BSM15GD120DN2 Infineon 1200V 25A 3-Phase IGBT Module

Content last revised on February 9, 2026

An Engineer's Guide to the BSM15GD120DN2 3-Phase IGBT Module

Optimizing Low-Power Drives with a Balanced Performance Profile

The Infineon BSM15GD120DN2 is a 1200V IGBT power module, consolidating a full 3-phase inverter bridge into a single, thermally efficient ECONOPACK 2 package. With its core specifications of 1200V | 25A (at T_c=25°C) | Rth(j-c) ≤ 0.86 K/W, this module provides a robust foundation for power conversion systems. Key benefits include simplified assembly due to high integration and an optimized trade-off between conduction and switching losses. It directly addresses the engineering challenge of designing compact, reliable, and efficient inverter stages for low-power industrial applications. What is the primary benefit of its integrated 3-phase bridge design? It simplifies system assembly and reduces stray inductance for improved reliability.

Application Scenarios & Value

Enabling High-Reliability Designs in Compact Motor Control

For low-power motor drives up to ~5 kW requiring a compact and efficient 1200V inverter stage, this module is an optimal fit. The primary value of the BSM15GD120DN2 lies in its integrated 3-phase full-bridge topology. In applications like small conveyor systems, packaging machinery, and commercial HVAC fans, engineers face the challenge of fitting a complete Variable Frequency Drive (VFD) into a constrained space without compromising reliability. This module directly solves this by combining six IGBTs and six corresponding fast free-wheeling diodes in one component. This high level of integration dramatically reduces PCB complexity, component count, and, crucially, parasitic inductance associated with long traces between discrete components. The result is a cleaner switching waveform, reduced voltage overshoot, and enhanced system-level reliability.

The module's 1200V collector-emitter voltage rating provides the necessary safety margin for direct operation on 400V or 480V three-phase AC lines, which is a standard requirement for industrial equipment globally. While this module is ideal for applications requiring a continuous current of 15A at a case temperature of 80°C, for systems demanding lower power, the related BSM10GD120DN2 offers a similar feature set with a lower current rating. Conversely, for designs needing a step up in power handling, the BSM25GD120DN2 provides a higher current capability in a compatible footprint.

Key Parameter Overview

Decoding the Specs for Efficient Power Conversion

The performance of the BSM15GD120DN2 is defined by a balance between its static and dynamic characteristics. The parameters below are critical for calculating system efficiency, designing the thermal solution, and ensuring reliable operation under load. Highlighting these key metrics allows engineers to quickly assess the module's fit for their specific application.

Download the BSM15GD120DN2 datasheet for detailed specifications and performance curves.

Technical Deep Dive

Analyzing the Trade-off Between VCE(sat) and Switching Energy

A critical aspect of selecting an IGBT is understanding the inherent trade-off between conduction losses and switching losses. The BSM15GD120DN2 is engineered to provide a balanced performance suitable for applications operating in the low-to-mid frequency range (typically 5-20 kHz). Its typical VCE(sat) of 2.5V at 15A and 125°C dictates the power dissipated as heat during the 'on' state. Think of VCE(sat) as the 'toll' the current pays to pass through the switch; a lower toll means less energy wasted as heat. This moderate VCE(sat) ensures that in applications with long conduction periods, like a motor holding a steady load, thermal generation is manageable.

On the other hand, the module's dynamic characteristics, such as the typical 70 ns fall time (t_f), determine the energy lost during each switching event. Faster switching reduces the time the IGBT spends in the high-dissipation linear region, minimizing switching loss. For an application like a variable speed drive, where switching frequency directly impacts motor noise and efficiency, these defined switching times allow engineers to precisely model and predict overall system efficiency. The BSM15GD120DN2's design parameters suggest it is not aimed at ultra-high frequency applications, but rather optimized for maximum efficiency and reliability in the mainstream industrial drive market. For a deeper understanding of this balance, resources like the guide to mastering 1200V IGBTs can provide further context.

Industry Insights & Strategic Advantage

Meeting Efficiency Mandates in Industrial Automation

The deployment of the BSM15GD120DN2 aligns with the persistent industry trend towards greater energy efficiency in industrial automation. Global regulations and the rising cost of energy put constant pressure on designers of motor drives, pumps, and fans to reduce system-level power consumption. An integrated power module like this one offers a strategic advantage over discrete solutions. By co-packaging the IGBTs and fast recovery diodes, Infineon has optimized the internal layout to minimize the parasitic elements that cause ringing and increase switching losses. This optimization at the component level translates directly into higher inverter efficiency.

Furthermore, as industrial systems become more connected and complex, reliability and uptime are paramount. The use of a single, factory-tested module for the entire power stage reduces the number of potential failure points compared to a design using twelve separate discrete components. This inherent reliability, combined with predictable thermal and electrical performance, allows engineering teams to streamline their design validation process and accelerate time-to-market for new, more efficient generations of servo drives and industrial controllers.

Frequently Asked Questions (FAQ)

What is the significance of the 15A current rating at 80°C versus 25A at 25°C?
The 15A rating at a case temperature (T_c) of 80°C is the more realistic and critical specification for practical design. It represents the continuous current the module can handle under typical industrial operating conditions where the heatsink is significantly warmer than ambient. The 25A rating at 25°C is a maximum value under ideal, often unachievable, thermal conditions and is primarily used for comparison, not for final system design.

How does the integrated 3-phase bridge configuration impact my design process?
It simplifies the power stage layout significantly. Instead of routing high-current paths for twelve discrete components, you manage connections for one module. This reduces PCB design time, minimizes the risk of assembly errors, and lowers stray inductance, which helps control electromagnetic interference (EMI) and voltage overshoots during switching.

What does the R_thJC of ≤ 0.86 K/W mean for my thermal design?
This value represents the thermal resistance from the IGBT chip's junction to the module's case. A lower number is better, as it indicates more efficient heat transfer away from the active silicon. For a designer, this parameter is a direct input for calculating the required heatsink performance. For every watt of power dissipated by the IGBT, the junction temperature will rise by 0.86°C above the case temperature. This is a fundamental value for ensuring the junction temperature stays below the 150°C maximum limit.

Is the BSM15GD120DN2 suitable for high-frequency ( > 20 kHz) applications?
Based on its specified switching characteristics (e.g., t_d(off) of 400 ns typ), this module is optimized for low to moderate switching frequencies, typical of standard motor drives (up to ~16-20 kHz). While it can operate at higher frequencies, switching losses would increase substantially, requiring significant thermal derating. For applications demanding higher frequencies, a module with faster-switching IGBT technology would be a more suitable choice.

Design and Integration Strategy

The successful integration of the BSM15GD120DN2 hinges on a system-level approach that considers its electrical and thermal characteristics in unison. Given its architecture, the module is positioned as a cornerstone component for designers aiming to build cost-effective and reliable low-power inverters. The strategic value lies not just in the individual specifications but in how the complete package accelerates development and enhances the final product's performance profile. Leveraging its integrated nature allows engineering resources to shift focus from basic power stage layout to more value-added areas like control algorithms and system software, ultimately fostering innovation in the end application.