Infineon FS150R06KL4_B4 | High-Efficiency 600V Half-Bridge IGBT Module
The Infineon FS150R06KL4_B4 is a highly integrated and robust half-bridge IGBT module designed for demanding power conversion applications. Housed in the industry-proven EconoPACK™ 2 package, this module combines Infineon's reliable TRENCHSTOP™ IGBT4 technology with an anti-parallel diode to deliver a balanced, high-performance solution for engineers focused on efficiency, power density, and system reliability.
- Optimized Efficiency: Leverages TRENCHSTOP™ IGBT4 technology to achieve an excellent trade-off between low conduction losses (VCE(sat)) and minimal switching losses, improving overall system efficiency.
- Superior Reliability: Features PressFIT contact technology, eliminating the need for solder joints and drastically reducing the risk of failure due to thermal cycling fatigue.
- Integrated Thermal Sensing: An included NTC thermistor provides accurate, real-time temperature feedback, enabling robust thermal protection and management schemes.
- High Power Density: The compact EconoPACK™ 2 footprint allows for space-saving designs in power-dense applications like industrial motor drives and UPS systems.
Technical Deep Dive: Engineering Advantage in Detail
The performance of the Infineon FS150R06KL4_B4 is rooted in its core technologies. Understanding these provides a clear picture of its value in a power electronics system.
First, the TRENCHSTOP™ IGBT4 chip is the heart of the module. Unlike earlier planar technologies, this trench-gate, field-stop structure is engineered for medium-frequency hard-switching topologies (typically 5 kHz to 20 kHz). It provides a low saturation voltage (VCE(sat)) to minimize power loss during the on-state, which is critical in motor control applications. Simultaneously, it maintains controlled switching characteristics to manage EMI and reduce turn-on/turn-off losses. This balance is key to achieving high efficiency without complicating gate drive design.
Second, the module utilizes EconoPACK™ packaging with PressFIT technology. This solderless mounting solution is a significant advantage from a manufacturing and reliability standpoint. The compliant pins form a high-pressure, gas-tight cold-welded connection with the PCB. This eliminates solder voids and cracks, which are common failure points in power modules subjected to repeated temperature changes. For system builders, this means faster, more repeatable assembly processes and a longer operational lifespan for the end product.
Application Scenarios & Value Proposition
The specific characteristics of the FS150R06KL4_B4 make it an ideal choice for several high-power applications:
- Industrial Motor Drives: In Variable Frequency Drives (VFDs), efficiency is directly tied to operating cost. The low total power losses of this module reduce the heat generated, potentially allowing for smaller heatsinks and more compact cabinet designs. Its robust Safe Operating Area (SOA) ensures reliable operation under the variable load and torque conditions typical of industrial machinery.
- Uninterruptible Power Supplies (UPS): For commercial and industrial UPS systems, reliability and efficiency are non-negotiable. The module's high-performance diodes ensure efficient handling of freewheeling currents, while the overall low-loss profile helps maximize battery runtime during a power outage and reduces cooling costs during normal operation.
- Welding & Power Conversion: In high-current applications like welding power supplies, the module's 150A rating and excellent thermal performance provide the necessary headroom and durability to withstand demanding, cyclical loads.
Key Parameters Overview
The following table highlights the critical specifications for the Infineon FS150R06KL4_B4. For comprehensive data, including characteristic curves and thermal information, please download the full datasheet.
| Parameter | Value |
|---|---|
| Collector-Emitter Voltage (VCES) | 600 V |
| Nominal Collector Current (IC nom) | 150 A |
| Collector-Emitter Saturation Voltage (VCE(sat), Tj=125°C, IC=150A) | 1.75 V (Typ.) |
| Total Power Dissipation (Ptot, TC=25°C) | 535 W |
| Maximum Junction Temperature (Tvj max) | 175°C (briefly), 150°C (operational) |
| Module Configuration | Half-Bridge (Two IGBTs) |
Frequently Asked Questions (FAQ)
What is the primary advantage of the EconoPACK™ 2 package with PressFIT contacts?
The primary advantage is enhanced long-term reliability. By eliminating solder, PressFIT technology removes a major failure mechanism in power electronics: solder joint fatigue from thermal cycling. This leads to a longer service life, especially in applications with frequent on/off cycles or fluctuating loads. Additionally, it streamlines the manufacturing process, making it faster and more cost-effective.
How does the FS150R06KL4_B4 compare to newer IGBT7 modules for a motor drive application?
While newer generations like IGBT7 offer further reductions in VCE(sat), the IGBT4 technology in the FS150R06KL4_B4 represents a mature, highly reliable, and cost-effective solution. For mainstream industrial drives operating in the 5-20 kHz range, this module provides an exceptional balance of performance and price. It is a proven workhorse, ideal for designs where reliability and value are the primary drivers over achieving the absolute lowest possible switching losses. For expert advice on selecting the right IGBT modules for your specific design, please contact our technical team.
