SKIIP 26NAB065V1: 600V CIB IPM for High-Reliability Industrial Drives
Content last revised on October 10, 2025.
Engineering a New Standard for Drivetrain Reliability
The SKIIP 26NAB065V1 from Semikron is an advanced Intelligent Power Module (IPM) designed to maximize long-term reliability and simplify thermal management in compact industrial motor drives. Featuring a highly integrated Converter-Inverter-Brake (CIB) topology, this module delivers robust performance with key specifications of 600V (VCES) and a nominal current of 50A (ICnom). Its core advantages are derived from a baseplate-less design and highly reliable spring contacts, which eliminate a primary failure mode seen in conventional soldered modules. This design directly addresses the engineering challenge of ensuring operational longevity in applications with frequent thermal and power cycling. For industrial drives below 20 kW that demand superior power cycling capability, the SKIIP 26NAB065V1's spring-contact construction offers a definitive advantage in system robustness.
Key Parameter Overview
Decoding the Specs for Enhanced Thermal Design
The technical specifications of the SKIIP 26NAB065V1 are tailored for efficient and reliable power conversion. The parameters below highlight the module's capabilities within its intended operational envelope. A key metric is the thermal resistance, Rth(j-c), which at 1.4 K/W per IGBT, dictates the efficiency of heat transfer from the semiconductor junction to the case. Think of this value as a measure of a highway's capacity for traffic; a lower number signifies a wider, more efficient path for heat to escape, simplifying heatsink design and enabling greater power density.
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Inverter & Brake Chopper IGBTs | |||
| Collector-Emitter Voltage | VCES | 600 | V |
| Continuous DC Collector Current (Tj = 175°C) | IC | 35 | A |
| Nominal Collector Current | ICnom | 50 | A |
| Collector-Emitter Saturation Voltage (IC = 50 A, Tj = 25°C) | VCE(sat) | 1.8 (typ.) / 2.2 (max.) | V |
| Thermal Resistance, Junction to Case (per IGBT) | Rth(j-c) | 1.4 | K/W |
| Rectifier Diodes | |||
| Repetitive Peak Reverse Voltage | VRRM | 1600 | V |
| Forward Current (Tcase = 80°C) | IFAV | 35 | A |
| Thermal Resistance, Junction to Case (per Diode) | Rth(j-c) | 1.8 | K/W |
| Module Characteristics | |||
| Insulation Test Voltage (RMS, 50 Hz, 1 min.) | Visol | 2500 | V |
| Operating Junction Temperature | Tj(op) | -40 to +150 | °C |
Download the SKIIP 26NAB065V1 datasheet for detailed specifications and performance curves.
Application Scenarios & Value
Achieving System-Level Benefits in Demanding Drive Applications
The SKIIP 26NAB065V1 is engineered for compact, high-performance power conversion systems where reliability and ease of assembly are paramount. What is the primary benefit of its spring-contact design? Enhanced long-term reliability by eliminating solder fatigue. This makes it an excellent fit for applications subject to harsh operational cycles.
- Variable Frequency Drives (VFDs): In VFDs controlling conveyor belts, pumps, and fans, the module's integrated CIB configuration simplifies the power stage design. Its ability to withstand high power cycling without solder degradation translates directly to longer service life and reduced maintenance, a crucial factor in calculating the total cost of ownership (TCO) for industrial automation equipment.
- Servo Drives: The module's Ultrafast NPT IGBTs and robust CAL freewheeling diodes ensure efficient and precise control in robotic and CNC servo drive systems. The low-profile, baseplate-less package allows for compact drive designs essential in multi-axis machinery.
- General Purpose Inverters & UPS Systems: The all-in-one nature of the module, combined with its simple, single-screw mounting mechanism, significantly reduces assembly time and complexity, making it ideal for cost-sensitive applications like uninterruptible power supplies (UPS).
While the SKIIP 26NAB065V1 is optimized for 600V systems, for applications requiring higher voltage blocking capabilities, such as those in the 480V to 690V industrial range, a related module like the SKiiP 35NAB126V1 provides a 1200V rating for increased design margin.
Frequently Asked Questions (FAQ)
How do the spring contacts in the SKIIP 26NAB065V1 improve reliability over traditional solder connections?
Spring-loaded contacts create a pressure-based electrical connection that is inherently resilient to the mechanical stresses of thermal cycling. Unlike solder joints, which can become brittle and crack over thousands of temperature swings, the spring contacts maintain consistent pressure and conductivity. This effectively eliminates a common failure mechanism in power modules, leading to a significant increase in operational lifetime, especially in applications with frequent start-stop cycles or fluctuating loads.
What is the purpose of the integrated brake chopper in this CIB module?
The integrated brake chopper is a critical feature for motor drive applications that involve deceleration or overhauling loads. When a motor is slowed down, it acts as a generator, feeding energy back into the DC bus. The brake chopper manages this regenerative energy by switching it into an external braking resistor, dissipating it as heat. This prevents the DC bus voltage from rising to dangerous levels that could damage the inverter or other components, ensuring safe and controlled operation during dynamic braking scenarios.
Technical Deep Dive
A Closer Look at Pressure Contact Technology for Long-Term Reliability
The defining feature of the MiniSKiiP® family, including the SKIIP 26NAB065V1, is its reliance on SKiiP® Technology, which utilizes pressure and spring contacts instead of soldered connections for both the power terminals and the gate drive PCB. This is a fundamental shift in module design philosophy, moving away from a rigid, bonded structure to a flexible, mechanically compliant one. To understand the advantage, consider the analogy of a bridge: a soldered connection is like a rigid concrete bridge that can crack under the repeated stress of expansion and contraction. In contrast, a pressure contact system is like a suspension bridge, designed to flex and move with environmental changes while maintaining a robust and unbroken connection.
This design provides two decisive engineering benefits. First, it dramatically enhances the module's power cycling capability. By eliminating solder fatigue, the module can endure a far greater number of active thermal cycles before failure. Second, it simplifies the assembly process. The entire module, along with the driver board, can be mounted to a heatsink with a single screw, ensuring even pressure distribution and a reliable thermal and electrical interface without the need for complex soldering or pressing equipment. This accelerates manufacturing and improves field serviceability, contributing to a more efficient and robust end product.
