true value of the SKiiP 26AC12T4V1 lies in its underlying engineering philosophy. Two core features set it apart from conventional solutions and deliver tangible benefits to the design engineer.
First, the **SKiiP pressure contact technology** is a fundamental departure from traditional soldered modules. By eliminating solder layers between the DCB substrate and the baseplate, the module achieves a lower thermal resistance and vastly superior reliability under thermal stress. For applications with frequent load changes, this translates directly to a longer operational lifetime and predictable performance. It mitigates the risk of solder fatigue and delamination, a critical concern in high-uptime industrial environments.
Second, the **integration of current and temperature sensors** directly onto the substrate is a masterstroke of design efficiency. This provides a much tighter and faster feedback loop for the control system compared to using external, board-mounted sensors. The result is more accurate current control for superior motor performance and immediate, localized thermal feedback. This preempts catastrophic failures, a key aspect of robust IGBT failure analysis and prevention, while also reducing the bill of materials (BOM), shrinking PCB size, and simplifying the assembly process.
Optimized Performance in Demanding Applications
The unique feature set of the Semikron SKiiP 26AC12T4V1 makes it the ideal power core for several key applications:
- Compact Variable Frequency Drives (VFDs): In applications like conveyor belts, pumps, and fans up to 7.5 kW, the CIB topology allows for an incredibly dense VFD design. The high level of integration minimizes internal wiring and external components, saving valuable cabinet space.
- High-Precision Servo Drives: The fast and accurate feedback from the integrated current sensors enables the precise torque and speed control necessary for robotics, CNC machines, and automated manufacturing systems. Learn more about the crucial role of IGBTs in robotic servo drives.
- Uninterruptible Power Supplies (UPS): The module's rectifier and inverter stages are perfectly suited for online UPS topologies, while the brake chopper provides an efficient way to manage energy from the DC link during specific operational modes.
SKiiP 26AC12T4V1 Key Technical Specifications
This table offers a quick overview of the module's core electrical characteristics for initial design assessment.
| Parameter | Value |
|---|---|
| Collector-Emitter Voltage (V_CES) | 1200 V |
| Continuous DC Collector Current, Inverter (I_C @ Tc=25°C) | 40 A |
| Nominal Chip Current, Inverter (I_Cnom) | 25 A |
| Output Power, Rectifier (P_out @ Th=80°C) | 14.1 kW |
| Collector-Emitter Saturation Voltage (V_CE(sat), Typ. @ I_Cnom) | 1.9 V |
| Topology | CIB (Converter-Inverter-Brake) |
| Integrated Features | Current Sensor, NTC Temperature Sensor |
For a complete and detailed overview, please download the official SKiiP 26AC12T4V1 datasheet.
Engineer's FAQ for the SKiiP 26AC12T4V1
1. How does the pressure contact system affect the mounting process?
The pressure contact system requires a specific, uniform mounting pressure to ensure optimal electrical and thermal contact. It is essential to use the specified mounting clamps and a high-quality Thermal Interface Material (TIM). While this differs from screw-terminal modules, the benefit is significantly enhanced thermal performance and mechanical robustness, eliminating torque-related installation errors and solder joint failures.
2. Is this module suitable for paralleling to achieve higher current output?
No, the SKiiP 26AC12T4V1 is designed as a self-contained system solution and is not recommended for direct paralleling. The integrated nature of the rectifier, brake, and inverter circuits, along with the internal current sensors, makes load sharing complex and impractical. For applications requiring higher power, it is better to select a larger discrete IGBT module specifically engineered for IGBT Paralleling. For help selecting the right module for your high-power design, please contact our technical team.
