Infineon TD180N16KOF 5DN IGBT Module

TD180N16KOF 5DN Datasheet | 1600V Thyristor/Diode Module

Engineered for exceptional operational lifespan, the Infineon TD180N16KOF 5DN Thyristor/Diode Module leverages a solder-free design to master thermal stress. With core specifications of 1600V | 180A | Pressure Contact Technology, this module provides superior thermal cycling capability and enhanced system robustness. Its design directly addresses the primary failure mode in conventional modules—solder fatigue—by creating a more resilient thermal and mechanical interface. This approach ensures consistent performance in demanding industrial power conversion systems where long-term reliability is a fundamental design requirement.

Applications Built for Enduring High-Power Conversion

The robust construction of the TD180N16KOF 5DN makes it a preferred component for power systems where uptime and minimal maintenance are critical economic drivers. Its inherent resilience against thermal and mechanical stress ensures predictable performance over an extended operational life. For systems operating on 400V to 690V AC lines, the module's 1600V rating provides a substantial safety margin, making it the optimal choice for applications requiring high reliability under fluctuating grid conditions.

• Industrial Motor Drives: Serves as a reliable input rectifier stage for high-power AC drives and DC motor controllers, ensuring stable DC-link voltage.
• Power Supply Systems: Ideal for the rectifier front-end of large-scale Uninterruptible Power Supplies (UPS) and industrial power converters.
• Soft Starters: Provides controlled voltage ramping for large induction motors, mitigating mechanical shock and electrical inrush currents.
• Renewable Energy: Functions effectively in grid-tied inverters and energy storage systems that require robust and efficient power rectification.

Core Specifications for Thermal and Electrical Stability

The technical parameters of the TD180N16KOF 5DN are centered on delivering stable performance under sustained thermal and electrical loads. The selection below highlights the key metrics that enable its long-term reliability in high-power applications. A comprehensive list of specifications can be found in the official product datasheet.

Download the complete TD180N16KOF 5DN Datasheet

Interpreting Key Parameters for System Design

• Repetitive Peak Off-state Voltage (VDRM/VRRM): A 1600V rating provides a significant safety buffer for applications connected to 690V AC mains, enhancing the system's ability to withstand voltage transients without degradation. This high blocking voltage is a cornerstone of its robust design.
• Thermal Resistance, Junction to Case (RthJC): This value represents the efficiency of heat transfer from the semiconductor chip to the module's case. The low 0.12 K/W value signifies excellent heat dissipation. Think of it like a wide-diameter pipe for heat flow; a lower thermal resistance allows more thermal energy to escape quickly, keeping the critical junction temperature lower and extending the device's lifespan.

A Strategic Advantage in Total Cost of Ownership

In the landscape of industrial automation and large-scale power infrastructure, component selection extends beyond initial procurement costs. The TD180N16KOF 5DN is designed with a focus on reducing the total cost of ownership (TCO). Its enhanced reliability, stemming directly from its pressure contact technology, translates into fewer service intervals, reduced downtime, and greater operational predictability. This aligns with the strategic industry push toward "fit-and-forget" components that bolster the financial viability and uptime of critical systems, from factory floors to utility-scale power installations. For a deeper understanding of module construction, see this guide on IGBT module structure.

A Technical Foundation of Solder-Free Reliability

At the core of the TD180N16KOF 5DN's durability is its use of Infineon's proven Pressure Contact Technology. What is the main benefit of this pressure-contact design? It delivers superior resistance to thermal cycling fatigue by eliminating solder layers. Conventional soldered modules can develop micro-cracks in the solder joints over thousands of heating and cooling cycles, eventually leading to increased thermal resistance and catastrophic failure. This module circumvents that entire failure mechanism. The semiconductor elements are pressed onto the baseplate with a precisely calibrated force, ensuring a stable and void-free thermal path throughout the module's life.

This mechanical integrity is complemented by an Aluminium Nitride (AlN) ceramic DCB substrate, which offers high thermal conductivity. The AlN substrate acts as an efficient bridge, rapidly conducting heat away from the silicon chip to the copper baseplate. This combination of a robust mechanical interface and superior thermal materials results in a module that maintains its performance characteristics even after extensive use in cyclical applications like motor soft-starters or industrial process controllers.

Data for Engineering and System Evaluation

When evaluating power modules, it is essential to consider parameters that directly impact long-term performance. The TD180N16KOF 5DN distinguishes itself from conventional soldered modules primarily through its vastly improved power cycling capability. While a datasheet provides electrical and thermal limits, the underlying construction technology dictates how well the device will endure real-world operational stresses. For systems where frequent on/off cycles or fluctuating loads are standard, a module with Pressure Contact Technology provides a more predictable and reliable performance curve over many years of service. For systems that require a different configuration, the TT162N16KOF provides a dual-thyristor topology within the same voltage class for AC controller and related applications. Always consult the full datasheet to ensure all design parameters are met.

Designing for the Future: A Focus on System Longevity

Selecting the TD180N16KOF 5DN is a strategic decision that prioritizes long-term system integrity and operational continuity. By engineering out one of the most common points of failure in power modules, this component provides a foundation for building power conversion systems that are not only powerful and efficient but also exceptionally durable. This forward-looking approach to component selection ensures that today's advanced industrial systems are equipped to meet the uptime and reliability expectations of tomorrow.