Infineon FS820R08A6P2LB | Engineering the Future of High-Performance EV Inverters
The Infineon FS820R08A6P2LB is not just an IGBT module; it's a foundational component engineered specifically to meet the extreme demands of modern automotive traction inverters. As a flagship product in the HybridPACK™ Drive family, it combines cutting-edge semiconductor technology with an innovative package design to deliver unparalleled power density, efficiency, and reliability for the next generation of electric vehicles (EVs).
Core Advantages at a Glance
- Automotive-Grade Reliability: Designed and qualified for the harsh operating conditions of EV powertrains, ensuring long-term performance and safety.
- Exceptional Power Density: Delivers a formidable 820A / 750V capacity within a compact, direct-cooled package, enabling smaller and lighter inverter designs.
- Optimized Switching Efficiency: Leverages Infineon's EDT2 IGBT technology to minimize both conduction and switching losses, directly contributing to increased vehicle range.
- Superior Thermal Management: Features a state-of-the-art Pin-Fin direct cooling baseplate for highly efficient heat dissipation, unlocking maximum power output.
Technical Deep-Dive: EDT2 and HybridPACK™ Drive Advantage
The performance of the Infineon FS820R08A6P2LB stems from two synergistic innovations: the EDT2 silicon and the HybridPACK™ Drive package. The EDT2 (Electric Drive Train) IGBT is a micro-pattern trench-field-stop technology meticulously optimized for the typical 8-10 kHz switching frequencies of an EV inverter. This results in an exceptionally low collector-emitter saturation voltage (VCE(sat)), which significantly reduces conduction losses during operation. The outcome for an engineer is tangible: less waste heat to manage and more battery energy converted into motive force.
This advanced silicon is housed in the revolutionary HybridPACK™ Drive package. Its defining feature is the Pin-Fin direct cooling baseplate, which creates a large surface area for direct fluid contact. This design dramatically lowers the junction-to-fluid thermal resistance compared to traditional flat baseplates. For system designers, this means the ability to extract more current from the module, operate at higher ambient temperatures, or build in a greater thermal safety margin, enhancing the powertrain's overall robustness. This superior cooling is critical for handling the peak power demands of rapid acceleration and the continuous stress of regenerative braking.
The Definitive Power Core for Next-Generation EV Powertrains
The primary application for the FS820R08A6P2LB is in high-performance EV inverters for passenger cars and light commercial vehicles. Its high efficiency is a key enabler for extending driving range, a critical factor for consumer adoption. Furthermore, the module's high power density allows automotive engineers to shrink the inverter's physical volume and weight, contributing to overall vehicle efficiency and freeing up valuable space. The robust electrical and thermal performance of the Infineon FS820R08A6P2LB makes it an ideal choice for demanding 400V systems and a future-proof solution for emerging 800V architectures that require exceptional power conversion capabilities.
Infineon FS820R08A6P2LB at a Glance
For a detailed technical breakdown, you can Download the Official Datasheet. The table below summarizes its key operational characteristics.
| Parameter | Value |
|---|---|
| Collector-Emitter Voltage (V_CES) | 750 V |
| Nominal Collector Current (I_C_nom) | 820 A |
| Collector-Emitter Saturation Voltage (V_CE_sat, Typ. at I_C_nom) | 1.35 V |
| Operating Junction Temperature (T_vj_op) | -40°C to 150°C (175°C overload) |
| Package | HybridPACK™ Drive |
| Technology | Infineon TRENCHSTOP™ IGBT7 EDT2 |
Engineering FAQ for the FS820R08A6P2LB
How does the direct cooling baseplate impact system design?
The Pin-Fin baseplate requires a specifically designed cooling system with liquid channels that interface directly with the module. While this differs from mounting to a simple cold plate, the benefit is a vastly superior thermal interface. This allows designers to either push the power output significantly higher for a given temperature or to reduce the size and cost of the overall cooling system while maintaining performance, a key trade-off in automotive design.
Is this module suitable for applications other than EV inverters?
Absolutely. While the FS820R08A6P2LB is optimized for EV traction drives, its core attributes of high power density, efficiency, and robust thermal performance make it an excellent choice for other demanding power conversion systems. This includes heavy-duty commercial vehicle drives, high-power solar inverters, and high-reliability industrial motor drives where performance and a compact footprint are critical design goals. For any high-current, liquid-cooled application, this family of IGBT modules should be a prime candidate for evaluation.
For detailed design-in support, application notes, or to discuss your specific project requirements, please contact our technical team.
