Content last revised on June 28, 2026
SKiiP 28AN16V2 Semikron MiniSKiiP 1600V CIB IGBT Module
The SKiiP 28AN16V2, a core component of the Semikron MiniSKiiP family, represents a sophisticated Converter-Inverter-Brake (CIB) topology designed for high-performance industrial motor control. By integrating a three-phase bridge rectifier, a brake chopper, and a three-phase inverter into a single MiniSKiiP 2 package, it provides a high power density solution. This module utilizes Solderless Pressure Contact (SPR) technology, which eliminates traditional solder joints between the power semiconductor and the PCB, significantly enhancing reliability against thermal cycling fatigue. For industrial drives requiring 1200V switching with a 1600V front-end, the SKiiP 28AN16V2 provides a compact, solder-free solution.
Top Specs: 1200V (IGBT) / 1600V (Rectifier) | 35A - 40A Class | MiniSKiiP 2 Housing.
Key Benefits: Enhanced power cycling via SPR technology; Reduced assembly time with single-screw mounting.
What is the primary benefit of its solderless assembly? It eliminates solder fatigue, a common failure mode in traditional modules, thereby extending the operational lifespan in variable load conditions.
Key Parameter Overview
Decoding the Specs for Enhanced Thermal Reliability
The engineering value of the SKiiP 28AN16V2 lies in its balanced electrical and thermal characteristics. The 1600V rating of the input rectifier section ensures robust performance against line voltage transients in 400V–480V AC networks, while the 1200V Trench IGBTs in the inverter section offer low VCE(sat) and optimized switching losses. Below are the definitive technical specifications sourced from the manufacturer's technical documentation:
| Feature / Specification | Technical Value |
|---|---|
| Manufacturer | Semikron Danfoss |
| Topology | CIB (Converter Inverter Brake) |
| IGBT Voltage (Vces) | 1200V |
| Rectifier Voltage (Vrrm) | 1600V |
| Package Style | MiniSKiiP 2 (Solderless) |
| Integrated Sensor | Temperature Sensing NTC |
Download the SKiiP 28AN16V2 datasheet for detailed specifications and performance curves.
Application Scenarios & Value
Achieving System-Level Benefits in High-Frequency Power Conversion
In the realm of Variable Frequency Drives (VFD) and Servo Drive systems, the mechanical arrangement of the power stage is as critical as the electrical switching efficiency. Engineers often face the challenge of managing parasitic inductance while maintaining a compact footprint. The SKiiP 28AN16V2 addresses this by utilizing a low-inductance internal layout within the MiniSKiiP housing. For example, in an industrial conveyor system subject to frequent start-stop cycles, the SPR technology ensures that the thermal expansion coefficient mismatch between the substrate and the PCB does not lead to cracked solder joints, a major contributor to field failures.
This module is specifically engineered for systems following the IEC 61800-3 standard for adjustable speed electrical power drive systems. The inclusion of an integrated NTC thermistor allows the control logic to monitor the junction temperature in real-time, enabling proactive thermal management. If your design requires a higher current handling capacity within a similar architecture, the SKiiP24NAB12T4V3 offers an alternative current profile while maintaining 1200V capabilities.
For more insights into the thermal mechanics of these units, refer to our guide on why Rth matters in IGBT thermal performance.
Technical Deep Dive
A Closer Look at Pressure-Contact Design for Long-Term Reliability
The SKiiP 28AN16V2 deviates from the traditional "baseplate + solder" architecture. Think of traditional soldering as gluing components together; eventually, the glue can crack under the heat of repeated heavy use. In contrast, the Semikron SKiiP® Technology acts like a high-tension spring system. By using pressure contact pins, the electrical connection is maintained by mechanical force, which "breathes" during temperature fluctuations without degrading.
This "pressure-only" connection reduces the overall Thermal Resistance (Rth) by eliminating layers of solder and large copper baseplates. This physical path to high power density is crucial for Solar Inverter and UPS applications where space is at a premium. Furthermore, the Trench IGBT technology utilized in this module significantly lowers the Switching Loss, allowing for higher carrier frequencies without exceeding the thermal limits of the MiniSKiiP 2 package. You can learn more about this switching principle in our analysis of voltage-controlled switching.
Frequently Asked Questions
How does the Rth(j-c) of the SKiiP 28AN16V2 compare to modules with a copper baseplate?
Because the SKiiP 28AN16V2 uses thin ceramic substrates and direct pressure contact to the heatsink, it eliminates the thermal interface layer typically found between the substrate and the baseplate. This allows for a more direct thermal path, often resulting in lower case-to-heatsink resistance, though the junction-to-case values are specifically optimized for the absence of a thermal spreader.
What are the design considerations for PCB layout when using solderless SPR technology?
The PCB must be designed with high-quality gold or silver-plated pads to ensure a low-resistance contact with the SKiiP 28AN16V2 pressure pins. Additionally, the PCB must be rigid enough to withstand the pressure of the single-center screw mounting without significant bowing, ensuring uniform contact pressure across all power and signal pins.
Can the SKiiP 28AN16V2 be used in 690V line applications?
No. While the rectifier is rated for 1600V, the 1200V IGBT Module section is optimized for 400V–480V AC line voltages. For 690V applications, a 1700V rated module is generally required to maintain an adequate safety margin for the DC bus voltage. To understand more about selecting the right voltage class, visit our guide to high-frequency IGBT selection.
For engineering teams evaluating the transition from discrete components to integrated modules, the SKiiP 28AN16V2 provides a proven framework for reducing system complexity. Its solder-free assembly not only simplifies production but also offers a strategic advantage in mission-critical industrial environments where downtime is not an option.
