Mitsubishi CM1000E4C-66R

Mitsubishi CM1000E4C-66R: 3300V/1000A IGBT for megawatt systems. Low-loss CSTBT™ and AlN substrate ensure maximum efficiency, power density, and operational life.

· Categories: IGBT
· Manufacturer: Mitsubishi
· Price: US$
· Date Code: 2016+
. Available Qty: 71
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CM1000E4C-66R Specification

Mitsubishi CM1000E4C-66R | High-Reliability 3300V IGBT for Megawatt-Scale Power Conversion

The Mitsubishi CM1000E4C-66R is not just a high-power switch; it is a foundational component engineered for the demanding world of megawatt-class power electronics. Designed specifically for applications where reliability and efficiency are non-negotiable, this 3300V / 1000A single IGBT module provides the robustness required to manage substantial energy flow in industrial and renewable energy systems. For design engineers developing next-generation inverters and converters, the CM1000E4C-66R offers a clear path to higher power density and extended operational life.

Engineered for Performance and Longevity

At the core of the CM1000E4C-66R's superior performance lies Mitsubishi's advanced chip and packaging technology. This module is built to solve critical engineering challenges in high-voltage systems:

  • Exceptional Efficiency: Leveraging Mitsubishi's 7th Generation CSTBT™ (Carrier Stored Trench-Gate Bipolar Transistor) technology, the module achieves an impressively low on-state voltage (VCE(sat)). This directly translates to reduced conduction losses, minimizing waste heat and improving overall system efficiency.
  • Superior Thermal Management: The module incorporates an Aluminum Nitride (AlN) ceramic substrate, which offers significantly lower thermal resistance compared to standard Alumina (Al2O3). This ensures more effective heat transfer from the IGBT chip to the heatsink, keeping junction temperatures lower and enhancing both reliability and power cycling capability.
  • Robust Mechanical Design: Built for long-term stability, the module's internal structure is optimized to withstand the mechanical stresses induced by thermal cycling, a common failure point in high-power applications with fluctuating loads.

Technical Deep Dive: Where Technology Creates Value

The CM1000E4C-66R is a prime example of how targeted silicon technology delivers tangible system-level benefits. The 7th Gen CSTBT™ chip is engineered to optimize the trade-off between conduction and switching losses. In high-voltage, medium-frequency applications, this balance is critical. By maintaining a low VCE(sat) while ensuring controlled switching characteristics, the module allows designers to push for higher power output without compromising on the thermal design or requiring oversized cooling systems.

Furthermore, the inclusion of an integrated soft-recovery freewheeling diode (FWD) is crucial. The diode is co-packed and optimized to work in harmony with the IGBT, featuring low reverse recovery losses (E_rr). This minimizes voltage overshoots during IGBT turn-on, simplifying the design of snubber circuits and improving the system's electromagnetic compatibility (EMC) profile.

Key Application Arenas

The unique combination of high voltage, high current, and robust thermal performance makes the Mitsubishi CM1000E4C-66R an ideal choice for several critical applications:

  • Medium-Voltage Drives (MVDs): In large industrial motor drives, the 3300V blocking voltage simplifies the inverter topology, often reducing the need for series-connected devices. This leads to a lower component count, reduced complexity, and a significant increase in overall system reliability.
  • Wind Power Converters: Wind turbines experience highly variable power generation. The CM1000E4C-66R's excellent power cycling capability ensures it can withstand these fluctuating load profiles, providing the long operational life required for wind-to-grid power conversion and minimizing costly maintenance cycles.
  • Grid-Scale Energy Systems: For large-scale solar inverters and battery energy storage systems (BESS), efficiency is paramount. The low losses of this IGBT module maximize the energy delivered to the grid and reduce the operational cost of the entire installation.

Key Technical Specifications

For a detailed analysis, please download the official CM1000E4C-66R datasheet. The table below provides a quick overview of its core parameters.

Parameter Value
Collector-Emitter Voltage (V_CES) 3300 V
Collector Current (I_C) @ Tc=80°C 1000 A
Collector-Emitter Saturation Voltage (V_CE(sat)) (Typ. @ 1000A) 3.0 V
Operating Junction Temperature (T_j(op)) -40 to +150 °C
Thermal Resistance (R_th(j-c)) IGBT 0.013 °C/W
Package Type Standard High Power Module

Frequently Asked Questions (FAQ) for Design Engineers

Q: What are the primary considerations for the gate drive design when using the CM1000E4C-66R?
A: A robust gate drive is critical for this high-power module. Key considerations include: 1) High peak gate current capability (typically >10A) for fast and effective switching. 2) Utilizing a negative gate voltage (e.g., -15V) during the off-state to ensure high immunity against dv/dt induced turn-on. 3) Making full use of the auxiliary Kelvin emitter connection to bypass stray inductance in the main emitter path, which ensures cleaner gate signals and more reliable switching. For more insights, explore these practical tips for robust gate drive design.

Q: Can these modules be paralleled for applications requiring more than 1000A?
A: Yes, the Mitsubishi CM1000E4C-66R is designed to support paralleling. However, successful implementation requires careful engineering. This includes ensuring a symmetrical busbar layout for equal stray inductances, providing individual gate driver circuits for each module, and considering thermal coupling to maintain balanced current sharing across all devices. Mismatches can lead to thermal runaway in one module, so careful design and testing are essential.

For detailed application support or to discuss how the CM1000E4C-66R can elevate your next high-power project, please contact our technical team.

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