Infineon FS100R12KT4G_B11 | 1200V IGBT for Solder-less, High-Reliability Power Conversion
The Infineon FS100R12KT4G_B11 is a 1200V, 100A four-pack IGBT module engineered for demanding industrial applications. Housed in the industry-proven EconoPACK™ 3 package, this module combines robust TRENCHSTOP™ IGBT4 technology with innovative PressFIT mounting pins, delivering an optimal blend of electrical performance, manufacturing efficiency, and long-term operational reliability. It is a strategic component for developing compact, efficient, and durable power conversion systems.
- Four-Pack (H-Bridge) Configuration: Ideal for DC/DC converters, solar inverters, and four-quadrant DC motor drives.
- TRENCHSTOP™ IGBT4 Technology: Provides a well-balanced performance profile with low conduction losses (VCE(sat)) and optimized switching characteristics for medium-frequency applications.
- PressFIT Mounting Technology: Enables solder-free assembly, significantly reducing production time and eliminating solder-joint fatigue for superior reliability in harsh industrial environments.
- 1200V Collector-Emitter Voltage: Ensures substantial voltage headroom for applications connected to high-voltage DC buses.
- Integrated NTC Thermistor: Allows for precise, real-time temperature monitoring, enabling effective thermal management and system protection.
Technical Deep Dive
Engineered for Reliability: TRENCHSTOP™ IGBT4 and PressFIT Technology
At the core of the FS100R12KT4G_B11 lies Infineon's TRENCHSTOP™ IGBT4 technology. This generation of IGBTs represents a significant engineering achievement, providing a low collector-emitter saturation voltage (VCE(sat)) which directly translates to lower conduction losses during operation. This efficiency is critical for minimizing heat dissipation and improving the overall thermal performance of the end system. While newer technologies may offer lower switching losses, IGBT4 provides a highly robust and cost-effective solution for applications operating in the typical frequency range of motor drives and solar inverters. For a broader understanding of how different IGBT technologies compare, see our guide to power semiconductor selection.
The standout feature of the _B11 variant is its PressFIT connection technology. Instead of traditional soldering, the module’s control pins are pressed into the PCB, forming a highly reliable, gas-tight cold-welded connection. This automated-assembly-friendly process not only accelerates manufacturing but also enhances system longevity by eliminating a common point of failure—the solder joint. This is particularly advantageous in applications subject to frequent thermal cycling and mechanical vibration, such as commercial vehicles and industrial drives.
Application Scenarios and Value Proposition
Optimized for Industrial Power Systems
The unique H-bridge topology and robust feature set of the Infineon FS100R12KT4G_B11 make it an exemplary choice for several key applications:
- Solar Inverters: The four-pack configuration is perfectly suited for building the full-bridge DC-AC inverter stage in string solar inverters. The module's high efficiency ensures maximum energy harvest, while the PressFIT pins and integrated NTC contribute to the high reliability and long operational life required in renewable energy systems. For higher power solar applications, a module like the FS150R12KT4 offers a seamless upgrade path.
- Uninterruptible Power Supplies (UPS): In UPS systems, reliability is non-negotiable. The FS100R12KT4G_B11's robust IGBT4 chips can handle demanding load conditions, and the solder-free PressFIT connections provide a level of dependability that is crucial for mission-critical power backup.
- Motor Drives and Servo Control: This module is an excellent fit for four-quadrant DC motor drives and specialized AC motor control systems. The fast and soft reverse recovery of the integrated freewheeling diodes minimizes voltage overshoots, and the low conduction losses help manage thermal loads in compact drive designs. This level of control is essential in applications like powering precision in robotic servo drives.
Key Parameter Overview
| Parameter | Value |
|---|---|
| Collector-Emitter Voltage (VCES) | 1200 V |
| Continuous Collector Current (IC @ Tc=100°C) | 100 A |
| Collector-Emitter Saturation Voltage (VCE(sat) typ. @ 100A, 150°C) | 2.05 V |
| Configuration | Four-Pack (H-Bridge) |
| Technology | TRENCHSTOP™ IGBT4 |
| Package | EconoPACK™ 3 with PressFIT pins |
| Maximum Junction Temperature (Tvj max) | 175°C |
For complete technical specifications, you can Download the Datasheet.
Frequently Asked Questions (FAQ)
What are the primary advantages of the PressFIT pins in the FS100R12KT4G_B11?
The PressFIT pins offer two main benefits over traditional soldering. First, they enhance manufacturing efficiency by enabling a faster, solder-free assembly process, which can be fully automated. Second, they improve long-term reliability by creating a gas-tight, cold-welded connection that is immune to the thermal and mechanical stresses that cause solder joints to degrade and fail over time. This results in a more robust and durable end product.
How does the FS100R12KT4G_B11 with IGBT4 compare to a newer module with IGBT7 technology?
The FS100R12KT4G_B11 is built on the highly reliable and cost-effective TRENCHSTOP™ IGBT4 platform, which is optimized for low conduction losses and robustness in applications with moderate switching frequencies (e.g., up to ~20 kHz). Newer modules featuring Infineon TRENCHSTOP™ IGBT7 technology are designed for even lower on-state voltage and higher power density. While IGBT7 offers superior performance for designs pushing the limits of power density, the FS100R12KT4G_B11 remains an excellent, field-proven choice for a wide range of industrial applications where reliability, ease of manufacturing, and value are the primary design drivers.
